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    • 1. 发明授权
    • Polystyrylpyridine resins having an increased toughness, and composite
materials comprising these resins
    • 具有增加的韧性的聚苯乙烯基吡啶树脂和包含这些树脂的复合材料
    • US4540770A
    • 1985-09-10
    • US643651
    • 1984-08-23
    • Sammy Chevallier
    • Sammy Chevallier
    • C08L61/00C08G16/00C08G16/02C08J5/24C08L61/34C08G12/02
    • C08J5/24C08G16/0268C08J2361/00
    • The present invention relates to polystyrylpyridine-type resins having increased toughness, and composite materials containing these resins.The resin of the invention contains a polycondensation product of at least two reactive methylated substituents, the said resin having the following general formula (I): U.sub.x V.sub.y W.sub.z in which: ##STR1## U denotes the grouping ##STR2## V denotes the grouping ##STR3## W denotes the grouping in which:R, R.sub.1 are identical or different and denote a chain segment consisting of hydrocarbon radicals and able to contain hetero atoms,A, A.sub.1 are identical or different and denote an atom or group forming a bridge between the segment R and an aromatic nucleus of the styrylpyridine chain, containing stereomobile bonds,R.sub.2 denotes hydrogen, or a methyl or ethyl radical, x, y, z denote integers that may be equal to 0, the sum y+z being at least equal to 1.Advantageously, A, A.sub.1 denotes an oxygen atom. The resins of the invention have better mechanical properties than conventional polystyrylpyridine (PSP) resins, particularly at ambient temperature, yet preserve the excellent thermostability and moisture resistance properties characteristic of PSP resins. This resin may be used as matrix in a laminate.
    • 本发明涉及韧性提高的聚苯乙烯基吡啶型树脂,以及包含这些树脂的复合材料。 本发明的树脂含有至少两个反应性甲基化取代基的缩聚产物,所述树脂具有以下通式(I):Ux Vy Wz,其中:U表示分组 V表示分组, 图像W表示其中:R,R 1相同或不同并且表示由烃基组成并能够含有杂原子的链段的分组,A,A1相同或不同,并且表示在原子或基团之间形成桥 段R和苯乙烯基吡啶链的芳香核,含有立体移动键,R2表示氢或甲基或乙基,x,y,z表示可等于0的整数,y + z之和至少等于 有利地,A,A1表示氧原子。 本发明的树脂具有比常规聚苯乙烯基吡啶(PSP)树脂更好的机械性能,特别是在环境温度下,同时保持了PSP树脂的优异的耐热性和耐湿性。 该树脂可以用作层压体中的基质。