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1. 发明授权

US08655472B2 Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatus 有权
标题翻译：调度器，基板处理装置以及在基板处理装置中传送基板的方法
公开(公告)号：US08655472B2
公开(公告)日：2014-02-18
申请号：US13004208
申请日：2011-01-11
申请人： Ryuya Koizumi , Kunio Oishi , Yoichi Kobayashi
发明人： Ryuya Koizumi , Kunio Oishi , Yoichi Kobayashi
IPC分类号： G06F19/00 , G06Q10/06
CPC分类号： G06Q10/06 , G05B19/41865 , G05B2219/45031 , H01L21/67253 , H01L21/67276 , Y02P90/20
摘要： A scheduler generates not only normal substrate transferring schedules for substrates newly supplied to a substrate processing apparatus, but also substrate transferring schedules for keeping a high production quantity in the event of a failure. The scheduler is used in a substrate processing apparatus including a plurality of substrate processing sections for processing substrates, a transfer device for transferring the substrates, and a controller for controlling the substrate processing units to process the substrates and controlling the transfer device to transfer the substrates. The scheduler is incorporated in the controller for calculating a substrate transferring schedule and has a function to successively calculate substrate transferring schedules for substrates which are newly supplied to the substrate processing apparatus, and, in the event of a fault occurring in the substrate processing apparatus, to recalculate the substrate transferring schedules with an initial state represented by a state including the fault.
摘要翻译：调度器不仅产生新提供给基板处理装置的基板的正常的基板转印时间表，而且生成在发生故障的情况下保持高生产量的基板转印时间表。调度器用于包括用于处理衬底的多个衬底处理部分，用于转移衬底的转移装置和用于控制衬底处理单元以处理衬底并控制转移装置以转移衬底的衬底处理装置。调度器被结合在控制器中用于计算衬底传送时间表，并且具有连续地计算新提供给衬底处理设备的衬底的衬底传送时间表的功能，并且在衬底处理设备中发生故障的情况下，重新计算由包括故障的状态表示的初始状态的基板传送调度。

2. 发明申请

US20120044308A1 RECORDING APPARATUS 有权
标题翻译：录音设备
公开(公告)号：US20120044308A1
公开(公告)日：2012-02-23
申请号：US13198098
申请日：2011-08-04
申请人： Yoichi Kobayashi
发明人： Yoichi Kobayashi
IPC分类号： B41J2/01
CPC分类号： B41J2/1721 , B41J11/0065 , B41J11/0085 , B41J11/06 , B41J2002/1742
摘要： A recording apparatus includes a recording head that ejects a liquid thereby performing recording on a recording medium, and a support member disposed so as to oppose the recording head. The support member includes a deposit recess located at a position corresponding to the respective end portion of the recording medium in the width direction intersecting with the transport direction, for receiving the liquid ejected to a region deviated from the recording medium in a marginless recording process, and a support region provided upstream of the deposit recess in the transport direction so as to support a back surface of the recording medium, and most upstream nozzles in the transport direction are not used in the marginless recording process.
摘要翻译：记录装置包括：喷射液体，从而在记录介质上进行记录的记录头;以及与记录头相对设置的支撑件。支撑构件包括位于与传送方向相交的宽度方向上与记录介质的相应端部相对应的位置的沉积凹槽，用于在无间隙记录过程中接收喷射到与记录介质偏离的区域中的液体，以及支撑区域，其设置在输送方向上的沉积凹槽的上游，以支撑记录介质的后表面，并且在无边缘记录处理中不使用传送方向上的大多数上游喷嘴。

