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1. 发明授权

US09915623B2 Optical inspection apparatus, a method of inspecting a substrate, and a method of treating a substrate 有权
公开(公告)号：US09915623B2
公开(公告)日：2018-03-13
申请号：US15218584
申请日：2016-07-25
申请人： Samsung Electronics Co., Ltd.
发明人： Kwang Soo Kim , Taejoong Kim , Byeonghwan Jeon , Yongsuk Choi , Youngduk Kim , Taeseok Oh , SangYun Lee , Yong-Ho Choi
IPC分类号： G01N21/00 , G01N21/95 , G02B27/09 , G02B13/00 , G02B3/00 , G01N21/956
CPC分类号： G01N21/9501 , G01N21/95623 , G02B3/0006 , G02B13/0095 , G02B27/0988
摘要： An optical inspection apparatus includes an inspection target unit on which an inspection target is loaded, an illumination optical unit configured to irradiate incident light to the inspection target, an objective lens unit disposed between the illumination optical unit and the inspection target unit, a detection optical unit configured to receive reflective light reflected from the inspection target to thereby detect a presence or absence of a defect on the inspection target, and a control unit configured to control the illumination optical unit and the detection optical unit. The illumination optical unit includes a light source part configured to irradiate the incident light, and a spatial filter array configured to modify a transmission region of the incident light irradiated from the light source part. The spatial filter array includes a spatial filter part, and a filter movement part configured to move the spatial filter part.

2. 发明授权

US09679929B2 Binary image sensors including quantum dots and unit pixels thereof 有权
公开(公告)号：US09679929B2
公开(公告)日：2017-06-13
申请号：US14052168
申请日：2013-10-11
申请人： Samsung Electronics Co., Ltd.
发明人： GwideokRyan Lee , SangChul Sul , Myungwon Lee , Min-ho Kim , Taechan Kim , Taeseok Oh , KwangHyun Lee , Taeyon Lee , Younggu Jin
IPC分类号： H01L27/146 , B82Y20/00
CPC分类号： H01L27/14609 , B82Y20/00 , H01L27/1461 , H01L27/14612 , H01L27/14679
摘要： A binary image sensor includes a plurality of unit pixels on a substrate having a surface on which light is incident. At least one quantum dot is disposed on the surface of a substrate. A column sense amplifier circuit is configured to detect binary information of a selected unit pixel among the plurality of unit pixels from a voltage or a current detected from the selected unit pixel, and a processing unit is configured to process binary information of the respective unit pixels to generate pixel image information. Related devices and methods of operation are also discussed.

3. 发明申请

US20180090344A1 RING ASSEMBLY AND CHUCK ASSEMBLY HAVING THE SAME 审中-公开
公开(公告)号：US20180090344A1
公开(公告)日：2018-03-29
申请号：US15470044
申请日：2017-03-27
申请人： Samsung Electronics Co., Ltd.
发明人： SungHyup KIM , Dong-Wook Kim , Sungmoon Park , JungHwan Um , Taeseok Oh
IPC分类号： H01L21/67 , H01L21/673 , H01J37/32 , H01L21/68 , H01L21/3065
摘要： A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a substrate. The edge ring may include a first top surface, a second top surface positioned outside the first top surface and above the first top surface, a first inner side surface connecting the first top surface to the second top surface, and at least one first flow hole extending outward from one of the first top surface and the first inner side surface, thereby penetrating the edge ring.

