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1. 发明授权

US10624248B2 EMI shielding structure and manufacturing method therefor 有权
公开(公告)号：US10624248B2
公开(公告)日：2020-04-14
申请号：US15438008
申请日：2017-02-21
申请人： Samsung Electronics Co., Ltd.
发明人： Kyong-il Kim , Keon Kuk , Il-ju Mun , O-hyun Beak
IPC分类号： H05K9/00 , H05K5/06 , B29C45/14 , H05K1/18 , H05K3/28 , B29K101/12 , B29L31/34
CPC分类号： H05K9/0088 , B29C45/14639 , H05K1/188 , H05K5/065 , H05K9/0022 , B29K2101/12 , B29L2031/3425 , H01L2224/16227 , H01L2224/97 , H01L2924/19105 , H01L2924/3025 , H05K3/284 , Y10T29/49146 , H01L2224/97 , H01L2224/81
摘要： An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

2. 发明授权

US10477737B2 Manufacturing method of a hollow shielding structure for circuit elements 有权
公开(公告)号：US10477737B2
公开(公告)日：2019-11-12
申请号：US15386823
申请日：2016-12-21
申请人： Samsung Electronics Co., Ltd.
发明人： Keon Kuk , Il-ju Mun , Ji-woon Yeom , Yeon-kyoung Jung , Kyong-il Kim
IPC分类号： H05K3/36 , H05K9/00 , H05K3/30 , H05K1/02
摘要： A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

3. 发明授权

US10477687B2 Manufacturing method for EMI shielding structure 有权
公开(公告)号：US10477687B2
公开(公告)日：2019-11-12
申请号：US15488024
申请日：2017-04-14
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Il-ju Mun , Keon Kuk , Ji-woon Yeom
IPC分类号： H05K1/00 , H05K1/18 , H01L23/552 , H05K9/00 , H05K1/02 , B05D1/26 , B05D7/00
摘要： An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

4. 发明授权

US10306816B2 EMI shielding structure 有权
公开(公告)号：US10306816B2
公开(公告)日：2019-05-28
申请号：US15789184
申请日：2017-10-20
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Il-ju Mun , Keon Kuk , Ji-woon Yeom
IPC分类号： H05K7/10 , H05K7/12 , H05K9/00 , H05K1/11 , H05K1/18 , H01L23/552 , H05K3/40 , H05K3/28 , H05K3/32
摘要： An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

5. 发明授权

US10139139B2 Refrigeration cycle and refrigerator having the same 有权
公开(公告)号：US10139139B2
公开(公告)日：2018-11-27
申请号：US15511851
申请日：2015-05-21
申请人： SAMSUNG ELECTRONICS CO., LTD. , KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
发明人： Hee Moon Jeong , Seong Ho Kil , Seok Uk Kim , Keon Kuk , Yong Chan Kim , Jae Jun Lee , Yong Seok Jeon
IPC分类号： F25B29/00 , F25B49/02 , F25D17/02 , F25B40/04 , F25B9/08 , F25D11/00 , F25D17/04 , F25B5/02 , F25B5/04 , F25B40/06 , F24F5/00 , F25B13/00 , F25B40/00
摘要： Disclosed herein is a refrigeration cycle includes a first refrigerant circuit configured to cause a refrigerant ejected from a compressor to flow through a condenser, an ejector, a first evaporator, and a second evaporator and flow back to the compressor; a second refrigerant circuit configured to cause the refrigerant to bypass the first evaporator in the first refrigerant circuit; and a third refrigerant circuit branching at a junction provided at a downstream end of the condenser from at least one of the first refrigerant circuit and the second refrigerant circuit, and configured to cause the refrigerant to flow through an expansion device and a third evaporator and flow to the ejector. By such configuration, a coefficient of performance (COP) of a refrigeration cycle may be improved and an ejector may be used to improve energy efficiency.

