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1. 发明授权

US09123732B2 Die warpage control for thin die assembly 有权
标题翻译：用于薄模组件的模翘曲控制
公开(公告)号：US09123732B2
公开(公告)日：2015-09-01
申请号：US13631612
申请日：2012-09-28
申请人： Sandeep B. Sane , Shankar Ganapathysubramanian , Jorge Sanchez , Leonel R. Arana , Eric J. Li , Nitin A. Deshpande , Jiraporn Seangatith , Poh Chieh Benny Poon
发明人： Sandeep B. Sane , Shankar Ganapathysubramanian , Jorge Sanchez , Leonel R. Arana , Eric J. Li , Nitin A. Deshpande , Jiraporn Seangatith , Poh Chieh Benny Poon
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00
CPC分类号： H01L24/32 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/89 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/3213 , H01L2224/32225 , H01L2224/32501 , H01L2224/32505 , H01L2224/73253 , H01L2224/81007 , H01L2224/81193 , H01L2224/81815 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/161 , H01L2924/16251 , H01L2924/3511 , H01L2924/00 , H01L2924/014
摘要： Die warpage is controlled for the assembly of thin dies. In one example, a device having a substrate on a back side and components in front side layers is formed. A backside layer is formed over the substrate, the layer resisting warpage of the device when the device is heated. The device is attached to a substrate by heating.
摘要翻译：控制模具翘曲，用于组装薄模具。在一个示例中，形成具有背面上的基板和在前侧层中的部件的装置。背衬层形成在衬底上，该层在加热器件时抵抗器件翘曲。该装置通过加热连接到基板。

2. 发明申请

US20140091470A1 DIE WARPAGE CONTROL FOR THIN DIE ASSEMBLY 有权
标题翻译：用于薄膜组件的DIE WARPAGE控制
公开(公告)号：US20140091470A1
公开(公告)日：2014-04-03
申请号：US13631612
申请日：2012-09-28
申请人： Sandeep B. Sane , Shandar Ganapathysubramanian , Jorge Sanchez , Leonel R. Arana , Eric J. Li , Nitin A. Deshpande , Jiraporn Seangatith , Poh Chieh Benny Poon
发明人： Sandeep B. Sane , Shandar Ganapathysubramanian , Jorge Sanchez , Leonel R. Arana , Eric J. Li , Nitin A. Deshpande , Jiraporn Seangatith , Poh Chieh Benny Poon
IPC分类号： H01L23/00
CPC分类号： H01L24/32 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/89 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/3213 , H01L2224/32225 , H01L2224/32501 , H01L2224/32505 , H01L2224/73253 , H01L2224/81007 , H01L2224/81193 , H01L2224/81815 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/161 , H01L2924/16251 , H01L2924/3511 , H01L2924/00 , H01L2924/014
摘要： Die warpage is controlled for the assembly of thin dies. In one example, a device having a substrate on a back side and components in front side layers is formed. A backside layer is formed over the substrate, the layer resisting warpage of the device when the device is heated. The device is attached to a substrate by heating.
摘要翻译：控制模具翘曲，用于组装薄模具。在一个示例中，形成具有背面上的基板和在前侧层中的部件的装置。背衬层形成在衬底上，该层在加热器件时抵抗器件翘曲。该装置通过加热连接到基板。

3. 发明授权

US08304065B2 Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same 有权
标题翻译：微电子器件的处理以及使用该微电子器件对微电子器件的损伤的方法
公开(公告)号：US08304065B2
公开(公告)日：2012-11-06
申请号：US12655282
申请日：2009-12-28
申请人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
发明人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
IPC分类号： B32B7/02
CPC分类号： H01L21/6836 , H01L23/3164 , H01L24/81 , H01L2221/68327 , H01L2221/68377 , H01L2224/131 , H01L2224/16 , H01L2224/81007 , H01L2224/81815 , H01L2924/0001 , H01L2924/10253 , Y10T428/24124 , Y10T428/2419 , Y10T428/24942 , Y10T428/2495 , Y10T428/25 , Y10T428/2839 , Y10T428/2852 , Y10T428/31703 , H01L2924/014 , H01L2224/13099 , H01L2924/00
摘要： A treatment for a microelectronic device comprises a dicing tape (110) and a polymer composite film (120) having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50° Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.
摘要翻译：微电子器件的处理包括切割带（110）和添加有颜料或其它着色剂的聚合物复合膜（120），并且在一些实施方案中，预固化玻璃化转变温度大于50℃。膜可以包括多层，一层是粘性的，另一层在给定温度下是非粘性的。