4. 发明申请

US20140103193A1 BINARY IMAGE SENSORS AND UNIT PIXELS THEREOF 有权
标题翻译：二进制图像传感器及其像素
公开(公告)号：US20140103193A1
公开(公告)日：2014-04-17
申请号：US14052168
申请日：2013-10-11
申请人： Samsung Electronics Co., Ltd.
发明人： GwideokRyan Lee , SangChul Sul , Myungwon Lee , Min-ho Kim , Taechan Kim , Taeseok Oh , KwangHyun Lee , Taeyon Lee , Younggu Jin
IPC分类号： H01L27/146
CPC分类号： H01L27/14609 , B82Y20/00 , H01L27/1461 , H01L27/14612 , H01L27/14679
摘要： A binary image sensor includes a plurality of unit pixels on a substrate having a surface on which light is incident. At least one quantum dot is disposed on the surface of a substrate. A column sense amplifier circuit is configured to detect binary information of a selected unit pixel among the plurality of unit pixels from a voltage or a current detected from the selected unit pixel, and a processing unit is configured to process binary information of the respective unit pixels to generate pixel image information. Related devices and methods of operation are also discussed.
摘要翻译：二值图像传感器包括在具有光入射的表面的基板上的多个单位像素。至少一个量子点设置在基板的表面上。列读出放大器电路被配置为从从所选择的单位像素检测的电压或电流中检测多个单位像素中的所选单位像素的二进制信息，并且处理单元被配置为处理各单位像素的二进制信息以生成像素图像信息。还讨论了相关设备和操作方法。

5. 发明授权

US10672629B2 Ring assembly and chuck assembly having the same 审中-公开
公开(公告)号：US10672629B2
公开(公告)日：2020-06-02
申请号：US15470044
申请日：2017-03-27
申请人： Samsung Electronics Co., Ltd.
发明人： SungHyup Kim , Dong-Wook Kim , Sungmoon Park , JungHwan Um , Taeseok Oh
IPC分类号： H01L21/67 , H01L21/687 , H01J37/32 , H01L21/3065 , H01L21/673 , H01L21/68
摘要： A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a substrate. The edge ring may include a first top surface, a second top surface positioned outside the first top surface and above the first top surface, a first inner side surface connecting the first top surface to the second top surface, and at least one first flow hole extending outward from one of the first top surface and the first inner side surface, thereby penetrating the edge ring.

6. 发明授权

US09825081B2 Semiconductor devices having a pad structure 有权
公开(公告)号：US09825081B2
公开(公告)日：2017-11-21
申请号：US15229265
申请日：2016-08-05
申请人： Samsung Electronics Co., Ltd.
发明人： Taeseok Oh , Junetaeg Lee , Seung-Hun Shin , Jaesang Yoo
IPC分类号： H01L31/0232 , H01L27/146 , H01L23/48 , H01L25/065 , H01L23/532
CPC分类号： H01L27/14636 , H01L21/187 , H01L21/76898 , H01L23/481 , H01L23/53223 , H01L23/53238 , H01L23/53266 , H01L25/0657 , H01L27/14621 , H01L27/14627 , H01L27/14634 , H01L27/1464 , H01L27/14687 , H01L27/1469
摘要： A semiconductor device includes a substrate, a circuit layer formed on a first surface of the substrate and including a via pad and an interlayer insulating layer covering the via pad, a via structure configured to fully pass through the substrate, partially pass through the interlayer insulating layer and be in contact with the via pad, a via isolation insulating layer configured to pass through the substrate and be spaced apart from outer side surfaces of the via structure in a horizontal direction and a pad structure buried in the substrate and exposed on a second surface of the substrate opposite the first surface of the substrate.