6. 发明申请

US20140064764A1 APPARATUS AND METHOD TO CONTROL TEMPERATURE OF HEATING ROLLER USED IN FUSING DEVICE OF IMAGE FORMING APPARATUS 有权
标题翻译：用于控制图像形成装置的装置中使用的加热辊的温度的装置和方法
公开(公告)号：US20140064764A1
公开(公告)日：2014-03-06
申请号：US14073329
申请日：2013-11-06
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Dae-hwan Kim , Keon Kuk , Jin-han Kim , Jun-o Kim , Tatsuhiro Otsuka , Young-dae Ko
IPC分类号： G03G15/20
CPC分类号： G03G15/2039 , G03G15/2042
摘要： The apparatus includes a heating roller that generates heat for melting toner attached to a printing medium; a first induction coil that is disposed outside the heating roller and heats the heating roller by using induced current generated according to current flowing through the first induction coil; two second induction coils that are disposed at upper portions of both ends of the first induction coil and heat the heating roller by using induced current generated according to current flowing through the two second induction coils; a power supply unit that supplies current to the first induction coil and the two second induction coils; and a control unit that controls the power supply unit to supply current flowing in the same direction or different directions to the first induction coil and the second induction coils according to the size of paper fed into the heating roller.
摘要翻译：该装置包括加热辊，该加热辊产生用于熔化附着在打印介质上的调色剂的热量; 第一感应线圈，其设置在所述加热辊的外侧，并使用根据流过所述第一感应线圈的电流产生的感应电流加热所述加热辊; 两个第二感应线圈，其设置在第一感应线圈的两端的上部，并且通过使用根据流经两个第二感应线圈的电流产生的感应电流加热加热辊; 电源单元，其向所述第一感应线圈和所述两个第二感应线圈提供电流; 以及控制单元，其控制所述电源单元根据供给到所述加热辊中的纸张的尺寸，向与所述第一感应线圈和所述第二感应线圈相同的方向或不同方向供给电流。

7. 发明授权

US11047616B2 Refrigerator and vacuum insulation module thereof 有权
公开(公告)号：US11047616B2
公开(公告)日：2021-06-29
申请号：US15540220
申请日：2015-12-16
申请人： Samsung Electronics Co., Ltd.
发明人： Hyun Ku Jeong , Dae Hwan Kim , Choong Hyo Jang , Keon Kuk , Jun O Kim
IPC分类号： F25D23/06 , F25D23/02
摘要： Provided is a refrigerator including an inner case, a storage compartment formed inside the inner case, an outer case provided outside the inner case, and a plurality of vacuum insulation modules provided between the inner case and the outer case to insulate the storage compartment, and each of the plurality of vacuum insulation modules includes a vacuum insulator, and a cartridge which accommodates the vacuum insulator and supports the inner case and the outer case. The cartridge has a mutual coupling portion coupled to the cartridge of an adjacent vacuum insulation module. Accordingly, the vacuum insulator can be easily manufactured without an additional support frame or a foaming process, and sufficient strength and coupling force can be secured by using only the vacuum insulator.

8. 发明授权

US10566293B2 Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof 有权
公开(公告)号：US10566293B2
公开(公告)日：2020-02-18
申请号：US15061233
申请日：2016-03-04
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Keon Kuk , Young-dae Ko , O-hyun Beak , Eun-bong Han , Hyeon-hyang Kim , Yeon-kyoung Jung , Il-ju Mun
IPC分类号： H01L23/552 , B05B15/20 , H05K3/28 , H01L23/24 , H05K1/02 , H01L23/498 , H01L23/00
摘要： A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

9. 发明授权

US10201072B2 EMI shielding structure and manufacturing method thereof 有权
公开(公告)号：US10201072B2
公开(公告)日：2019-02-05
申请号：US15489190
申请日：2017-04-17
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Keon Kuk , Il-ju Mun , Jin-woo Jung , Ji-woon Yeom
IPC分类号： H05K1/18 , H05K1/02 , B05B1/00 , H05K3/28 , H05K9/00
摘要： An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.

10. 发明授权

US09964344B2 Magnetic cooling apparatus 有权
公开(公告)号：US09964344B2
公开(公告)日：2018-05-08
申请号：US14312961
申请日：2014-06-24
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jin Han Kim , Il Ju Mun , Woo Hyek Choi , Young Dae Ko , Keon Kuk , Min Soo Kim
IPC分类号： F25B21/00
CPC分类号： F25B21/00 , F25B2321/002 , F25B2321/0021 , F25B2321/0023 , Y02B30/66
摘要： A magnetic cooling apparatus including a plurality of magnetic regenerators including a plurality of magnetocaloric materials to emit heat when magnetized and to absorb heat when demagnetized. The magnetic regenerators are rotatably disposed on a circumference having a predetermined radius, at least one coil is disposed on the circumference and coupled to the magnetic regenerators, and a plurality of permanent magnets is provided inside and outside the circumference to generate a magnetic field to magnetize or demagnetize the magnetic regenerators. The at least one coil interacts with the magnetic field generated by the permanent magnets to rotate the magnetic regenerators. The coil interacting with the magnetic field to magnetize or demagnetize the magnetic regenerators is coupled to the magnetic regenerators such that the magnetic regenerators reciprocate or rotate, thereby minimizing a size of the magnetic cooling apparatus, relative to the use of a motor. In addition, a member to switch a channel of a heat transfer fluid directly performs heat transfer between the heat transfer fluid and an external fluid, thereby minimizing heat loss.

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