4. 发明申请

US20110159256A1 Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same 有权
标题翻译：微电子器件的处理以及使用该微电子器件对微电子器件的损伤的方法
公开(公告)号：US20110159256A1
公开(公告)日：2011-06-30
申请号：US12655282
申请日：2009-12-28
申请人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
发明人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
IPC分类号： H01L21/60 , C09J7/02 , B32B7/02 , H01L21/56
CPC分类号： H01L21/6836 , H01L23/3164 , H01L24/81 , H01L2221/68327 , H01L2221/68377 , H01L2224/131 , H01L2224/16 , H01L2224/81007 , H01L2224/81815 , H01L2924/0001 , H01L2924/10253 , Y10T428/24124 , Y10T428/2419 , Y10T428/24942 , Y10T428/2495 , Y10T428/25 , Y10T428/2839 , Y10T428/2852 , Y10T428/31703 , H01L2924/014 , H01L2224/13099 , H01L2924/00
摘要： A treatment for a microelectronic device comprises a dicing tape (110) and a polymer composite film (120) having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50° Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.
摘要翻译：微电子器件的处理包括切割带（110）和添加有颜料或其它着色剂的聚合物复合膜（120），并且在一些实施方案中，预固化玻璃化转变温度大于50℃。膜可以包括多层，一层是粘性的，另一层在给定温度下是非粘性的。

5. 发明授权

US08111013B2 Method and firmware for controlling voltage and current in a fluorescent lamp array 有权
标题翻译：用于控制荧光灯阵列中的电压和电流的方法和固件
公开(公告)号：US08111013B2
公开(公告)日：2012-02-07
申请号：US12043070
申请日：2008-03-05
申请人： Jorge Sanchez
发明人： Jorge Sanchez
IPC分类号： H05B37/02
CPC分类号： H02M7/53873 , H05B41/2828 , H05B41/3927 , Y02B20/186
摘要： A method and firmware for controlling voltage and current in an electrical load includes steps of calculating a numerically quantized duty cycle of a pulse-width modulated, digital switch control signal by firmware in an inverter voltage microcontroller as a function of an inverter voltage and controlling the inverter voltage by adjusting the duty cycle of the digital switch control signal to generate a load current in the electrical load.
摘要翻译：用于控制电负载中的电压和电流的方法和固件包括以下步骤：根据逆变器电压微控制器中的固件计算脉冲宽度调制的数字开关控制信号的数字量化占空比，并且控制逆变器电压通过调节数字开关控制信号的占空比来产生负载电流在电气负载中。

6. 发明申请

US20090167621A1 Flat antenna 审中-公开
标题翻译：扁平天线
公开(公告)号：US20090167621A1
公开(公告)日：2009-07-02
申请号：US11659341
申请日：2004-08-03
申请人： Miguel Beruete , Mario Sorolla , Igor Campillo , Jorge Sanchez
发明人： Miguel Beruete , Mario Sorolla , Igor Campillo , Jorge Sanchez
IPC分类号： H01Q13/10
CPC分类号： H01Q13/10 , H01Q19/00
摘要： The present invention relates to antennas of a planar profile coupled to waveguides, and particularly to completely planar antennas, applicable in mobile telephony, radars and space communications, which base their operating on the transmission of electromagnetic waves, mainly in the range of microwaves and millimetric waves, through a thin opening of a height that is less than the wavelength, having corrugations around said opening such that maximized wave transmission as well as the collimation thereof in a defined direction towards leaky waves by means of a resonant coupling mechanism are obtained.
摘要翻译：本发明涉及耦合到波导的平面轮廓的天线，特别涉及可应用于移动电话，雷达和空间通信中的完全平面的天线，其基于它们在电磁波的传输上的操作，主要在微波和毫米波的范围内通过小于波长的高度的薄开口，在所述开口周围具有波纹，从而获得最大化的波传播以及通过谐振耦合机构沿着确定的朝向漏波的方向的准直。

7. 发明申请

US20060153256A1 Laser temperature performance compensation 审中-公开
标题翻译：激光温度性能补偿
公开(公告)号：US20060153256A1
公开(公告)日：2006-07-13
申请号：US10513105
申请日：2003-01-14
申请人： Jorge Sanchez
发明人： Jorge Sanchez
IPC分类号： H01S3/04
CPC分类号： H01S5/042 , H01S5/0427 , H01S5/0617 , H01S5/06812 , H01S5/0683
摘要： The invention presents a method that calibrates the laser optical power in a continuous manner without disrupting the flow of information in the optical communications link. The method utilizes knowledge of the measured value of the laser optical power and makes necessary adjustments to optimize the values of the Extinction Ratio, Bit Error Rate and to compensate for aging. The method utilizes knowledge of the temperature from a sensor and mathematical models, which contain parameters which are updated for a specific laser configuration.
摘要翻译：本发明提出了一种在不破坏光通信链路中的信息流的情况下以连续的方式校准激光光功率的方法。该方法利用了激光光功率的测量值的知识，并进行了必要的调整，以优化消光比，误码率值并补偿衰老。该方法利用来自传感器和数学模型的温度知识，其包含针对特定激光器配置更新的参数。

