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1. 发明申请

US20070170350A1 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers 有权
公开(公告)号：US20070170350A1
公开(公告)日：2007-07-26
申请号：US11727545
申请日：2007-03-27
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
IPC分类号： H01L27/00
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

2. 发明申请

US20060243889A1 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers 有权
公开(公告)号：US20060243889A1
公开(公告)日：2006-11-02
申请号：US11476015
申请日：2006-06-28
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Alan Wood , Peter Benson , James Wark , David Hembree , Kyle Kirby , Charles Watkins , Salman Akram
IPC分类号： H01L27/00
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

3. 发明申请

US20060220665A1 Alignment fences and devices and assemblies including the same 审中-公开
标题翻译：对齐栅栏和包括它们的装置和组件
公开(公告)号：US20060220665A1
公开(公告)日：2006-10-05
申请号：US11445684
申请日：2006-06-01
申请人： Salman Akram , Alan Wood , Warren Farnworth
发明人： Salman Akram , Alan Wood , Warren Farnworth
IPC分类号： G01R31/02
CPC分类号： H05K7/1061 , B33Y10/00 , B33Y30/00 , B33Y80/00 , G01R1/0408 , G01R1/0433 , G01R1/0466 , G01R1/0483 , G01R1/07378 , G01R3/00 , H01L23/32 , H01L23/49827 , H01L2224/16111 , H01L2224/16237 , H01L2224/8114 , H01L2224/81385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01049 , H01L2924/01082 , H01L2924/12042 , H01L2924/12044 , H01L2924/15787 , H01L2924/351 , H05K1/112 , H05K1/141 , H05K3/3436 , H05K2201/049 , H05K2201/09472 , H05K2201/10378 , H05K2201/10734 , H05K2201/2018 , H05K2203/167 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49156 , Y10T29/49165 , Y10T29/49204 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A fence is configured to receive and align a semiconductor device, such as a flip-chip type semiconductor device, with a substrate. The fence may include a plurality of adjacent, mutually adhered regions, which may comprise layers. One or more laterally recessed regions may be located at one or more corners of a receptacle formed by the fence to facilitate rough alignment of a semiconductor device with the substrate. The receptacle of the fence may include edges that are configured to progressively align a semiconductor device with the substrate.
摘要翻译：栅栏被配置为接收和对齐诸如倒装芯片型半导体器件的半导体器件与衬底。栅栏可以包括多个相邻的相互粘合的区域，其可以包括层。一个或多个横向凹陷区域可以位于由栅栏形成的容器的一个或多个拐角处，以便半导体器件与衬底的粗略对准。栅栏的插座可以包括被配置为使半导体器件与衬底逐渐对准的边缘。

4. 发明申请

US20060035415A1 Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages 有权
标题翻译：用于制造图像传感器封装等的框架结构和半导体附着工艺以及所产生的封装
公开(公告)号：US20060035415A1
公开(公告)日：2006-02-16
申请号：US10919604
申请日：2004-08-16
申请人： Alan Wood , Kyle Kirby , Warren Farnworth , Salman Akram
发明人： Alan Wood , Kyle Kirby , Warren Farnworth , Salman Akram
IPC分类号： H01L21/50
CPC分类号： H01L27/14618 , B33Y80/00 , H01L27/14625 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor package such as an image sensor package, and methods for fabrication. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used for the packages.
摘要翻译：诸如图像传感器封装的半导体封装以及制造方法。框架结构包括每个具有穿过其中的孔的框架阵列，图像传感器与盖玻片，过滤器，透镜或其它部件组合的模具可以精确相互对准地安装在该框架中。单片图像传感器骰子和其他组件可以被拾取并放置在框架结构的每个帧中。或者，框架结构可以被配置为与承载多个图像传感器骰子的晶片对准并且连接到其上，其中沿着框架的周边的任选的向下突出的裙边可以被接收到沿着晶片上的模具位置之间沿着街道切割的切口，然后安装其他包装组件。在任一情况下，将帧结构与单独的图像传感器芯片或连接的晶片组合成单独的图像传感器封装。各种外部连接方法可用于包装。

