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1. 发明授权

US06283701B1 Pneumatically actuated flexure gripper for wafer handling robots 有权
标题翻译：用于晶圆处理机器人的气动弯曲夹具
公开(公告)号：US06283701B1
公开(公告)日：2001-09-04
申请号：US09283995
申请日：1999-04-01
申请人： Satish Sundar , Ned G. Matthews
发明人： Satish Sundar , Ned G. Matthews
IPC分类号： B25J1502
CPC分类号： H01L21/68707 , B25J15/0206
摘要： The present invention generally provides a robot that can transfer workpieces, such as silicon wafers, at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In a particular embodiment, a clamp for securing silicon wafers uses a flexure assembly to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that the wafers are normally clamped near full extension of the workpiece handling member to deliver or pick up a wafer. A particular embodiment uses a pneumatic cylinder to actuate the flexure assembly so that the flexure assembly moves outwardly and rearwardly away from the wafer when actuated at or near full extension of the workpiece handling member.
摘要翻译：本发明通常提供一种能够以增加的速度和加速度和减速度传送诸如硅晶片的工件的机器人。更具体地，本发明提供了一种与机器人臂相关联的机械手，用于将工件机械地夹持到附接到臂的工件处理构件。晶片夹具选择性地施加足够的力来保持工件，并且在处理构件的快速旋转和线性移动期间防止滑动和损坏工件。在特定实施例中，用于固定硅晶片的夹具使用挠曲组件来以最小的颗粒产生和晶片损坏来定位和保持晶片。夹具被设计成使得晶片通常被夹持在工件处理构件的完全延伸附近以递送或拾取晶片。特定实施例使用气动缸来致动弯曲组件，使得挠曲组件在工件处理构件的全部延伸处或在其附近被致动时向外和向后移动远离晶片。

2. 发明授权

US06685422B2 Pneumatically actuated flexure gripper for wafer handling robots 有权
标题翻译：用于晶圆处理机器人的气动弯曲夹具
公开(公告)号：US06685422B2
公开(公告)日：2004-02-03
申请号：US10032663
申请日：2001-10-23
申请人： Satish Sundar , Ned G. Matthews
发明人： Satish Sundar , Ned G. Matthews
IPC分类号： B25J1502
CPC分类号： H01L21/68707 , B25J15/0206
摘要： The present invention generally provides a robot that can transfer workpieces, such as silicon wafers, at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In a particular embodiment, a clamp for securing silicon wafers uses a flexure assembly to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that the wafers are normally clamped near full extension of the workpiece handling member to deliver or pick up a wafer. A particular embodiment uses a pneumatic cylinder to actuate the flexure assembly so that the flexure assembly moves outwardly and rearwardly away from the wafer when actuated at or near full extension of the workpiece handling member.
摘要翻译：本发明通常提供一种能够以增加的速度和加速度和减速度传送诸如硅晶片的工件的机器人。更具体地，本发明提供了一种与机器人臂相关联的机械手，用于将工件机械地夹持到附接到臂的工件处理构件。晶片夹具选择性地施加足够的力来保持工件，并且在处理构件的快速旋转和线性移动期间防止滑动和损坏工件。在特定实施例中，用于固定硅晶片的夹具使用挠曲组件来以最小的颗粒产生和晶片损坏来定位和保持晶片。夹具被设计成使得晶片通常被夹持在工件处理构件的完全延伸附近以递送或拾取晶片。特定实施例使用气动缸来致动弯曲组件，使得挠曲组件在工件处理构件的全部延伸处或在其附近被致动时向外和向后移动远离晶片。