3. 发明授权

US08112169B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US08112169B2
公开(公告)日：2012-02-07
申请号：US12881522
申请日：2010-09-14
申请人： Yoichi Kobayashi , Yasumasa Hiroo , Tsuyoshi Ohashi
发明人： Yoichi Kobayashi , Yasumasa Hiroo , Tsuyoshi Ohashi
IPC分类号： G05B13/02 , G06F19/00 , B24B49/00 , B24B51/00
CPC分类号： B24B37/005 , B24B49/10
摘要： A polishing apparatus has a polishing table having a polishing surface and a top ring for pressing a substrate against the polishing surface while independently controlling pressing forces applied to a plurality of areas on the substrate. The polishing apparatus has a sensor for monitoring substrate conditions of a plurality of measurement points on the substrate, a monitor unit for performing a predetermined arithmetic process on a signal from the sensor to generate a monitor signal, and a controller for comparing the monitor signal of the measurement points with the reference signal and controlling the pressing forces of the top ring so that the monitor signal of the measurement point converges on the reference signal.
摘要翻译：抛光装置具有抛光台，其具有抛光表面和用于将衬底压靠在抛光表面上的顶环，同时独立地控制施加到衬底上的多个区域的按压力。抛光装置具有用于监测基板上的多个测量点的基板状况的传感器，用于对来自传感器的信号执行预定的运算处理以产生监视信号的监视单元，以及用于将监视信号测量点与参考信号，并控制顶环的按压力，使测量点的监视信号收敛于参考信号。

4. 发明授权

US07780503B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US07780503B2
公开(公告)日：2010-08-24
申请号：US12292453
申请日：2008-11-19
申请人： Shinrou Ohta , Noburu Shimizu , Yoichi Kobayashi
发明人： Shinrou Ohta , Noburu Shimizu , Yoichi Kobayashi
IPC分类号： B24B49/00
CPC分类号： B24B37/005 , B24B49/12 , B24B49/16 , H01L21/3212 , H01L22/12 , H01L22/26
摘要： A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus includes: a polishing table having a polishing surface; a top ring for holding a workpiece having a surface conductive film, and pressing the conductive film against the polishing surface to polish the conductive film; an optical sensor for monitoring the polishing state of the conductive film by emitting light toward the conductive film of the workpiece held by the top ring, receiving reflected light from the conductive film, and measuring a change in the reflectance of the reflected light; and a control section for controlling a pressure at which the workpiece is pressed on the polishing surface.
摘要翻译：抛光装置可以抛光和除去额外的导电膜，同时防止腐蚀的发生而不降低生产量。抛光装置包括：具有抛光表面的抛光台; 用于保持具有表面导电膜的工件的顶环，并且将导电膜压靠在抛光表面上以抛光导电膜; 光传感器，用于通过向由顶环保持的工件的导电膜发射光，接收来自导电膜的反射光并测量反射光的反射率的变化来监测导电膜的抛光状态; 以及控制部，用于控制在抛光面上压入工件的压力。

5. 发明申请

US20100093260A1 Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detection apparatus, and polishing monitoring method 有权
标题翻译：用于选择用于抛光终点检测的光的波长的图的制作方法，用于选择用于抛光终点检测的光的波长的选择方法和装置，抛光终点检测方法，抛光终点检测装置和抛光监测方法
公开(公告)号：US20100093260A1
公开(公告)日：2010-04-15
申请号：US12461533
申请日：2009-08-14
申请人： Yoichi Kobayashi , Noburu Shimizu , Shinrou Ohta , Toshifumi Kimba , Masaki Kinoshita
发明人： Yoichi Kobayashi , Noburu Shimizu , Shinrou Ohta , Toshifumi Kimba , Masaki Kinoshita
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013
摘要： A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection is provided. The method includes polishing a surface of a substrate having a film by a polishing pad; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; calculating relative reflectances of the reflected light at respective wavelengths; determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the relative reflectances which vary with a polishing time; identifying a point of time when the wavelengths, indicating the local maximum point and the local minimum point, are determined; and plotting coordinates, specified by the wavelengths and the point of time corresponding to the wavelengths, onto a coordinate system having coordinate axes indicating wavelength of the light and polishing time.
摘要翻译：提供了一种制造用于选择光学抛光终点检测中的光的波长的图的方法。该方法包括通过抛光垫抛光具有膜的基板的表面; 在基板的研磨过程中将光施加到基板的表面并接收来自基板的反射光; 计算各波长的反射光的相对反射率; 确定反射光的波长，其指示随抛光时间变化的相对反射率的局部最大点和局部最小点; 识别指示表示局部最大点和局部最小点的波长的时间点; 并且将由波长相对应的波长和时间点指定的坐标绘制到具有指示光的波长和抛光时间的坐标轴的坐标系上。

