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1. 发明申请

US20130016466A1 MOTHERBOARD CAPABLE OF REDUCING ELECTROMAGNETIC INTERFERENCE 失效
标题翻译：能减少电磁干扰的主轴
公开(公告)号：US20130016466A1
公开(公告)日：2013-01-17
申请号：US13275329
申请日：2011-10-18
申请人： SHIN-TING YEN , YUNG-CHIEH CHEN , DUEN-YI HO
发明人： SHIN-TING YEN , YUNG-CHIEH CHEN , DUEN-YI HO
IPC分类号： G06F1/16
CPC分类号： H05K1/0216 , H05K1/0296 , H05K1/113 , H05K2201/10159 , H05K2201/10189 , H05K2201/10522
摘要： A motherboard includes a printed circuit board (PCB), a central processing unit (CPU), a regulator, a first memory adaptor, and a second memory adaptor. The PCB includes a top surface, a bottom surface, a plurality of first soldering pads and first leads arranged on the top surface, and a plurality of second leads arranged between the top surface and the bottom surface. The PCB defines a plurality of first vias, second vias, and power vias. The CPU is connected to the first vias. The voltage regulator is connected to the power vias. The first memory adaptor neighbors to the regulator and is surface-mount soldered to the first soldering pads. The first soldering pads are connected to the first vias by first leads. The second memory adaptor is soldered to the second vias. The second vias are connected to the first vias by the second leads.
摘要翻译：主板包括印刷电路板（PCB），中央处理单元（CPU），调节器，第一存储器适配器和第二存储器适配器。 PCB包括顶表面，底表面，多个第一焊盘和布置在顶表面上的第一引线，以及布置在顶表面和底表面之间的多个第二引线。 PCB限定多个第一通孔，第二通孔和电源通孔。 CPU连接到第一个通孔。电压调节器连接到电源通孔。第一个存储器适配器与调节器相邻，并且表面安装焊接到第一个焊盘。第一焊盘通过第一引线连接到第一通孔。第二个存储器适配器焊接到第二个通孔。第二通孔通过第二引线连接到第一通孔。

2. 发明申请

US20120140426A1 PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板
公开(公告)号：US20120140426A1
公开(公告)日：2012-06-07
申请号：US12978599
申请日：2010-12-26
申请人： DUEN-YI HO , YUNG-CHIEH CHEN
发明人： DUEN-YI HO , YUNG-CHIEH CHEN
IPC分类号： H05K7/06
CPC分类号： H05K1/0243 , G06K19/077 , G11C5/025 , G11C5/04 , G11C5/063 , H05K1/181 , H05K2201/09227 , H05K2201/10159
摘要： A printed circuit board includes a top layer. A memory controller, a first dual-channel architecture, and a second dual-channel architecture are located on the top layer. A distance between the memory modules of the first dual-channel architecture and the memory controller is equal to a distance between the memory modules of the second dual-channel architecture and the memory controller.
摘要翻译：印刷电路板包括顶层。存储器控制器，第一双通道架构和第二双通道架构位于顶层上。第一双通道架构的存储器模块与存储器控制器之间的距离等于第二双通道架构的存储器模块与存储器控制器之间的距离。