3. 发明申请

US20120271590A1 METHOD AND APPARATUS FOR ROBOT CALIBRATIONS WITH A CALIBRATING DEVICE 有权
标题翻译：用于校准装置的机器人校准的方法和装置
公开(公告)号：US20120271590A1
公开(公告)日：2012-10-25
申请号：US13523751
申请日：2012-06-14
申请人： Vijay Sakhare , Sekar Krishnasamy , Mordechai Leska , Donald Foldenauer , Rinat Shimshi , Marvin L. Freeman , Jeffery Hudgens , Satish Sundar
发明人： Vijay Sakhare , Sekar Krishnasamy , Mordechai Leska , Donald Foldenauer , Rinat Shimshi , Marvin L. Freeman , Jeffery Hudgens , Satish Sundar
IPC分类号： G06F15/00
CPC分类号： H01L21/681 , B25J9/1692 , G01B11/03 , G01B21/042 , G05B2219/37278 , G05B2219/37608 , G05B2219/39047 , G05B2219/39056 , H01L21/67742 , H01L21/67748
摘要： Described herein is a method and apparatus for performing calibrations on robotic components. In one embodiment, a method for performing robotic calibrations includes moving the calibrating device across a target (e.g., a wafer chuck). Next, the method includes measuring distances between light spots from the sensors and a perimeter of the target using the sensors located on the calibrating device. Next, the method includes determining a displacement of the calibrating device relative to a center of the target. Then, the method includes determining a rotation angle of the calibrating device relative to a system of coordinates of the target. Next, the method includes calibrating a robot position of the robot based on the displacement and rotation angle of the calibrating device with respect to the target.
摘要翻译：这里描述了一种用于对机器人部件执行校准的方法和装置。在一个实施例中，用于执行机器人校准的方法包括使校准装置跨越目标（例如，晶片卡盘）移动。接下来，该方法包括使用位于校准装置上的传感器来测量来自传感器的光点和目标周边之间的距离。接下来，该方法包括确定校准装置相对于目标的中心的位移。然后，该方法包括确定校准装置相对于目标系的坐标系的旋转角度。接下来，该方法包括基于校准装置相对于目标的位移和旋转角度来校准机器人的机器人位置。

4. 发明申请

US20060245856A1 SUBSTRATE EDGE GRIP APPARATUS 审中-公开
标题翻译：基板边缘装置
公开(公告)号：US20060245856A1
公开(公告)日：2006-11-02
申请号：US11423970
申请日：2006-06-14
申请人： Satish Sundar , Sanjeev Baluja
发明人： Satish Sundar , Sanjeev Baluja
IPC分类号： H01L21/677
CPC分类号： H01L21/68707 , Y10S414/141
摘要： In one embodiment, the invention is a substrate edge gripper assembly for positioning a semiconductor substrate upon a transfer robot. In one embodiment, a modular assembly comprises spring loaded jaws that are mounted on either side of a robot end effector. The jaws are adapted to be actuated by a feature remote from the robot end effector to release the substrate for delivery.
摘要翻译：在一个实施例中，本发明是用于将半导体衬底定位在传送机器人上的衬底边缘夹持器组件。在一个实施例中，模块化组件包括安装在机器人端部执行器的任一侧上的弹簧加载的夹爪。钳口适于由远离机器人末端执行器的特征致动以释放用于输送的基底。

5. 发明申请

US20060224276A1 METHOD FOR MONITORING THE POSITION OF A SEMICONDUCTOR PROCESSING ROBOT 审中-公开
标题翻译：用于监测半导体加工机器人的位置的方法
公开(公告)号：US20060224276A1
公开(公告)日：2006-10-05
申请号：US11424377
申请日：2006-06-15
申请人： Pyongwon Yim , Satish Sundar , Vinay Shah , Mario Silvetti , Douglas Kitajima , Venkatesh Babu , Visweswaren Sivaramakrishnan , Indrajit Lahiri , Surinder Bedi
发明人： Pyongwon Yim , Satish Sundar , Vinay Shah , Mario Silvetti , Douglas Kitajima , Venkatesh Babu , Visweswaren Sivaramakrishnan , Indrajit Lahiri , Surinder Bedi
IPC分类号： G06F19/00 , H01L21/306 , C23C16/00
CPC分类号： H01L21/67259 , H01L21/67766 , H01L21/681
摘要： A robotic positioning system that cooperates with a sensing system to correct robot motion is provided. The sensing system is decoupled from the sensors used conventionally to control the robot's motion, thereby providing repeatable detection of the robot's true position. In one embodiment, the positioning system includes a robot, a controller, a motor sensor and a decoupled sensor. The robot has at least one motor for manipulating a linkage controlling the displacement of a substrate support coupled thereto. The motor sensor is provides the controller with motor actuation information utilized to move the substrate support. The decoupled sensor provides information indicative of the true position the substrate support that may be utilized to correct the robot's motion.
摘要翻译：提供了与传感系统配合以校正机器人运动的机器人定位系统。感测系统与常规用于控制机器人运动的传感器解耦，从而提供机器人真实位置的可重复检测。在一个实施例中，定位系统包括机器人，控制器，马达传感器和去耦传感器。机器人具有至少一个用于操纵联动装置的电动机，控制联接到其上的衬底支架的位移。马达传感器为控制器提供用于移动基板支架的马达驱动信息。解耦传感器提供指示可用于校正机器人运动的基板支撑件的真实位置的信息。

