会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明申请
    • ELECTRICAL CONTACTS FOR SKUTTERUDITE THERMOELECTRIC MATERIALS
    • SKUTTERUDITE热电材料的电气接触
    • US20120006376A1
    • 2012-01-12
    • US13161156
    • 2011-06-15
    • JEAN-PIERRE FLEURIALThierry CaillatSu Chih Chi
    • JEAN-PIERRE FLEURIALThierry CaillatSu Chih Chi
    • H01L35/32H01L35/34H01L35/18
    • H01L35/08H01L35/18
    • A thermally stable diffusion barrier for bonding skutterudite-based materials with metal contacts is disclosed. The diffusion barrier may be employed to inhibit solid-state diffusion between the metal contacts, e.g. titanium (Ti), nickel (Ni), copper (Cu), palladium (Pd) or other suitable metal electrical contacts, and a skutterudite thermoelectric material including a diffusible element, such as antimony (Sb), phosphorous (P) or arsenic (As), e.g. n-type CoSb3 or p-type CeFe4−xCoxSb12 where the diffusible element is Sb, to slow degradation of the mechanical and electrical characteristics of the device. The diffusion barrier may be employed to bond metal contacts to thermoelectric materials for various power generation applications operating at high temperatures (e.g. 673 K or above). Some exemplary diffusion barrier materials have been identified such as zirconium (Zr), hafnium (Hf), and yttrium (Y).
    • 公开了一种热稳定的扩散阻挡层,用于粘接具有金属触点的方钴矿基材料。 可以使用扩散阻挡层来抑制金属触点之间的固态扩散,例如, 钛(Ti),镍(Ni),铜(Cu),钯(Pd)或其它合适的金属电触点,以及包括可扩散元素如锑(Sb),磷(P)或砷 As),例如 n型CoSb3或p型CeFe4-xCoxSb12,其中可扩散元素为Sb,从而缓慢降低器件的机械和电气特性。 可以使用扩散阻挡层将金属触点接合到用于在高温(例如673K或更高)下操作的各种发电应用的热电材料。 已经鉴定了一些示例性的扩散阻挡材料,例如锆(Zr),铪(Hf)和钇(Y)。