3. 发明申请

US20110047524A1 SYSTEM AND METHOD FOR INSPECTING LAYOUT OF A PRINTED CIRCUIT BOARD 失效
标题翻译：用于检查印刷电路板布局的系统和方法
公开(公告)号：US20110047524A1
公开(公告)日：2011-02-24
申请号：US12701677
申请日：2010-02-08
申请人： HSIEN-CHUAN LIANG , SHEN-CHUN LI , CHUN-JEN CHEN , SHOU-KUO HSU , DUEN-YI HO , YUNG-CHIEH CHEN
发明人： HSIEN-CHUAN LIANG , SHEN-CHUN LI , CHUN-JEN CHEN , SHOU-KUO HSU , DUEN-YI HO , YUNG-CHIEH CHEN
IPC分类号： G06F17/50
CPC分类号： G06F17/5081
摘要： A system and method for inspecting layout of a printed circuit board (PCB) provides a graphical user interface (GUI). The GUI displays a layout of the PCB. High side pins of a pulse width modulation (PWM) controller and a component connected to a high side pin are found. If the component is a metallic oxide semiconductor field effect transistor (MOSFET), the system calculate absolute a linear distance and a trace distance between a source pin of the MOSFET and a capacitor pin of a coupling capacitor connected to the source pin. If the linear distance, the trace distance and a capacitance of the coupling capacitor accord with a layout standard, the layout of the PCB is determined to be up to standard.
摘要翻译：用于检查印刷电路板（PCB）的布局的系统和方法提供图形用户界面（GUI）。 GUI显示PCB的布局。发现脉冲宽度调制（PWM）控制器的高端引脚和连接到高端引脚的元件。如果组件是金属氧化物半导体场效应晶体管（MOSFET），则该系统计算绝缘线性距离和MOSFET的源极引脚与连接到源极引脚的耦合电容的电容引脚之间的走线距离。如果线性距离，迹线距离和耦合电容的电容符合布局标准，则PCB的布局被确定为达到标准。

4. 发明申请

US20130039025A1 PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板
公开(公告)号：US20130039025A1
公开(公告)日：2013-02-14
申请号：US13212179
申请日：2011-08-18
申请人： YUNG-CHIEH CHEN , DUEN-YI HO , SHOU-KUO HSU
发明人： YUNG-CHIEH CHEN , DUEN-YI HO , SHOU-KUO HSU
IPC分类号： H05K1/18
CPC分类号： H05K1/0295 , H05K1/0231 , H05K1/0243 , H05K1/111 , H05K2201/10189
摘要： A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors.
摘要翻译：印刷电路板包括第一至第五连接器焊盘，第一至第八耦合电容器焊盘，第一至第十传输线，第一通孔和第二通孔，第一至第四共享焊盘和电压转换电路。印刷电路板可操作以选择性地支持不同类型的连接器。

5. 发明申请

US20120152602A1 PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板
公开(公告)号：US20120152602A1
公开(公告)日：2012-06-21
申请号：US12981480
申请日：2010-12-30
申请人： YUNG-CHIEH CHEN , YU-CHANG PAI , DUEN-YI HO , SHOU-KUO HSU
发明人： YUNG-CHIEH CHEN , YU-CHANG PAI , DUEN-YI HO , SHOU-KUO HSU
IPC分类号： H05K1/18
CPC分类号： H05K1/141 , H05K1/117 , H05K2201/09145 , H05K2201/10159 , H05K2201/10189
摘要： A printed circuit board (PCB) includes a top layer, a memory controller, a gap, and a connector. The memory controller is located on the top layer. A number of first golden fingers are set on the top layer near the gap and electrically connected to the memory controller. A connector includes a first slot to hold the first golden fingers and a second slot to hold a number of second golden fingers of a memory chip. The first slot is electrically connected to the second slot. The memory chip and the PCB are coplanar.
摘要翻译：印刷电路板（PCB）包括顶层，存储器控制器，间隙和连接器。内存控制器位于顶层。在间隙附近的顶层设置有多个第一金手指，并且电连接到存储器控制器。连接器包括用于保持第一金手指的第一槽和用于保持存储芯片的多个第二金手指的第二槽。第一槽电连接到第二槽。存储芯片和PCB是共面的。

