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1. 发明授权

US06309591B1 Apparatus for bonding a particle material to near theoretical density 有权
标题翻译：用于将颗粒材料粘合到接近理论密度的装置
公开(公告)号：US06309591B1
公开(公告)日：2001-10-30
申请号：US09412518
申请日：1999-10-05
申请人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
发明人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
IPC分类号： B22F314
CPC分类号： B22F3/093 , B22F3/14 , B22F2999/00 , C04B35/64 , Y10S29/031 , Y10S977/775 , Y10S977/776 , B22F3/105
摘要： An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The apparatus may be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The apparatus may further be used to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.
摘要翻译：用于将颗粒材料粘合到接近理论密度的装置包括用于支撑颗粒材料的腔室，冲头和模具组件，用于施加剪切和/或轴向压力的柱塞以及用于施加电流的电源。在第一阶段中，将约1至20,000安培的脉冲电流施加到颗粒材料预定时间段，并且基本同时施加约5-50MPa的剪切力。在第二阶段中，将大约小于1至2,000MPa的轴向压力施加到颗粒材料预定时间段，并且基本同时施加约1至20,000安培的稳定电流。被申请;被应用。该装置可用于将金属，陶瓷，金属间和复合材料直接从前体或元素颗粒材料粘合到近净形状，而不需要合成材料。该方法还可以用于进行反应性材料的燃烧合成，随后固化或接合到近净形状的制品或部件。该装置还可用于修复损坏或磨损的基底或部件，将颗粒涂覆到基底上，并生长颗粒材料的单晶。

2. 发明授权

US06270718B1 Method of bonding a particle material to near theoretical density 有权
公开(公告)号：US06270718B1
公开(公告)日：2001-08-07
申请号：US09412520
申请日：1999-10-05
申请人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
发明人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
IPC分类号： B22F700
CPC分类号： C04B35/58092 , B01J3/06 , B01J3/062 , B01J19/087 , B01J2203/062 , B01J2203/0655 , B01J2203/0685 , B22F3/105 , B22F2999/00 , B30B15/34 , B32B18/00 , C04B35/52 , C04B35/571 , C04B35/58071 , C04B35/581 , C04B35/645 , C04B35/6455 , C04B37/001 , C04B2235/6567 , C04B2237/343 , C04B2237/365 , Y10S29/031 , Y10S977/777 , B22F3/14 , B22F3/093
摘要： A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The method may further be applied to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.

3. 发明授权

US6001304A Method of bonding a particle material to near theoretical density 有权
标题翻译：将颗粒材料粘合到接近理论密度的方法
公开(公告)号：US6001304A
公开(公告)日：1999-12-14
申请号：US223964
申请日：1998-12-31
申请人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
发明人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
IPC分类号： B01J3/06 , B01J19/08 , B22F3/105 , C04B35/52 , C04B35/58 , C04B35/581 , C04B35/645 , C04B37/00 , B22F3/12
CPC分类号： C04B35/58092 , B01J19/087 , B01J3/06 , B01J3/062 , B22F3/105 , B30B15/34 , B32B18/00 , C04B35/52 , C04B35/571 , C04B35/58071 , C04B35/581 , C04B35/645 , C04B35/6455 , C04B37/001 , B01J2203/062 , B01J2203/0655 , B01J2203/0685 , B22F2999/00 , C04B2235/6567 , C04B2237/343 , C04B2237/365 , Y10S29/031 , Y10S977/777
摘要： A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps, is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The method may further be applied to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.
摘要翻译：将颗粒材料粘合到接近理论密度的方法包括将颗粒材料放置在模具中。在第一阶段中，将约1至20,000安培的脉冲电流施加到颗粒材料预定时间段，并且基本同时施加约5-50MPa的剪切力。在第二阶段中，将大约小于1至2,000MPa的轴向压力施加到颗粒材料预定时间段，并且基本同时施加约1至20,000安培的稳定电流。该方法可用于将金属，陶瓷，金属间化合物和复合材料直接从前体或元素颗粒材料粘合到近净形状，而不需要合成材料。该方法还可以用于进行反应性材料的燃烧合成，随后固化或接合到近净形状的制品或部件。该方法可以进一步应用于修复损坏或磨损的基底或部件，将颗粒涂覆到基底上，并生长颗粒材料的单晶。

