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    • 4. 发明申请
    • MOTHERBOARD
    • 母板
    • US20080259553A1
    • 2008-10-23
    • US11766105
    • 2007-06-21
    • SHOU-KUO HSUDUEN-YI HOCHENG-SHIEN LI
    • SHOU-KUO HSUDUEN-YI HOCHENG-SHIEN LI
    • H05K7/00
    • G06F1/26
    • An exemplary motherboard includes a first slot arranged for mounting a first type of memory, a second slot arranged for mounting a second type of memory, a voltage regulator electronically connected to the first slot and the second slot, and a serial presence detect (SPD) unit connected to the voltage regulator. The first memory and the second memory alternatively mounted on the motherboard, the SPD detects which type of memory is mounted on the motherboard, and the voltage regulator outputs voltages suitable for the type of the memory mounted on the motherboard according to a detection result of the SPD.
    • 示例性主板包括布置用于安装第一类型存储器的第一槽,布置用于安装第二类型存储器的第二槽,电连接到第一槽和第二槽的电压调节器,以及串联存在检测(SPD) 单元连接到电压调节器。 第一存储器和第二存储器交替地安装在母板上,SPD检测在主板上安装哪种类型的存储器,并且电压调节器根据检测结果输出适合安装在母板上的存储器类型的电压 SPD。
    • 6. 发明申请
    • SYSTEM AND METHOD FOR ANALYZING RESPONSE VALUES SUM OF DIFFERENTIAL SIGNALS
    • 用于分析差分信号响应值的系统和方法
    • US20080010622A1
    • 2008-01-10
    • US11615008
    • 2006-12-22
    • SHOU-KUO HSUCHENG-SHIEN LI
    • SHOU-KUO HSUCHENG-SHIEN LI
    • G06F17/50
    • G06F17/5036G06F17/504
    • A method for analyzing response values sum of differential signals includes: receiving configurations of simulation parameters; simulating differential signal paths with an analog transmission channel according to a design file; analyzing the analog transmission channel into different channel modes according to received configurations; simulating a plurality of pulse signals into the analog transmission channel according to the received configurations, and recording an impulse response of each of the channel modes; simulating differential signal transmissions of the differential signals according to the received configurations, and analyzing the differential signal transmissions into different signal modes corresponding to the different channel modes; transforming each signal mode and the impulse response of a corresponding channel mode to respectively generate a first value and a second value by utilizing Fast Fourier Transform Algorithm; multiplying the first value by the second value to generate a third value, and transforming the third value to a fourth value by utilizing an Inverse Fast Fourier Transform Algorithm; and summing all the fourth values corresponding to all of the channel modes to be the response values sum of the differential signals. A related system is also disclosed.
    • 用于分析差分信号的响应值和的方法包括:接收模拟参数的配置; 根据设计文件用模拟传输通道模拟差分信号路径; 根据接收的配置,将模拟传输信道分析成不同的信道模式; 根据接收到的配置将多个脉冲信号模拟成模拟传输信道,并记录每个信道模式的脉冲响应; 根据接收到的配置模拟差分信号的差分信号传输,并将差分信号传输分析成对应于不同信道模式的不同信号模式; 通过利用快速傅立叶变换算法来变换每个信号模式和相应信道模式的脉冲响应,分别产生第一值和第二值; 将第一值乘以第二值以产生第三值,并且通过利用快速傅里叶逆变换算法将第三值变换为第四值; 并将与所有信道模式相对应的所有第四值求和作为差分信号的响应值和。 还公开了相关系统。
    • 7. 发明申请
    • MOTHERBOARD
    • 母板
    • US20090096555A1
    • 2009-04-16
    • US11942727
    • 2007-11-20
    • SHOU-KUO HSUCHIEN-HUNG LIUCHENG-SHIEN LI
    • SHOU-KUO HSUCHIEN-HUNG LIUCHENG-SHIEN LI
    • H01P5/12
    • G06F13/409
    • A motherboard includes a signal control chip, a signal switch chip connected to the signal control chip via a plurality of first transmission lines, and a complex connector configured for connecting to a first type of transmission device or a second type of transmission device. The signal control chip is connected to the complex connector via the first transmission lines and a plurality of second transmission lines. The signal switch chip is electrically connected to the complex connector via a plurality of third transmission lines. Each second transmission line is connected in series with a first resistor. Each third transmission line is connected in series with a second resistor. When the first type of transmission device is mounted on the complex connector, the signal switch chip and the second resistors are removed. When the second type of transmission device is mounted on the complex connector, the first resistors are removed.
