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1. 发明申请

US20140360288A1 DROPLET FORMING DEVICE AND METHOD OF FORMING DROPLET USING THE SAME 审中-公开
标题翻译：液滴形成装置和使用其形成液滴的方法
公开(公告)号：US20140360288A1
公开(公告)日：2014-12-11
申请号：US14015520
申请日：2013-08-30
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sang Hyun YI , Dong Woo LEE , Bo Sung KU
IPC分类号： B01L3/00
CPC分类号： B01L3/0262 , B01L3/0251 , B01L3/5088 , B01L2200/025 , B01L2300/0819 , B01L2300/0832 , B01L2400/028
摘要： There is provided a droplet forming device including: a guide part having a pillar shape in which the center thereof is empty; a central separation plate formed above the guide part and having a discharging hole formed in the center thereof; and a fluid storing part formed above the central separation plate.
摘要翻译：提供了一种液滴形成装置，包括：具有中心为空的柱形的引导部分; 中心分离板，形成在引导部分上方并具有形成在其中心的排出孔; 以及形成在中央分离板上方的流体存储部。

2. 发明申请

US20180123554A1 BULK ACOUSTIC WAVE RESONATOR AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20180123554A1
公开(公告)日：2018-05-03
申请号：US15704225
申请日：2017-09-14
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Je Hong KYOUNG , Jin Suk SON , Hwa Sun LEE , Sang Hyun YI
IPC分类号： H03H9/02 , H03H3/02
CPC分类号： H03H9/02047 , H03H3/02 , H03H9/02015 , H03H9/02086 , H03H9/02118 , H03H9/02157 , H03H9/173 , H03H2003/021 , H03H2003/0435 , H03H2003/0442
摘要： A bulk acoustic wave resonator includes a substrate protective layer disposed on a top surface of a substrate, a cavity defined by a membrane layer and the substrate, and a resonating part disposed on the membrane layer. The membrane layer includes a first layer and a second layer, the second layer having the same material as the first layer and having a density greater than that of the first layer.

3. 发明申请

US20170244379A1 ACOUSTIC RESONATOR AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20170244379A1
公开(公告)日：2017-08-24
申请号：US15277186
申请日：2016-09-27
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jeong Suong YANG , Sang Hyun YI , Ho Joon PARK , Yeong Gyu LEE
IPC分类号： H03H9/17 , H03H9/54
CPC分类号： H03H9/17 , H03H9/1014 , H03H9/173 , H03H9/54
摘要： An acoustic resonator includes a substrate having via holes provided therein and having a membrane structure formed on a first surface of the substrate, and a cap accommodating the membrane structure and bonded to the substrate. The cap includes a support block in contact with the membrane structure.

4. 发明申请

US20140141504A1 GEL-FORMING DEVICE 审中-公开
标题翻译：凝胶成型装置
公开(公告)号：US20140141504A1
公开(公告)日：2014-05-22
申请号：US13861275
申请日：2013-04-11
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sang Hyun YI , Dong Woo LEE , Bo Sung KU
IPC分类号： C12M1/12
CPC分类号： C12M25/14
摘要： There is provided a gel-forming device including a housing providing an inner space and having one opened side, a support plate disposed on one opened side of the housing and including at least one through-hole passing through the top and the bottom thereof, a substrate disposed on the top of the support plate and including at least one protrusion protruding from one surface thereof so as to have a biomaterial disposed thereon, and a spacing member provided on the bottom of the support plate so as to allow the support plate and the housing to be spaced apart from each other by a predetermined interval.
摘要翻译：提供了一种凝胶形成装置，其包括提供内部空间并具有一个开放侧的壳体，设置在壳体的一个开放侧上的支撑板，并且包括穿过其顶部和底部的至少一个通孔，衬底，其设置在所述支撑板的顶部上，并且包括从其一个表面突出的至少一个突起，以具有设置在其上的生物材料;以及间隔构件，其设置在所述支撑板的底部上，以允许所述支撑板和壳体彼此隔开预定间隔。

5. 发明申请

US20220149806A1 BULK ACOUSTIC WAVE RESONATOR 有权
公开(公告)号：US20220149806A1
公开(公告)日：2022-05-12
申请号：US17226317
申请日：2021-04-09
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Tae Kyung LEE , Sang Heon HAN , Sung Joon PARK , Sang Kee YOON , Sang Hyun YI , Jae Goon AUM
IPC分类号： H03H9/02 , H03H9/17
摘要： A bulk acoustic wave resonator includes: a substrate; a resonant portion including a first electrode, a piezoelectric layer, and a second electrode sequentially stacked on the substrate; and a protective layer disposed on an upper surface of the resonant portion. The protective layer includes: a first protective layer formed of a diamond thin film; and a second protective layer stacked on the first protective layer, and formed of a dielectric material.

