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1. 发明申请

US20190019714A1 ELECTROSTATIC CHUCK DEVICE 审中-公开
公开(公告)号：US20190019714A1
公开(公告)日：2019-01-17
申请号：US16070478
申请日：2017-01-18
申请人： SUMITOMO OSAKA CEMENT CO., LTD.
发明人： Mamoru KOSAKAI , Yukio MIURA , Kazunori ISHIMURA , Keisuke MAEDA , Hitoshi KOUNO , Yuuki KINPARA , Shinichi MAETA , Tomomi ITO
IPC分类号： H01L21/683 , H01L21/67 , H02N13/00
摘要： An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.

2. 发明申请

US20180254211A1 ELECTROSTATIC CHUCK DEVICE 审中-公开
公开(公告)号：US20180254211A1
公开(公告)日：2018-09-06
申请号：US15752863
申请日：2016-08-09
申请人： SUMITOMO OSAKA CEMENT CO., LTD.
发明人： Mamoru KOSAKAI , Shinichi MAETA , Keisuke MAEDA
IPC分类号： H01L21/683 , H01L21/3065 , H02N13/00 , B23Q3/15 , H01L21/67
CPC分类号： H01L21/6833 , B23Q3/15 , H01L21/3065 , H01L21/67109 , H01L21/67248 , H01L21/683 , H01L21/6835 , H02N13/00
摘要： An electrostatic chuck device includes an electrostatic chuck member and a temperature controlling base member. The electrostatic chuck member has a ceramic plate having a mounting surface on which a plate-shaped sample is mounted, and an electrode for electrostatic attraction provided on the other surface on the side opposite the mounting surface of the ceramic plate. The temperature controlling base member is disposed on the surface on the side opposite the ceramic plate side of the electrode for electrostatic attraction and cools the electrostatic chuck member. The ceramic plate has a dike portion which extends to the temperature controlling base member side and surrounds the electrode for electrostatic attraction, the temperature controlling base member has a groove portion accommodating an end part of the dike portion, and a space between the groove portion and the dike portion is filled with a filling part formed of a resin material.

3. 发明申请

US20210006182A1 ELECTROSTATIC CHUCK DEVICE 有权
公开(公告)号：US20210006182A1
公开(公告)日：2021-01-07
申请号：US16954989
申请日：2019-11-11
申请人： SUMITOMO OSAKA CEMENT CO., LTD.
发明人： Shinichi MAETA
IPC分类号： H02N13/00 , H01L21/683
摘要： According to an electrostatic chuck device of the present invention, a cross-sectional shape of a base body in a thickness direction is a convex curved surface or a concave curved surface that gradually curves from a center of one main surface toward an outer periphery of the one main surface, an annular projection portion is provided on a peripheral portion on the one main surface of the base body so as to go around the peripheral portion, a plurality of convex projection portions are provided in a region surrounded by the annular projection portion, a difference between a height of a top surface of the convex projection portion positioned at a center of the one main surface and a height of an upper surface of the annular projection portion is 1 μm or higher and 30 μm or lower, the convex projection portion has the top surface in contact with the plate-shaped sample, a side surface, and an R surface continuously connecting the top surface and the side surface, and a ratio of a diameter of the top surface to a diameter of a bottom surface is 0.75 or higher, and an angle formed by the top surface and the side surface of the convex projection portion is 90° or higher and 160° or lower.

4. 发明申请

US20180269097A1 ELECTROSTATIC CHUCK DEVICE 审中-公开
公开(公告)号：US20180269097A1
公开(公告)日：2018-09-20
申请号：US15762056
申请日：2016-09-13
申请人： SUMITOMO OSAKA CEMENT CO., LTD.
发明人： Shinichi MAETA , Yukio MIURA , Mamoru KOSAKAI , Hitoshi KOUNO
IPC分类号： H01L21/683 , H01J37/32
CPC分类号： H01L21/6833 , H01J37/32642 , H01J37/32724 , H01J2237/002 , H01J2237/334 , H01L21/67069 , H01L21/6831 , H01L21/68735 , H02N13/00
摘要： An electrostatic chuck device according to the present invention includes: an electrostatic chuck portion having a placement surface on which a plate-like sample is placed; a base portion for temperature adjustment disposed in opposition to the side of the electrostatic chuck portion on the opposite side from the placement surface; a bonding portion for bonding the electrostatic chuck portion and the base portion for temperature adjustment together; and an annular focus ring surrounding the periphery of the placement surface, in which the volume of a space surrounded by the electrostatic chuck portion, the focus ring, the bonding portion, and a dam portion of the base portion for temperature adjustment is greater than the amount of volume expansion of the bonding portion at the working temperature.

5. 发明申请

US20180108555A1 ELECTROSTATIC CHUCK DEVICE 审中-公开
公开(公告)号：US20180108555A1
公开(公告)日：2018-04-19
申请号：US15562850
申请日：2016-02-25
申请人： SUMITOMO OSAKA CEMENT CO., LTD.
发明人： Mamoru KOSAKAI , Shinichi MAETA , Keisuke MAEDA
IPC分类号： H01L21/683
CPC分类号： H01L21/6833 , H01L21/67103 , H01L21/6831 , H01L21/6875 , H01L21/68757
摘要： An electrostatic chuck device includes: a placing plate having a placement surface on which a plate-like sample is placed on one side thereof; an electrostatic attraction electrode provided on the other side of the first ceramic plate; and a first organic insulating layer provided between the first ceramic plate and the electrostatic attraction electrode. The electrostatic chuck device further has a supporting plate provided between the first organic insulating layer and the electrostatic attraction electrode.

6. 发明申请

US20180025933A1 ELECTROSTATIC CHUCK DEVICE, AND SEMICONDUCTOR MANUFACTURING DEVICE 审中-公开
公开(公告)号：US20180025933A1
公开(公告)日：2018-01-25
申请号：US15550205
申请日：2016-02-03
申请人： SUMITOMO OSAKA CEMENT CO., LTD.
发明人： Kazunori ISHIMURA , Kazuto ANDO , Kentaro TAKAHASHI , Yuhki KINPARA , Shinichi MAETA , Mamoru KOSAKAI
IPC分类号： H01L21/683 , H01L21/67
CPC分类号： H01L21/6833 , H01L21/67103 , H01L21/67109 , H01L21/6831 , H01L21/68757
摘要： An electrostatic chuck part of an electrostatic chuck device has an electrostatic chuck part inner peripheral surface surrounding an opening of a chuck part through-hole, and an electrostatic chuck part outer peripheral surface surrounding the electrostatic chuck part inner peripheral surface. An insulator has an insulator main body in which an insulator through-hole having an opening on the electrostatic chuck part side is formed, an insulator inner end face, and an insulator outer end face which faces the electrostatic chuck part outer peripheral surface. The insulator inner end face and the electrostatic chuck part inner peripheral surface are in contact with each other, or an adhesion layer or a plasma-resistant adhesive layer extends in a gap between the insulator inner end face and the electrostatic chuck part inner peripheral surface. The plasma-resistant adhesive layer is formed between the electrostatic chuck part outer peripheral surface and the insulator outer end face.

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