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    • 9. 发明授权
    • Multi-bit data converter using data weight averaging
    • 使用数据权重平均的多位数据转换器
    • US07808409B2
    • 2010-10-05
    • US12328550
    • 2008-12-04
    • Sang-Ho Kim
    • Sang-Ho Kim
    • H03M1/00
    • H03M1/0665H03M1/747H03M3/502
    • A method for converting data includes matching dynamic elements by repeatedly selecting a portion of unit elements among N unit elements according to data and a circulation direction. An existence of a tone generation possibility is determined by comparing a present pointer position with a previous pointer position and by comparing present data with previous data. At least one of the present pointer position and the circulation direction is changed based on the existence of the tone generation possibility. The present pointer position and the present data are stored or the changed pointer position and the present data are stored. Unit elements are sequentially selected by the present data from the stored pointer position in the circulation direction or the changed circulation direction. The present pointer position is moved by the present data in the circulation direction or the changed circulation direction.
    • 用于转换数据的方法包括通过根据数据和循环方向重复地选择N个单元中的单位元素的一部分来匹配动态元素。 通过将当前指针位置与先前的指针位置进行比较并通过将当前数据与先前数据进行比较来确定音调生成可能性的存在。 本指针位置和循环方向中的至少一个基于音调生成可能性的存在而改变。 存储当前指针位置和当前数据,或存储改变的指针位置和当前数据。 通过来自循环方向或改变的循环方向上存储的指示器位置的当前数据顺序地选择单位元素。 当前数据在循环方向或改变的循环方向上移动当前指针位置。
    • 10. 发明申请
    • METHODS AND APPARATUS FOR SEMICONDUCTOR ETCHING INCLUDING AN ELECTRO STATIC CHUCK
    • 用于半导体蚀刻的方法和装置,包括电子静态卡盘
    • US20080194113A1
    • 2008-08-14
    • US12106484
    • 2008-04-21
    • Jin-Man KimYun-Sik YangYoung-Min MinSang-Ho Kim
    • Jin-Man KimYun-Sik YangYoung-Min MinSang-Ho Kim
    • H01L21/3065
    • H01L21/6831H01J37/32642H01L21/68735
    • There is provided a semiconductor etching apparatus which removes particles remaining on the upper surface of an electro static chuck (ESC) during an etching process, thereby preventing a chucking force from decreasing and minimizing a leak of helium. To prevent a failure of the etching process due to a wafer chucking failure, by preventing polymers from falling down on the upper part of the ESC when a wafer is dechucked or transferred, the semiconductor etching apparatus comprises: an ESC selectively holding a wafer to be entered and positioned inside a chamber, and including a lower electrode part to which RF power is applied; parts positioned at a stepped portion of the ESC and respectively surrounding a side of the ESC; and a gas flow blocking part blocking a gas flow in a vacuum path formed between the ESC and the parts.
    • 提供了一种半导体蚀刻装置,其在蚀刻过程中除去静电卡盘(ESC)的上表面上残留的颗粒,从而防止夹紧力降低并使氦泄漏最小化。 为了防止由于晶片夹紧故障引起的蚀刻工艺的故障,通过在晶片脱扣或转印时防止聚合物落下于ESC的上部,半导体蚀刻装置包括:选择性地保持晶片的ESC 进入并定位在室内,并且包括施加RF功率的下电极部分; 位于ESC的阶梯部分并分别围绕ESC的一侧的部件; 以及阻塞在ESC和部件之间形成的真空路径中的气流的气流阻塞部。