5. 发明授权

US6005290A Multi chip module having self limiting contact members 失效
标题翻译：具有自限制接触构件的多芯片模块
公开(公告)号：US6005290A
公开(公告)日：1999-12-21
申请号：US691759
申请日：1996-08-02
申请人： Salman Akram , Warren Farnworth , Alan Wood
发明人： Salman Akram , Warren Farnworth , Alan Wood
IPC分类号： G01R1/04 , G01R31/28 , H01L21/66 , H01L23/13 , H01L23/32 , H01L23/34 , H01L23/06 , H01L23/48
CPC分类号： G01R1/04 , G01R31/2863 , H01L22/22 , H01L23/13 , H01L23/32 , H01L2224/16145 , H01L2224/48227 , H01L2924/09701 , H01L2924/10253
摘要： A method for forming a multi chip module for singulated semiconductor dice or dice contained on a wafer is provided. The method includes forming an interconnect adapted to support and establish an electrical connection with the dice. The interconnect includes a substrate formed of a material such as silicon with raised contact members. The raised contact members include projections adapted to penetrate contact locations on the dice (e.g., bond pads) to a limited penetration depth to establish the electrical connection. A conductive layer and conductive traces are formed on the substrate to form an electrical path to the contact members. Programmable links, such as fuses or anti-fuses, can be included in the electrical path for enabling or disabling select dice of the module. A packaged multi chip module assembly can be formed by encapsulation of the dice and substrate in an insulating material or by forming a ceramic base and cover.
摘要翻译：提供一种用于形成包含在晶片上的单片半导体晶片或骰子的多芯片模块的方法。该方法包括形成适于支撑并建立与骰子的电连接的互连。互连包括由诸如具有凸起接触构件的硅的材料形成的衬底。凸起的接触构件包括适于将骰子（例如，接合垫）上的接触位置穿透到有限的穿透深度以建立电连接的突起。导电层和导电迹线形成在衬底上以形成到接触构件的电路径。可编程链路，如保险丝或反熔丝，可以包含在电气路径中，用于启用或禁用模块的选择骰子。封装的多芯片模块组件可以通过将骰子和基板封装在绝缘材料中或通过形成陶瓷基底和盖而形成。

6. 发明申请

US20070088451A1 Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs 失效
标题翻译：使用有关制造程序集成电路（ICS）的数据的方法已经进行了修复，以选择IC将经历的程序，例如额外修理
公开(公告)号：US20070088451A1
公开(公告)日：2007-04-19
申请号：US11545067
申请日：2006-10-06
申请人： Salman Akram , Warren Farnworth , Derek Gouchnour , David Hembree , Michael Hess , John Jacobson , James Wark , Alan Wood
发明人： Salman Akram , Warren Farnworth , Derek Gouchnour , David Hembree , Michael Hess , John Jacobson , James Wark , Alan Wood
IPC分类号： G06F19/00
CPC分类号： G03F7/7065 , G06F11/006 , H01L2223/5444
摘要： An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on ICs at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the ICs. The ID codes of the ICs are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the ICs is then accessed, and additional repair procedures the ICs may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.
摘要翻译：在集成电路（IC）制造过程中的创造性方法，用于使用关于在探针上的IC进行的修复程序的数据，以确定是否在制造过程中稍后进行进一步的修理，包括将数据与每个的熔丝ID相关联地存储 IC。 IC的ID代码在制造过程中例如在打开/短路测试中自动读取。然后访问与IC的ID代码相关联存储的数据，并且根据所访问的数据选择IC可能经历的附加修复过程。因此，例如，访问的数据可以指示IC不可修复，因此IC可以直接进入废料仓，而不必被查询以确定其是否可修复，如在传统IC制造过程中所必需的。

7. 发明申请

US20060261340A1 Microelectronic imagers and methods of packaging microelectronic imagers 有权
标题翻译：微电子成像器和包装微电子成像器的方法
公开(公告)号：US20060261340A1
公开(公告)日：2006-11-23
申请号：US11494453
申请日：2006-07-28
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
IPC分类号： H01L29/04 , H01L33/00 , H01L29/768 , H01L27/148 , H01L31/0203
CPC分类号： H01L27/14618 , H01L23/481 , H01L24/48 , H01L31/0203 , H01L31/02325 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
摘要翻译：本文公开了微电子成像器和用于封装微电子成像器的方法。在一个实施例中，微电子成像单元可以包括微电子管芯，图像传感器，电耦合到图像传感器的集成电路以及电耦合到集成电路的接合焊盘。导电晶片互连延伸穿过管芯并且与焊盘接触。互连可以包括完全延伸穿过基底的通道和具有至少部分地设置在通道中的导电填充材料的接合垫。导电支撑构件由接合垫承载和突出。图像传感器上的盖连接到支撑构件。