4. 发明授权

US06187087B1 Method of bonding a particle material to near theoretical density 有权
公开(公告)号：US06187087B1
公开(公告)日：2001-02-13
申请号：US09412521
申请日：1999-10-05
申请人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
发明人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
IPC分类号： C30B102
CPC分类号： C04B35/58071 , B01J3/06 , B01J19/087 , B01J2203/0685 , B22F3/093 , B22F3/105 , B22F2999/00 , B32B18/00 , C04B35/52 , C04B35/528 , C04B35/571 , C04B35/58092 , C04B35/581 , C04B35/645 , C04B37/021 , C04B2235/6567 , C04B2237/343 , C04B2237/365 , C04B2237/366 , C04B2237/403 , C04B2237/405 , C04B2237/567
摘要： A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The method may further be applied to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.

5. 发明授权

US06183690B2 Method of bonding a particle material to near theoretical density 有权
标题翻译：将颗粒材料粘合到接近理论密度的方法
公开(公告)号：US06183690B2
公开(公告)日：2001-02-06
申请号：US09412519
申请日：1999-10-05
申请人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
发明人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
IPC分类号： B22F312
CPC分类号： C04B35/58092 , B01J3/06 , B01J3/062 , B01J19/087 , B01J2203/062 , B01J2203/0655 , B01J2203/0685 , B22F3/105 , B22F2999/00 , B30B15/34 , B32B18/00 , C04B35/52 , C04B35/571 , C04B35/58071 , C04B35/581 , C04B35/645 , C04B35/6455 , C04B37/001 , C04B2235/6567 , C04B2237/343 , C04B2237/365 , Y10S29/031 , Y10S977/777 , B22F3/14 , B22F3/093
摘要： A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The method may further be applied to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.
摘要翻译：将颗粒材料粘合到接近理论密度的方法包括将颗粒材料放置在模具中。在第一阶段中，将约1至20,000安培的脉冲电流施加到颗粒材料预定时间段，并且基本同时施加约5-50MPa的剪切力。在第二阶段中，将大约小于1至2,000MPa的轴向压力施加到颗粒材料预定时间段，并且基本同时施加约1至20,000安培的稳定电流。被申请;被应用。该方法可用于将金属，陶瓷，金属间化合物和复合材料直接从前体或元素颗粒材料粘合到近净形状，而不需要合成材料。该方法还可以用于进行反应性材料的燃烧合成，随后固化或接合到近净形状的制品或部件。该方法可以进一步应用于修复损坏或磨损的基底或部件，将颗粒涂覆到基底上，并生长颗粒材料的单晶。

6. 发明授权

US5989487A Apparatus for bonding a particle material to near theoretical density 有权
标题翻译：用于将颗粒材料粘合到接近理论密度的装置
公开(公告)号：US5989487A
公开(公告)日：1999-11-23
申请号：US274878
申请日：1999-03-23
申请人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
发明人： Sang H. Yoo , Krupashankara M. Sethuram , Tirumalai S. Sudarshan
IPC分类号： B22F3/00 , B22F3/035 , B22F3/093 , B22F3/14 , C04B35/64 , B22F3/12
CPC分类号： B22F3/093 , B22F3/14 , C04B35/64 , B22F2999/00 , Y10S29/031 , Y10S977/775 , Y10S977/776
摘要： An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The apparatus may be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The apparatus may further be used to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.
摘要翻译：用于将颗粒材料粘合到接近理论密度的装置包括用于支撑颗粒材料的腔室，冲头和模具组件，用于施加剪切和/或轴向压力的柱塞以及用于施加电流的电源。在第一阶段中，将约1至20,000安培的脉冲电流施加到颗粒材料预定时间段，并且基本同时施加约5-50MPa的剪切力。在第二阶段中，将大约小于1至2,000MPa的轴向压力施加到颗粒材料预定时间段，并且基本同时施加约1至20,000安培的稳定电流。被申请;被应用。该装置可用于将金属，陶瓷，金属间和复合材料直接从前体或元素颗粒材料粘合到近净形状，而不需要合成材料。该方法还可以用于进行反应性材料的燃烧合成，随后固化或接合到近净形状的制品或部件。该装置还可用于修复损坏或磨损的基底或部件，将颗粒涂覆到基底上，并生长颗粒材料的单晶。