6. 发明授权

US06856863B1 Method and apparatus for automatic calibration of robots 有权
标题翻译：机器人自动校准的方法和装置
公开(公告)号：US06856863B1
公开(公告)日：2005-02-15
申请号：US09626362
申请日：2000-07-27
申请人： Satish Sundar
发明人： Satish Sundar
IPC分类号： B25J9/10 , B25J9/00 , B25J9/16 , B25J9/22 , B65G49/07 , G05B19/401 , G05B19/404 , H01L21/00 , H01L21/677 , G05B19/18
CPC分类号： H01L21/67259 , B25J9/1692 , G05B19/4015 , G05B2219/39024 , G05B2219/45031
摘要： An automatic calibration method and apparatus for robots, particularly robots used in substrate processing systems. The method for calibrating a robot in a processing chamber comprises: determining a useable free-space for the robot in a processing system; determining a distance between a position of a robot end effector and a target position in the useable free-space; and generating a path within the useable space from the position of the robot end effector to the target position using incremental displacements of the robot end effector that minimize the distance between the robot end effector and the target position. The apparatus for calibrating a robot in a processing system comprises: a sensor disposed at a location to be taught; a receiver disposed on a robot end effector; and a microprocessor connected to receive signals from the sensor and the receiver to determine a distance between the sensor and the receiver, wherein the microprocessor generates a path using incremental movements that minimizes the distance between the sensor and the receiver.
摘要翻译：用于机器人的自动校准方法和装置，特别是用于衬底处理系统中的机器人。用于在处理室中校准机器人的方法包括：在处理系统中确定机器人的可用空闲空间; 确定机器人末端执行器的位置与可用空间中的目标位置之间的距离; 以及使用最小化机器人端部执行器与目标位置之间的距离的机器人端部执行器的增量位移，在从机器人端部执行器的位置到目标位置的可用空间内生成路径。用于在处理系统中校准机器人的装置包括：设置在要教导的位置的传感器; 设置在机器人端部执行器上的接收器; 以及微处理器，其连接以从传感器和接收器接收信号以确定传感器和接收器之间的距离，其中微处理器使用使传感器和接收器之间的距离最小化的增量移动来产生路径。

7. 发明授权

US06224312B1 Optimal trajectory robot motion 失效
标题翻译：最佳轨迹机器人运动
公开(公告)号：US06224312B1
公开(公告)日：2001-05-01
申请号：US08749614
申请日：1996-11-18
申请人： Satish Sundar
发明人： Satish Sundar
IPC分类号： B65G4907
CPC分类号： H01L21/67167 , H01L21/6719 , H01L21/67196 , H01L21/67201 , H01L21/67248 , H01L21/67276 , H01L21/67742 , Y10S414/139
摘要： An apparatus for processing wafers generally comprising a transfer chamber, a loadlock chamber mounted on the transfer chamber, one or more processing chambers mounted on the transfer chamber, a wafer handling member disposed in the transfer chamber, and a system controller programmed to move wafers through the transfer chamber following time optimal paths.
摘要翻译：一种用于处理晶片的设备，其通常包括传送室，安装在传送室上的负载锁定室，安装在传送室上的一个或多个处理室，设置在传送室中的晶片处理部件，以及被编程为将晶片移动通过的系统控制器传输室跟随时间最优路径。

