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    • 1. 发明申请
    • Semiconductor laser element and process for producing the same
    • 半导体激光元件及其制造方法
    • US20030007530A1
    • 2003-01-09
    • US10179012
    • 2002-06-26
    • SHARP KABUSHIKI KAISHA
    • Hiroyuki HosobaYasuo Kan
    • H01S005/00
    • H01S5/0421H01S5/2231H01S5/2275H01S5/321H01S5/32391
    • In a semiconductor laser element, an active layer is sandwiched between first-conductivity type and second-conductivity type cladding layers, and a second-conductivity type contact layer is disposed above the second cladding layer with an intermediate bandgap layer interposed between the second cladding layer and the contact layer, the second-conductivity type contact layer having a bandgap different from a bandgap of the second-conductivity type cladding layer, the intermediate bandgap layer having an intermediate bandgap between the bandgaps of the second-conductivity type cladding layer and the second-conductivity type contact layer. The second-conductivity type contact layer has at least a first contact layer, an intermediate second contact layer and a third contact layer stacked in this order and the second contact layer has an impurity density lower than impurity densities of the first and third contact layers.
    • 在半导体激光元件中,有源层夹在第一导电型和第二导电型包覆层之间,第二导电型接触层设置在第二覆层的上方,中间带隙层介于第二覆层 所述接触层,所述第二导电型接触层具有与所述第二导电型包覆层的带隙不同的带隙,所述中间带隙层在所述第二导电型包覆层的带隙与所述第二导电型包覆层的带隙之间具有中间带隙 导电型接触层。 第二导电型接触层具有至少第一接触层,中间第二接触层和第三接触层,并且第二接触层的杂质密度低于第一和第三接触层的杂质浓度。