7. 发明授权

US07448389B1 Method and kit for inducing hypoxia in tumors through the use of a magnetic fluid 有权
标题翻译：通过使用磁性液体在肿瘤中诱导缺氧的方法和试剂盒
公开(公告)号：US07448389B1
公开(公告)日：2008-11-11
申请号：US10681899
申请日：2003-10-10
申请人： Sanjay Kotha , Tirumalai S. Sudarshan
发明人： Sanjay Kotha , Tirumalai S. Sudarshan
IPC分类号： A61B19/00
CPC分类号： A61K33/24 , A61K9/0009 , A61K9/0019 , A61K9/5094 , A61K33/00 , A61K33/26 , A61K33/38 , A61K33/44 , A61K41/00 , A61K45/06
摘要： A method and kit for inducing hypoxia in tumors includes impeding oxygen supply to non-hypoxic cells in a subject in need thereof by using a magnetic fluid.
摘要翻译：用于在肿瘤中诱导缺氧的方法和试剂盒包括通过使用磁性液体来阻止需要的对象中的非缺氧细胞的氧供应。

8. 发明授权

US07200956B1 Magnetic fluid cushioning device for a footwear or shoe 有权
标题翻译：用于鞋类或鞋子的磁性液体缓冲装置
公开(公告)号：US07200956B1
公开(公告)日：2007-04-10
申请号：US10624519
申请日：2003-07-23
申请人： Sanjay Kotha , Tirumalai S. Sudarshan
发明人： Sanjay Kotha , Tirumalai S. Sudarshan
IPC分类号： A43B13/20
CPC分类号： A43B13/189 , A43B1/0054 , A43B3/0005 , A43B17/026
摘要： A cushioning device for a footwear or shoe includes a chamber with a magnetically responsive fluid therein for absorbing and/or dampening vibrations and/or shocks. A magnetic member, such as an electromagnet, is provided for applying a magnetic field to the magnetic fluid to thereby vary the viscosity thereof.
摘要翻译：用于鞋类或鞋子的缓冲装置包括其中具有用于吸收和/或抑制振动和/或冲击的磁响应流体的室。提供磁性构件，例如电磁体，用于向磁性流体施加磁场，从而改变其粘度。

9. 发明授权

US07007972B1 Method and airbag inflation apparatus employing magnetic fluid 有权
标题翻译：使用磁性液体的方法和气囊充气装置
公开(公告)号：US07007972B1
公开(公告)日：2006-03-07
申请号：US10383779
申请日：2003-03-10
申请人： Ramachandran Radhakrishnan , Sanjay Kotha , Tirumalai S. Sudarshan
发明人： Ramachandran Radhakrishnan , Sanjay Kotha , Tirumalai S. Sudarshan
IPC分类号： B60R21/26
CPC分类号： B60R21/26 , B60R2021/2636 , Y10S137/909 , Y10T137/2082
摘要： An airbag inflation apparatus includes a chamber for generating a gas to inflate an airbag. A valve, including a magnetic fluid and a source of magnetic field, preferably an electromagnet, is associated with the chamber for regulating the flow of the gas into the airbag. A sensor determines and feeds occupant information to the sensor.
摘要翻译：安全气囊充气装置包括用于产生气体以使气囊膨胀的室。包括磁性流体和磁场源（优选电磁体）的阀门与腔室相关联，用于调节进入气囊的气体流。传感器确定并将乘客信息提供给传感器。

10. 发明授权

US07670623B2 Hemostatic composition 有权
标题翻译：止血组成
公开(公告)号：US07670623B2
公开(公告)日：2010-03-02
申请号：US10157921
申请日：2002-05-31
申请人： Sanjay Kotha , Tirumalai S. Sudarshan
发明人： Sanjay Kotha , Tirumalai S. Sudarshan
IPC分类号： A61K38/00 , A61K9/14
CPC分类号： A61L24/02 , A61K9/501 , A61K9/5094 , A61K38/4833 , A61K38/4846 , A61L2400/04
摘要： A hemostatic composition includes a carrier medium including a predetermined amount of a particulate material. The particulate material is comprised of core particles with a coating. The core particles have an average particle size of about 5 nm to 10 μm, and the coating is one of gold, silica, silver, platinum, steel, cobalt, carbon, a polymer, or a combination thereof.
摘要翻译：止血组合物包括包含预定量的颗粒材料的载体介质。颗粒材料由具有涂层的核心颗粒组成。核心颗粒的平均粒度为约5nm至10μm，并且涂层是金，二氧化硅，银，铂，钢，钴，碳，聚合物或其组合中的一种。

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