6. 发明申请

US20100029177A1 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US20100029177A1
公开(公告)日：2010-02-04
申请号：US12310877
申请日：2007-09-06
申请人： Yoichi Kobayashi , Yasumasa Hiroo , Tsuyoshi Ohashi
发明人： Yoichi Kobayashi , Yasumasa Hiroo , Tsuyoshi Ohashi
IPC分类号： B24B49/04 , B24B49/10
CPC分类号： B24B37/04 , B24B37/013
摘要： The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a semiconductor wafer, to planarize the substrate. The polishing apparatus according to the present invention includes a polishing table (10) having a polishing surface, a top ring (14) configured to press the substrate against the polishing table by applying pressing forces independently to first plural zones on the substrate, a sensor (50) configured to detect a state of the film at plural measuring points, a monitoring device (53) configured to produce monitoring signals with respect to second plural zones on the substrate, respectively, a storage device configured to store plural reference signals each indicating a relationship between reference values of each monitoring signal and polishing times, and a controller configured to operate the pressing forces against the first plural zones such that the monitoring signals, corresponding respectively to the second plural zones, converge on one of the plural reference signals.
摘要翻译：抛光装置和抛光方法技术领域本发明涉及一种用于抛光半导体晶片等基板的平面化研磨装置和研磨方法。根据本发明的研磨装置包括具有研磨面的研磨台（10），顶环（14），其构造成通过对基板上的第一多个区域分别施加压力而将基板压靠在研磨台上，传感器（50），被配置为检测所述胶片在多个测量点的状态;监视装置（53），被配置为相对于所述基板上的第二多个区域产生监视信号;存储装置，被配置为存储多个参考信号，每个监测信号的参考值和抛光时间之间的关系;以及控制器，被配置为对第一多个区域施加按压力，使得分别对应于第二多个区域的监测信号在多个参考信号中的一个上收敛。

7. 发明申请

US20090096446A1 Polishing monitoring method, polishing apparatus and monitoring apparatus 有权
标题翻译：抛光监测方法，抛光装置和监测装置
公开(公告)号：US20090096446A1
公开(公告)日：2009-04-16
申请号：US12285674
申请日：2008-10-10
申请人： Taro Takahashi , Yoichi Kobayashi , Shinrou Ohta , Akihiko Ogawa
发明人： Taro Takahashi , Yoichi Kobayashi , Shinrou Ohta , Akihiko Ogawa
IPC分类号： G01B7/06
CPC分类号： G01B7/105
摘要： The present invention provides a method for monitoring a change in thickness of a conductive film brought into sliding contact with a polishing surface of a polishing pad using an eddy current sensor. The output signal of the eddy current sensor comprises two signals corresponding to a resistance component and an inductive reactance component of an impedance of an electric circuit including a coil of the eddy current sensor. The method includes acquiring the output signal of the eddy current sensor when the eddy current sensor is facing the conductive film, defining the two signals as coordinates on a coordinate system, repeating the acquiring of the output signal and the defining of the coordinates, determining a center of curvature of an arc specified by at least three sets of coordinates on the coordinate system, determining an angle of inclination of a line connecting the center of curvature and a latest one of the at least three sets of coordinates, and monitoring a change in thickness of the conductive film by monitoring a change in the angle of inclination.
摘要翻译：本发明提供一种用于使用涡流传感器监测与抛光垫的抛光表面滑动接触的导电膜的厚度变化的方法。涡电流传感器的输出信号包括对应于包括涡流传感器的线圈的电路的阻抗的电阻分量和电抗分量的两个信号。该方法包括当涡流传感器面向导电膜时获取涡流传感器的输出信号，将两个信号定义为坐标系上的坐标，重复获取输出信号和定义坐标，确定由坐标系上的至少三组坐标指定的圆弧的曲率中心，确定连接曲率中心的直线和最小三个坐标系中的最近一个的线的倾斜角度，通过监测倾斜角度的变化来确定导电膜的厚度。