8. 发明授权

US06198976B1 On the fly center-finding during substrate handling in a processing system 失效
标题翻译：在处理系统中的基板处理期间的飞行中心查找
公开(公告)号：US06198976B1
公开(公告)日：2001-03-06
申请号：US09034808
申请日：1998-03-04
申请人： Satish Sundar , Peter F. Ebbing
发明人： Satish Sundar , Peter F. Ebbing
IPC分类号： G05B1918
CPC分类号： H01L21/681 , G05B2219/36405 , G05B2219/37283 , G05B2219/37608 , G05B2219/45031 , G05B2219/49299 , G05B2219/50151
摘要： A substrate center-finding method and apparatus, for determining the center of a substrate being passed through a substrate handling chamber of a substrate processing system, includes any number of sensors arranged in any configuration and permits the substrate to pass through any trajectory that triggers the sensors. The locations of the sensors are calibrated by homing in on the sensors using a point, the reference point, near the tip of an arm assembly on a substrate handler. The substrate handler has an encoder for sensing the pivot angles of links in the arm assembly, whereby the coordinates of the reference point can be calculated from the angles and lengths of the links. When the substrate triggers a sensor, the location of the reference point is again calculated, and the coordinates of the trigger point on the edge of the substrate is determined relative to the reference point. A suitable number of trigger points on the edge of a circular substrate will define a circle, so the center of the circle can be calculated, and the location of the substrate can be adjusted to account for any offset from the reference point.
摘要翻译：用于确定通过衬底处理系统的衬底处理室的衬底的中心的衬底中心测定方法和装置包括以任何构造布置的任何数量的传感器，并允许衬底通过任何触发器件的轨迹传感器。传感器的位置通过使用在基板处理器上的臂组件的尖端附近的点（参考点）归位在传感器上来校准。衬底处理器具有用于感测臂组件中的链节的枢转角度的编码器，由此可以根据链节的角度和长度来计算参考点的坐标。当基板触发传感器时，再次计算参考点的位置，并且相对于参考点确定基板边缘上的触发点的坐标。在圆形基板的边缘上的合适数量的触发点将限定圆形，因此可以计算圆的中心，并且可以调整基板的位置以考虑到与参考点的任何偏移。

9. 发明申请

US20100296903A1 END EFFECTOR FOR HANDLING SUBSTRATES 审中-公开
标题翻译：用于处理基材的终止效应
公开(公告)号：US20100296903A1
公开(公告)日：2010-11-25
申请号：US12769486
申请日：2010-04-28
申请人： VINAY K. SHAH , Navdeep Gupta , Satish Sundar , Andrea Baccini , Christopher Burkhart , Rohit Dey , Christian Zorzi
发明人： VINAY K. SHAH , Navdeep Gupta , Satish Sundar , Andrea Baccini , Christopher Burkhart , Rohit Dey , Christian Zorzi
IPC分类号： B65G47/91 , B25J15/06 , B25J11/00
CPC分类号： H01L21/6838
摘要： Embodiments of the present invention provide an end effector for a substrate handling robot. In one embodiment, the end effector comprises one or more Bernoulli chucks surrounded by a plurality of suction cup devices. In one embodiment, the suction cup devices are configured in the form of a bellows to provide both cushioning and lateral stability to the substrate. In one embodiment, the suction cup devices further include an air pressure device to provide light positive pressure to the substrate during release. Embodiments of the end effector described herein provide a small vacuum pressure over a large area of ultra-thin substrates to minimize damage during handling.
摘要翻译：本发明的实施例提供了一种用于基板处理机器人的端部执行器。在一个实施例中，末端执行器包括由多个吸盘装置包围的一个或多个伯努利卡盘。在一个实施例中，吸盘装置构造为波纹管的形式，以向衬底提供缓冲和横向稳定性。在一个实施例中，吸盘装置还包括空气压力装置，以在释放期间向衬底提供轻的正压力。本文所述的末端执行器的实施例在大面积超薄基板上提供小的真空压力，以最小化处理期间的损坏。

10. 发明授权

US07527694B2 Substrate gripping apparatus 失效
标题翻译：基板夹持装置
公开(公告)号：US07527694B2
公开(公告)日：2009-05-05
申请号：US11423966
申请日：2006-06-14
申请人： Satish Sundar
发明人： Satish Sundar
IPC分类号： C23C16/00 , B05C13/00 , B05C13/02 , B05C21/00 , C23F1/00 , H01L21/306
CPC分类号： C23C16/4585 , H01L21/68 , H01L21/68728
摘要： In one embodiment, a substrate centering apparatus for centering a substrate on a substrate support is provided. In one embodiment, the invention comprises an apparatus that is mounted to an underside of a substrate support and includes a lever that projects upward through a support surface of the substrate support. The lever may be biased toward a center of the substrate support to contact an edge of a substrate. A mechanism is coupled to the lever and moves the lever radially outward to release the substrate. In one embodiment, the mechanism is actuated as the substrate support moves downward to a position that facilitates substrate handoff.
摘要翻译：在一个实施例中，提供了一种用于将衬底定心在衬底支撑件上的衬底定心装置。在一个实施例中，本发明包括安装到基板支撑件的下侧的装置，并且包括通过基板支撑件的支撑表面向上突出的杠杆。杠杆可以朝着基板支撑件的中心偏置以接触基板的边缘。机构联接到杠杆并且将杆径向向外移动以释放基板。在一个实施例中，当衬底支撑件向下移动到便于衬底切换的位置时，机构被致动。

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