6. 发明申请

US20120125679A1 PRINTED CIRCUIT BOARD HAVING DIFFERENTIAL VIAS 审中-公开
标题翻译：印刷电路板有差异的VIAS
公开(公告)号：US20120125679A1
公开(公告)日：2012-05-24
申请号：US13032653
申请日：2011-02-23
申请人： YUNG-CHIEH CHEN , CHENG-HSIEN LEE , PO-CHUAN HSIEH , SHOU-KUO HSU , SHIN-TING YEN
发明人： YUNG-CHIEH CHEN , CHENG-HSIEN LEE , PO-CHUAN HSIEH , SHOU-KUO HSU , SHIN-TING YEN
IPC分类号： H05K1/11
CPC分类号： H05K1/0251 , H05K1/0245 , H05K1/116
摘要： A printed circuit board includes an insulating board, a pair of differential vias, and a number of wiring layers. A pair of via holes extends through opposite surfaces of the insulating board. The differential vias correspond to the pair of via holes. Each differential via includes a metal plated barrel and two via capture pads. The plated barrel is plated on the inner surface of the respective via hole, and terminates at each of the two opposite surfaces of the insulating board. The via capture pads are formed on the opposite surfaces of the insulating board around the openings of the via hole, and are electrically connected to the plated barrel. The wiring layers are arranged in the insulating board, and each define a clearance hole surrounding all of the via capture pads.
摘要翻译：印刷电路板包括绝缘板，一对差动通孔和多个布线层。一对通孔延伸穿过绝缘板的相对表面。差分过孔对应于一对通孔。每个差分通孔包括一个金属电镀桶和两个通孔捕获垫。电镀桶被镀在相应通孔的内表面上，并且终止于绝缘板的两个相对表面的每一个。通孔捕获垫形成在绝缘板的围绕通孔的开口的相对表面上，并且电连接到电镀桶。布线层布置在绝缘板中，并且每个限定围绕所有通孔捕获垫的间隙孔。

7. 发明申请

US20120145448A1 PRINTED CIRCUIT BOARD WITH COMPOUND VIA 失效
标题翻译：印刷电路板与化合物通过
公开(公告)号：US20120145448A1
公开(公告)日：2012-06-14
申请号：US13031617
申请日：2011-02-22
申请人： YUNG-CHIEH CHEN , CHENG-HSIEN LEE , PO-CHUAN HSIEH , SHOU-KUO HSU , SHIN-TING YEN , DAN-CHEN WU , JIA-CHI CHEN
发明人： YUNG-CHIEH CHEN , CHENG-HSIEN LEE , PO-CHUAN HSIEH , SHOU-KUO HSU , SHIN-TING YEN , DAN-CHEN WU , JIA-CHI CHEN
IPC分类号： H05K1/11
CPC分类号： H05K1/0251 , H05K1/0225 , H05K1/0295 , H05K1/0298 , H05K1/113
摘要： A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.
摘要翻译：具有复合通孔的印刷电路板（PCB）包括基板和穿过基板的一对通孔。衬底包括作为衬底的顶层的信号层，与信号层相邻的第一参考层和不与信号层相邻的第二参考层。第一和第二对焊盘安装在信号层上。每个通孔延伸穿过第一对垫，使得通孔和第一对垫共同形成复合通孔。第一保留开口形成在第一参考层上，并且对应于第一和第二对焊盘和复合通孔。第二保留开口形成在第二参考层上并围绕其上的通孔。

8. 发明申请

US20120066655A1 ELECTRONIC DEVICE AND METHOD FOR INSPECTING ELECTRICAL RULES OF CIRCUIT BOARDS 失效
标题翻译：电子设备和检查电路板电气规格的方法
公开(公告)号：US20120066655A1
公开(公告)日：2012-03-15
申请号：US12965938
申请日：2010-12-13
申请人： YUNG-CHIEH CHEN , HSIEN-CHUAN LIANG , SHIN-TING YEN , SHEN-CHUN LI , SHOU-KUO HSU
发明人： YUNG-CHIEH CHEN , HSIEN-CHUAN LIANG , SHIN-TING YEN , SHEN-CHUN LI , SHOU-KUO HSU
IPC分类号： G06F17/50
CPC分类号： G06F17/5081
摘要： An electronic device and method for inspecting electrical rules of circuit boards includes selecting at least two design files that record electrical rules of the circuit boards and searching the electrical rules in the selected design files using preset parameter keywords. Same electrical rules of the selected design files are acquired by comparing the electrical rules in the selected design files. The same electrical rules and corresponding parameter values are input to a comparison table, and the comparison table is output.
摘要翻译：用于检查电路板的电气规则的电子设备和方法包括：选择记录电路板的电气规则的至少两个设计文件，并使用预设的参数关键词搜索所选择的设计文件中的电气规则。通过比较所选设计文件中的电气规则，可以获得所选设计文件的相同电气规则。将相同的电气规则和相应的参数值输入到比较表中，并输出比较表。