8. 发明授权

US07510460B2 Substrate polishing apparatus 有权
公开(公告)号：US07510460B2
公开(公告)日：2009-03-31
申请号：US11806445
申请日：2007-05-31
申请人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
发明人： Yoichi Kobayashi , Shunsuke Nakai , Hitoshi Tsuji , Yasuo Tsukuda , Hiroki Yamauchi
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12
摘要： A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

9. 发明申请

US20070243795A1 Polishing Apparatus And Polishing Method 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20070243795A1
公开(公告)日：2007-10-18
申请号：US11596726
申请日：2005-06-20
申请人： Yoichi Kobayashi , Yasumasa Hiroo , Tsuyoshi Ohashi
发明人： Yoichi Kobayashi , Yasumasa Hiroo , Tsuyoshi Ohashi
IPC分类号： B24B51/00
CPC分类号： B24B37/005 , B24B49/10
摘要： A polishing apparatus has a polishing table (18) having a polishing surface (40) and a top ring (20) for pressing a substrate against the polishing surface (40) while independently controlling pressing forces applied to a plurality of areas (C1-C4) on the substrate. The polishing apparatus has a sensor (52) for monitoring substrate conditions of a plurality of measurement points on the substrate, a monitor unit (53) for performing a predetermined arithmetic process on a signal from the sensor (52) to generate a monitor signal, and a controller (54) for comparing the monitor signal of the measurement points with the reference signal and controlling the pressing forces of the top ring (20) so that the monitor signal of the measurement point converges on the reference signal.
摘要翻译：抛光装置具有抛光台（18），其具有研磨面（40）和用于将基板压靠在研磨面（40）上的顶环（20），同时独立地控制施加到多个区域（C1- C 4）。抛光装置具有用于监测基板上的多个测量点的基板状况的传感器（52），用于对来自传感器（52）的信号执行预定运算处理以产生监视信号的监视单元（53）以及控制器（54），用于将测量点的监视信号与参考信号进行比较，并控制顶环（20）的按压力，使得测量点的监视信号收敛于参考信号。

10. 发明申请

US20070042679A1 Substrate polishing apparatus 有权
标题翻译：基材抛光装置
公开(公告)号：US20070042679A1
公开(公告)日：2007-02-22
申请号：US10558257
申请日：2004-05-19
申请人： Kazuto Hirokawa , Yoichi Kobayashi , Shunsuke Nakai , Shinrou Ohta , Yasuo Tsukuda
发明人： Kazuto Hirokawa , Yoichi Kobayashi , Shunsuke Nakai , Shinrou Ohta , Yasuo Tsukuda
IPC分类号： B24B49/00 , B24B29/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/08 , B24B49/12 , H01L21/30625 , H01L21/31053 , H01L21/3212
摘要： A substrate polishing apparatus (10) polishes a substrate (20) to a flat mirror finish. The substrate polishing apparatus (10) has a polishing table (12) against which a substrate (20) is pressed, a light-emitting and light-receiving device (24) to emit measurement light from the polishing table (12) to the substrate (20) and to receive reflected light from the substrate (20) for measuring a film on the substrate (20), a fluid supply passage (42) for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber (68) provided at a light-emitting and light-receiving position of the polishing table (12), and a fluid supply control device (56, 58) for controlling supply of the measurement fluid to the fluid chamber (68).
摘要翻译：基板研磨装置（10）将基板（20）抛光成平面镜面。基板研磨装置（10）具有：被加压基板（20）的研磨台（12），从研磨台（12）向基板发射测定光的发光和受光装置（24）（20）接收来自基板（20）的反射光，用于测量基板（20）上的薄膜;流体供给通道（42），用于将测量光和反射光通过的测量流体通过，设置在所述研磨台（12）的发光和受光位置处的流体室（68）和用于控制向所述流体室（68）供给所述测量流体的流体供应控制装置（56,58）。

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