8. 发明申请

US20060192230A1 Image sensor packages and frame structure thereof 有权
标题翻译：图像传感器封装及其框架结构
公开(公告)号：US20060192230A1
公开(公告)日：2006-08-31
申请号：US11411265
申请日：2006-04-26
申请人： Alan Wood , Kyle Kirby , Warren Farnworth , Salman Akram
发明人： Alan Wood , Kyle Kirby , Warren Farnworth , Salman Akram
IPC分类号： H01L27/148 , H01L31/0203
CPC分类号： H01L27/14618 , B33Y80/00 , H01L27/14625 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor package such as an image sensor package. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used.
摘要翻译：诸如图像传感器封装的半导体封装。框架结构包括每个具有穿过其中的孔的框架阵列，图像传感器与盖玻片，过滤器，透镜或其它部件组合的模具可以精确相互对准地安装在该框架中。单片图像传感器骰子和其他组件可以被拾取并放置在框架结构的每个帧中。或者，框架结构可以被配置为与承载多个图像传感器骰子的晶片对准并且连接到其上，其中沿着框架的周边的任选的向下突出的裙边可以被接收到沿着晶片上的模具位置之间沿着街道切割的切口，然后安装其他包装组件。在任一情况下，将帧结构与单独的图像传感器芯片或连接的晶片组合成单独的图像传感器封装。可以使用各种外部连接方法。

9. 发明申请

US20050275048A1 Microelectronic imagers and methods of packaging microelectronic imagers 有权
标题翻译：微电子成像器和包装微电子成像器的方法
公开(公告)号：US20050275048A1
公开(公告)日：2005-12-15
申请号：US10867352
申请日：2004-06-14
申请人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
发明人： Warren Farnworth , Sidney Rigg , William Hiatt , Kyle Kirby , Peter Benson , James Wark , Alan Wood , David Hembree , Salman Akram , Charles Watkins
IPC分类号： H01L21/00 , H01L23/02 , H01L23/48 , H01L27/14 , H01L27/146 , H01L31/00 , H01L31/0203 , H01L31/0232
CPC分类号： H01L27/14618 , H01L23/481 , H01L24/48 , H01L31/0203 , H01L31/02325 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/04941 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
摘要翻译：本文公开了微电子成像器和用于封装微电子成像器的方法。在一个实施例中，微电子成像单元可以包括微电子管芯，图像传感器，电耦合到图像传感器的集成电路以及电耦合到集成电路的接合焊盘。导电晶片互连延伸穿过管芯并且与焊盘接触。互连可以包括完全延伸穿过基底的通道和具有至少部分地设置在通道中的导电填充材料的接合垫。导电支撑构件由接合垫承载和突出。图像传感器上的盖连接到支撑构件。

10. 发明申请

US20050230825A1 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer 失效
公开(公告)号：US20050230825A1
公开(公告)日：2005-10-20
申请号：US11083057
申请日：2005-03-16
申请人： Salman Akram , Alan Wood , Warren Farnworth
发明人： Salman Akram , Alan Wood , Warren Farnworth
IPC分类号： G01R1/04 , H01L21/60 , H01L23/13 , H01L23/48 , H01L23/498 , H05K3/32
CPC分类号： H01L23/13 , G01R1/0466 , G01R1/0483 , H01L23/49827 , H01L2224/05571 , H01L2224/05573 , H01L2224/131 , H01L2224/16237 , H01L2224/8114 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/15174 , H05K3/325 , H05K3/326 , H01L2224/05599
摘要： The present invention is directed toward apparatus and methods of testing and assembling bumped die and bumped devices using an anisotropically conductive layer. In one embodiment, a semiconductor device comprises a bumped device having a plurality of conductive bumps formed thereon, a substrate having a plurality of contact pads distributed thereon and approximately aligned with the plurality of conductive bumps, and an anisotropically conductive layer disposed between and mechanically coupled to the bumped device and to the substrate. The anisotropically conductive layer electrically couples each of the conductive bumps with a corresponding one of the contact pads. In another embodiment, an apparatus for testing a bumped device having a plurality of conductive bumps includes a substrate having a plurality of contact pads distributed thereon and substantially alignable with the plurality of conductive bumps, and an anisotropically conductive layer disposed on the first surface and engageable with the plurality of conductive bumps to electrically couple each of the conductive bumps with a corresponding one of the contact pads. Alternately, the test apparatus may also include an alignment device or a bumped device handler. In another embodiment, a method of testing a bumped device includes engaging a plurality of contact pads with an anisotropically conductive layer, engaging the plurality of conductive bumps with the anisotropically conductive layer substantially opposite from and in approximate alignment with the plurality of contact pads, forming a plurality of conductive paths through the anisotropically conductive layer so that each of the conductive bumps is electrically coupled to one of the contact pads, and applying test signals through at least some of the contact pads and the conductive paths to at least some of the conductive bumps.

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