9. 发明申请

US20110235956A1 BEARING 失效
标题翻译：轴承
公开(公告)号：US20110235956A1
公开(公告)日：2011-09-29
申请号：US12822311
申请日：2010-06-24
申请人： SHEN-CHUN LI , SHOU-KUO HSU , YUNG-CHIEH CHEN , HSIEN-CHUAN LIANG , SHIN-TING YEN , HUNG CHAO
发明人： SHEN-CHUN LI , SHOU-KUO HSU , YUNG-CHIEH CHEN , HSIEN-CHUAN LIANG , SHIN-TING YEN , HUNG CHAO
IPC分类号： F16C32/04
CPC分类号： F16C32/0414
摘要： A bearing includes a main body, a plurality of first magnetic members, a plurality of second magnetic members, and a plurality of friction members. The main body defines a pivot hole, and a plurality of first receiving portions and a plurality of second receiving portions around the pivot hole. Each of the second receiving portions defines a cutout. The first magnetic members are received in the first receiving portions. The second magnetic members together with the friction members are received in the second receiving portions, thus generating a repelling force between the first magnetic members and the second magnetic members to impel the friction members to partially extend out of the cutouts.
摘要翻译：轴承包括主体，多个第一磁性构件，多个第二磁性构件和多个摩擦构件。主体限定枢轴孔，以及围绕枢轴孔的多个第一容纳部和多个第二容纳部。每个第二接收部分限定切口。第一磁性构件被容纳在第一接收部分中。第二磁性构件与摩擦构件一起被容纳在第二容纳部分中，从而在第一磁性构件和第二磁性构件之间产生排斥力，以推动摩擦构件部分延伸出切口。

10. 发明申请

US20120304145A1 ELECTRONIC DEVICE AND WIRING METHOD FOR CIRCUIT BOARDS 审中-公开
标题翻译：电子设备和电路板布线方法
公开(公告)号：US20120304145A1
公开(公告)日：2012-11-29
申请号：US13434858
申请日：2012-03-30
申请人： YUNG-CHIEH CHEN , SHOU-KUO HSU , SHIN-TING YEN
发明人： YUNG-CHIEH CHEN , SHOU-KUO HSU , SHIN-TING YEN
IPC分类号： G06F17/50
CPC分类号： G06F17/5077
摘要： An electronic device includes a wiring unit. The wiring unit creates one or more circuit diagrams for a design of a first circuit board, and setting electrical rules for components of the first circuit board in each of the one or more diagrams. Based on the one or more diagrams having the electrical rules, the wiring unit generates a wiring diagram for the design of the first circuit board by executing a wiring application. If a second circuit board desires to use a circuit diagram of the first circuit board, the wiring unit copies the circuit diagram having the electrical rules into the wiring application. Then, based on the copied circuit diagram having the electrical rules and particular circuit diagrams of the second circuit board, and the wiring unit creates a wiring diagram for the design of the second circuit board by executing the wiring application.
摘要翻译：电子设备包括接线单元。接线单元为第一电路板的设计创建一个或多个电路图，并且在一个或多个图中的每一个中为第一电路板的部件设置电气规则。基于具有电气规则的一个或多个图，布线单元通过执行布线应用产生用于设计第一电路板的布线图。如果第二电路板希望使用第一电路板的电路图，则布线单元将具有电气规则的电路图复制到布线应用中。然后，基于具有电气规则的复制电路图和第二电路板的具体电路图，并且布线单元通过执行布线应用来创建用于第二电路板的设计的布线图。

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