7. 发明申请

US20160190198A1 IMAGE SENSOR 有权
标题翻译：图像传感器
公开(公告)号：US20160190198A1
公开(公告)日：2016-06-30
申请号：US14958987
申请日：2015-12-04
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： DooWon KWON , Taeseok Oh
IPC分类号： H01L27/146 , H01L25/04
CPC分类号： H01L27/14636 , H01L27/14612 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14634 , H01L27/1464 , H01L27/1469 , H01L2924/0002 , H01L2924/00
摘要： An image sensor includes a pixel array chip, a logic chip, and an interposed layer. The interposed layer is disposed on the pixel array chip. The logic chip is disposed on the interposed layer. The interposed layer includes a connecting part, a shielding part, and a metal-diffusion barrier layer. The connecting part electrically connects a first interconnection wire of the pixel array chip and a second interconnection wire of the logic chip. The connecting part includes a first metallic element. The shielding part is disposed spatially apart from the connecting part and electrically grounded to suppress an electrical coupling between the pixel array chip and the logic chip. The shielding part includes a second metallic element. The metal-diffusion barrier layer is disposed on top and bottom surfaces of the interposed layer to limit diffusion of electrical charges to the pixel array chip and the logic chip.
摘要翻译：图像传感器包括像素阵列芯片，逻辑芯片和插入层。插入层设置在像素阵列芯片上。逻辑芯片设置在插入层上。插入层包括连接部分，屏蔽部分和金属扩散阻挡层。连接部分电连接像素阵列芯片的第一互连线和逻辑芯片的第二互连线。连接部分包括第一金属元件。屏蔽部分在空间上与连接部分配置并电接地以抑制像素阵列芯片和逻辑芯片之间的电耦合。屏蔽部分包括第二金属元件。金属扩散阻挡层设置在插入层的顶表面和底表面上，以限制电荷向像素阵列芯片和逻辑芯片的扩散。

8. 发明授权

US09711554B2 Image sensor 有权
公开(公告)号：US09711554B2
公开(公告)日：2017-07-18
申请号：US14958987
申请日：2015-12-04
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： DooWon Kwon , Taeseok Oh
IPC分类号： H01L27/146
CPC分类号： H01L27/14636 , H01L27/14612 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14634 , H01L27/1464 , H01L27/1469 , H01L2924/0002 , H01L2924/00
摘要： An image sensor includes a pixel array chip, a logic chip, and an interposed layer. The interposed layer is disposed on the pixel array chip. The logic chip is disposed on the interposed layer. The interposed layer includes a connecting part, a shielding part, and a metal-diffusion barrier layer. The connecting part electrically connects a first interconnection wire of the pixel array chip and a second interconnection wire of the logic chip. The connecting part includes a first metallic element. The shielding part is disposed spatially apart from the connecting part and electrically grounded to suppress an electrical coupling between the pixel array chip and the logic chip. The shielding part includes a second metallic element. The metal-diffusion barrier layer is disposed on top and bottom surfaces of the interposed layer to limit diffusion of electrical charges to the pixel array chip and the logic chip.

9. 发明申请

US20170082552A1 OPTICAL INSPECTION APPARATUS, A METHOD OF INSPECTING A SUBSTRATE, AND A METHOD OF TREATING A SUBSTRATE 有权
公开(公告)号：US20170082552A1
公开(公告)日：2017-03-23
申请号：US15218584
申请日：2016-07-25
申请人： Samsung Electronics Co., Ltd.
发明人： Kwang Soo Kim , Taejoong Kim , Byeonghwan Jeon , Yongsuk Choi , Youngduk Kim , Taeseok Oh , SangYun Lee , Yong-Ho Choi
IPC分类号： G01N21/88 , G01N21/95 , G02B3/00 , G02B27/09 , G02B13/00
CPC分类号： G01N21/9501 , G01N21/95623 , G02B3/0006 , G02B13/0095 , G02B27/0988
摘要： An optical inspection apparatus includes an inspection target unit on which an inspection target is loaded, an illumination optical unit configured to irradiate incident light to the inspection target, an objective lens unit disposed between the illumination optical unit and the inspection target unit, a detection optical unit configured to receive reflective light reflected from the inspection target to thereby detect a presence or absence of a defect on the inspection target, and a control unit configured to control the illumination optical unit and the detection optical unit. The illumination optical unit includes a light source part configured to irradiate the incident light, and a spatial filter array configured to modify a transmission region of the incident light irradiated from the light source part. The spatial filter array includes a spatial filter part, and a filter movement part configured to move the spatial filter part.

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