    • 主板包括信号控制芯片,通过多个第一传输线连接到信号控制芯片的信号开关芯片,以及被配置为连接到第一类型的传输设备或第二类型的传输设备的复合连接器。 信号控制芯片通过第一传输线和多条第二传输线连接到复合连接器。 信号开关芯片通过多条第三传输线与复合连接器电连接。 每个第二传输线与第一电阻器串联连接。 每个第三传输线与第二电阻器串联连接。 当第一类型的传输装置安装在复合连接器上时,信号开关芯片和第二电阻器被去除。 当第二类型的传输装置安装在复合连接器上时,第一电阻器被去除。
    • 8. 发明申请
    • OVERDRIVE TOPOLOGY STRUCTURE FOR TRANSMISSION OF RGB SIGNAL
    • 用于传输RGB信号的扩展拓扑结构
    • US20100289601A1
    • 2010-11-18
    • US12483260
    • 2009-06-12
    • SHOU-KUO HSUYU-CHANG PAICHENG-SHIEN LIJIA-CHI CHEN
    • SHOU-KUO HSUYU-CHANG PAICHENG-SHIEN LIJIA-CHI CHEN
    • H01P3/00
    • H04L25/0278G09G5/04G09G2300/0426
    • An overdrive topology structure for transmission of a RGB signal includes a signal sending terminal, a signal receiving terminal, and a transmission line to transmit the RGB signal from the signal sending terminal to the signal receiving terminal. The transmission line is divided into a number of section transmission lines. A node is formed between every two section transmission lines. An impedance of a first section transmission line approaching to the signal sending terminal is less than an impedance of a second section transmission line approaching to the first section transmission line to overdrive the RGB signal at a first node between the first and second section transmission lines. At least one node except the first node is grounded via a resistor. An equivalent resistance of the resistor is equal to a resistance of the first resistor.
    • 用于传输RGB信号的过驱动拓扑结构包括信号发送端,信号接收端和传输线,以将RGB信号从信号发送端发送到信号接收端。 传输线被分成多个部分传输线。 在每两段传输线之间形成节点。 接近信号发送端的第一部分传输线的阻抗小于接近第一部分传输线的第二部分传输线的阻抗,以在第一和第二部分传输线之间的第一节点处过驱动RGB信号。 除第一个节点之外的至少一个节点通过电阻器接地。 电阻器的等效电阻等于第一电阻器的电阻。
    • 10. 发明申请
    • MOTHERBOARD
    • 母板
    • US20080059685A1
    • 2008-03-06
    • US11759238
    • 2007-06-07
    • SHOU-KUO HSUCHENG-SHIEN LI
    • SHOU-KUO HSUCHENG-SHIEN LI
    • G06F13/36
    • G06F13/4068G06F2213/0024H05K1/029H05K1/0295H05K2201/10363
    • A motherboard includes a chipset, a first connector pad suitable for receiving a first type of PCI connector, a second connector pad suitable for receiving a second type of PCI connector, a plurality of first transmission lines, a plurality of second transmission lines, and a plurality of areas for mounting switches. One end of each first transmission line is connected to the chipset, another end of each first transmission line is connected to an end of a corresponding area, one end of each second transmission line is connected to another end of the corresponding area, another end of each second transmission line is connected to the second connector pad, the first connector pad is connected to the plurality of first transmission lines, and the switches are selectively mounted on the plurality of areas.
    • 主板包括芯片组,适于接收第一类型的PCI连接器的第一连接器焊盘,适于接收第二类型的PCI连接器的第二连接器焊盘,多个第一传输线,多条第二传输线,以及 多个安装开关的区域。 每个第一传输线的一端连接到芯片组,每个第一传输线的另一端连接到相应区域的一端,每个第二传输线的一端连接到相应区域的另一端,另一端 每个第二传输线连接到第二连接器焊盘,第一连接器焊盘连接到多个第一传输线,并且开关选择性地安装在多个区域上。