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    • 4. 发明授权
    • In-situ support structure for line collapse robustness in memory arrays
    • 存储阵列线路崩溃鲁棒性的原位支持结构
    • US09543139B2
    • 2017-01-10
    • US14246656
    • 2014-04-07
    • SANDISK TECHNOLOGIES INC.
    • Akira MatsudairaDonovan Lee
    • H01L21/82H01L21/02H01L21/28H01L29/788H01L27/02H01L27/115
    • H01L21/02164H01L21/28273H01L27/0207H01L27/11519H01L27/11524H01L29/7883
    • Methods for preventing line collapse during the fabrication of NAND flash memory and other microelectronic devices that utilize closely spaced device structures with high aspect ratios are described. In some embodiments, one or more mechanical support structures may be used to provide lateral support between closely spaced device structures to prevent collapsing of the closely spaced device structures during an etching process (e.g., during a word line etch). In one example, during fabrication of a NAND flash memory, one or more mechanical support structures may be in place prior to performing a high aspect ratio word line etch or may be formed during the word line etch. In some cases, the one or more mechanical support structures may comprise portions of an inter-poly dielectric (IPD) layer that were in place prior to performing the word line etch.
    • 描述了在制造NAND闪速存储器和利用具有高纵横比的紧密间隔的器件结构的其它微电子器件时防止线塌陷的方法。 在一些实施例中,可以使用一个或多个机械支撑结构来在紧密间隔开的装置结构之间提供横向支撑,以防止在蚀刻过程(例如,在字线蚀刻期间)紧密间隔开的装置结构的折叠。 在一个示例中,在NAND快闪存储器的制造过程中,在执行高宽比字线蚀刻之前,一个或多个机械支撑结构可以就位,或者可以在字线蚀刻期间形成。 在一些情况下,一个或多个机械支撑结构可以包括在执行字线蚀刻之前就位的多晶硅间电介质(IPD)层的部分。
    • 9. 发明申请
    • IN-SITU SUPPORT STRUCTURE FOR LINE COLLAPSE ROBUSTNESS IN MEMORY ARRAYS
    • 存储器阵列中线性逼真的现场支持结构
    • US20150287733A1
    • 2015-10-08
    • US14246656
    • 2014-04-07
    • SANDISK TECHNOLOGIES INC.
    • Akira MatsudairaDonovan Lee
    • H01L27/115H01L21/02H01L21/311H01L21/3213H01L21/28H01L29/788
    • H01L21/02164H01L21/28273H01L27/0207H01L27/11519H01L27/11524H01L29/7883
    • Methods for preventing line collapse during the fabrication of NAND flash memory and other microelectronic devices that utilize closely spaced device structures with high aspect ratios are described. In some embodiments, one or more mechanical support structures may be used to provide lateral support between closely spaced device structures to prevent collapsing of the closely spaced device structures during an etching process (e.g., during a word line etch). In one example, during fabrication of a NAND flash memory, one or more mechanical support structures may be in place prior to performing a high aspect ratio word line etch or may be formed during the word line etch. In some cases, the one or more mechanical support structures may comprise portions of an inter-poly dielectric (IPD) layer that were in place prior to performing the word line etch.
    • 描述了在制造NAND闪速存储器和利用具有高纵横比的紧密间隔的器件结构的其它微电子器件时防止线塌陷的方法。 在一些实施例中,可以使用一个或多个机械支撑结构来在紧密间隔开的装置结构之间提供横向支撑,以防止在蚀刻过程(例如,在字线蚀刻期间)紧密间隔开的装置结构的折叠。 在一个示例中,在NAND快闪存储器的制造过程中,在执行高宽比字线蚀刻之前,一个或多个机械支撑结构可以就位,或者可以在字线蚀刻期间形成。 在一些情况下,一个或多个机械支撑结构可以包括在执行字线蚀刻之前就位的多晶硅间电介质(IPD)层的部分。