6. 发明申请

US20210313955A1 BULK ACOUSTIC RESONATOR 有权
公开(公告)号：US20210313955A1
公开(公告)日：2021-10-07
申请号：US16942913
申请日：2020-07-30
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Chang Hyun LIM , Sang Hyun YI , Yong Suk KIM , Sung Jun LEE , Jae Hyoung GIL , Dong Hyun PARK
IPC分类号： H03H9/13 , H03H9/17
摘要： A bulk acoustic resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a protective layer disposed to cover at least the metal pad.

7. 发明申请

US20180006632A1 BULK ACOUSTIC WAVE FILTER 审中-公开
公开(公告)号：US20180006632A1
公开(公告)日：2018-01-04
申请号：US15615088
申请日：2017-06-06
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sang Hyun YI
IPC分类号： H03H9/56 , H03H9/10 , H03H9/13 , H03H9/54
CPC分类号： H03H9/105 , H03H9/0538 , H03H9/1014 , H03H9/13 , H03H9/542 , H03H9/564
摘要： A bulk acoustic wave filter includes a substrate, a first electrode and a second electrode disposed on the substrate, a piezoelectric layer including a piezoelectric material, the piezoelectric layer disposed between the first and second electrodes, and a passive element disposed on one surface of a housing. The housing is coupled to the substrate to accommodate the piezoelectric layer, the first electrode and the second electrode.

8. 发明申请

US20220085791A1 BULK-ACOUSTIC WAVE RESONATOR 有权
公开(公告)号：US20220085791A1
公开(公告)日：2022-03-17
申请号：US17231330
申请日：2021-04-15
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Tae Yoon KIM , Won HAN , Sang Hyun YI , Jae Hyoung GIL , Sang Kee YOON , Moon Chul LEE
IPC分类号： H03H9/17 , H03H9/02
摘要： A bulk-acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a cavity disposed between the substrate and the first electrode; a piezoelectric layer covering at least a portion of the first electrode; a second electrode covering at least a portion of the piezoelectric layer; an insertion layer disposed between the first electrode and the piezoelectric layer; and a lower frame disposed in the cavity. At least a portion of the lower frame overlaps the insertion layer.

9. 发明申请

US20190356293A1 BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20190356293A1
公开(公告)日：2019-11-21
申请号：US16400052
申请日：2019-05-01
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Yong Suk KIM , Moon Chul LEE , Sung Jun LEE , Chang Hyun LIM , Jae Hyoung GIL , Sang Hyun YI
IPC分类号： H03H3/02 , H03H9/17 , H03H9/02 , H03H9/13 , H03H9/54
摘要： A bulk acoustic wave resonator includes a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the lower electrode; an upper electrode disposed to cover at least a portion of the piezoelectric layer; and a passivation layer disposed to cover at least a portion of the upper electrode, wherein the passivation layer includes a non-trimming-processed portion disposed outside an active region of the bulk acoustic wave resonator in which portions of the lower electrode, the piezoelectric layer, and the upper electrode overlap, and having a thickness that is thicker than a thickness of a portion of the passivation layer disposed in the active region.

10. 发明申请

US20160077043A1 BIOCHIP AND DEVICE FOR MEASURING BIOCHIP 审中-公开
标题翻译：生物技术和生物技术设备
公开(公告)号：US20160077043A1
公开(公告)日：2016-03-17
申请号：US14664577
申请日：2015-03-20
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Sang Hyun YI
IPC分类号： G01N27/403 , G01N33/487
CPC分类号： G01N33/48785
摘要： There is provided a biochip including: a first substrate having a first surface in which a plurality of grooves are provided to accommodate at least one type of culture medium therein, and including a first electrode which is connected to the plurality of grooves; and a second substrate having a first surface in which a plurality of biomaterial fixing parts are provided to attach at least one type of biomaterial thereto, and including a second electrode which is connected to the plurality of biomaterial fixing parts. The biochip can rapidly and precisely measure a reaction of the biomaterial.
摘要翻译：提供一种生物芯片，包括：具有第一表面的第一基板，其中设置有多个槽以容纳至少一种类型的培养基，并且包括连接到所述多个槽的第一电极; 以及具有第一表面的第二基底，其中提供多个生物材料固定部分以将至少一种类型的生物材料附着到其上，并且包括连接到所述多个生物材料固定部分的第二电极。生物芯片可以快速，精确地测量生物材料的反应。

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