8. 发明授权

US6132649A Fabrication including sol-gel processing 失效
标题翻译：制作包括溶胶 - 凝胶加工
公开(公告)号：US6132649A
公开(公告)日：2000-10-17
申请号：US240904
申请日：1999-01-29
申请人： Michael J. Cauda , Jorge Sanchez , Jorge Luis Valdes
发明人： Michael J. Cauda , Jorge Sanchez , Jorge Luis Valdes
IPC分类号： C03B8/02 , C03B20/00 , C03B37/016 , C03C1/00 , B29D11/00
CPC分类号： C03C1/006
摘要： An aqueous dispersion of silica particles is mixed with a dialkyldialkoxysilane monomer, e.g., dimethyldiethoxysilane (DMDES), typically under basic conditions. Optionally, the monomer, or a portion thereof, is partially reacted prior to mixing, such that it is possible for a polydialkylsiloxane oligomer, e.g., polydimethylsiloxane (PDMS), to be added either with or instead of the monomer. The addition of the monomer (or oligomer) induces gelation of the silica. The contemplated mechanism is that the silanol groups on the growing polydialkylsiloxane chains are able to condense with silanol groups found on the silica particle surfaces, thereby anchoring the chains to the particles. These chains appear to have the ability to form bridges between particles and/or loops on individual particles. Such bridges appear to initiate formation of a silica particle network, and both the bridges and loops increase the silica particles' hydrophobicity. Both of these features contribute to gelation of the silica particles, substantially independent of the particles' surface charge.
摘要翻译：二氧化硅颗粒的水分散体通常在碱性条件下与二烷基二烷氧基硅烷单体例如二甲基二乙氧基硅烷（DMDES）混合。任选地，单体或其一部分在混合之前部分反应，使得聚二烷基硅氧烷低聚物例如聚二甲基硅氧烷（PDMS）可以用或代替单体加入。单体（或低聚物）的添加诱导二氧化硅的凝胶化。预期的机理是生长的聚二烷基硅氧烷链上的硅烷醇基能够与在二氧化硅颗粒表面上发现的硅烷醇基团缩合，从而将链锚定到颗粒上。这些链似乎具有在单个颗粒上的颗粒和/或环之间形成桥的能力。这样的桥似乎引起二氧化硅颗粒网络的形成，并且桥和环都增加二氧化硅颗粒的疏水性。这两个特征有助于二氧化硅颗粒的凝胶化，基本上与颗粒的表面电荷无关。

9. 发明申请

US20190313848A1 BARBECUE (BAR-B-QUE) GRILL AND SMOKER 审中-公开
公开(公告)号：US20190313848A1
公开(公告)日：2019-10-17
申请号：US15953403
申请日：2018-04-14
申请人： Jorge Sanchez
发明人： Jorge Sanchez
IPC分类号： A47J37/07 , A23B4/052
摘要： Provided is a grill apparatus having an elongated base assembly coupled to a firebox assembly. The base assembly includes a lid with a handle, where the lid is pivotally coupled to a base along the length of the base assembly. The base has a bottom, and a hole in a side portion that is adapted to accept an exhaust piping assembly, while the bottom of the base has a hole that substantially accommodate a fire box assembly. The firebox assembly is coupled to the base assembly and includes a firebox and at least one vent. A removable shield separates the firebox assembly from the base assembly. The shield is slightly larger than the hole in the base in at least one dimension, such that as the shield rests on the base above the hole in the base, a gap is left that allows heat and air to flow from the firebox into the base assembly.

10. 发明申请

US20150226637A1 Method and Optical Shield for Detecting Tampering 有权
标题翻译：用于检测篡改的方法和光学屏蔽
公开(公告)号：US20150226637A1
公开(公告)日：2015-08-13
申请号：US14178724
申请日：2014-02-12
申请人： Jorge Sanchez , Carol E. Fuller
发明人： Jorge Sanchez , Carol E. Fuller
IPC分类号： G01M11/00
CPC分类号： G01M11/30 , G01M11/088 , G01M11/31 , G08B13/186
摘要： A method includes conforming an arrangement of an optical fiber to an object to detect tampering with the object when the optical fiber arrangement is changed, measuring an optical signature of the optical fiber arrangement in a first measurement, measuring the optical signature of the optical fiber arrangement at a time after the first measurement in a second measurement, and comparing the first and second measurements to detect tampering with the object from a change in the optical fiber arrangement. In another embodiment, an optical shield includes an optical fiber arranged to detect tampering with an object resulting from a change in the optical fiber arrangement and an optical fiber carrier coupled to the optical fiber for conforming the optical fiber arrangement to the object.
摘要翻译：一种方法包括：当光纤布置改变时，使光纤的布置符合物体以检测对物体的篡改，在第一测量中测量光纤布置的光学特征，测量光纤布置的光学特征在第二测量中的第一次测量之后的时间，并且比较第一和第二测量值以从光纤配置的变化中检测对物体的篡改。在另一个实施例中，光学屏蔽包括光纤，其布置成检测由于光纤布置的变化而导致的物体的篡改，以及耦合到光纤的光纤载体，用于使光纤布置与物体一致。

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