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    • 8. 发明申请
    • ELECTRONIC DEVICE AND METHOD FOR DISASSEMBLING THE ELECTRONIC DEVICE
    • 电子设备和用于拆卸电子设备的方法
    • US20170023973A1
    • 2017-01-26
    • US15185858
    • 2016-06-17
    • Samsung Electronics Co., Ltd.
    • Sun-Ho KIMChul-Hyung YANGJi-Woo LEE
    • G06F1/16
    • G06F1/1626G06F1/182G06F1/183H04M1/02
    • An electronic device and a method for disassembling the electronic device are provided. The electronic device includes a housing including at least one of a first plate or a second plate, when the housing includes the first plate and the second plate, the second plate faces in an opposite direction to the first plate, a substrate disposed between the first and second plates in substantially parallel with the first and second plates, a first attachment layer disposed between the first plate and the substrate, and a second attachment layer disposed between the second plate and the substrate. When the first and second attachment layers are seen from above the first plate, the first and second attachment layers overlap with each other at least partially, and one of the first and second attachment layer includes at least one tear line extended at least partially across the one attachment layer.
    • 提供了电子装置和拆卸电子装置的方法。 电子装置包括壳体,其包括第一板或第二板中的至少一个,当壳体包括第一板和第二板时,第二板面向与第一板相反的方向,基板设置在第一板 以及与所述第一板和所述第二板基本平行的第二板,设置在所述第一板和所述基板之间的第一附接层和设置在所述第二板和所述基板之间的第二附接层。 当从第一板的上方观察第一和第二附接层时,第一和第二附接层至少部分地彼此重叠,并且第一和第二附接层中的一个包括至少一条延伸至 一个附着层。