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1. 发明申请

US20100096169A1 Polyamide Resin as Well as Epoxy Resin Composition Using the Same and Use Thereof 审中-公开
标题翻译：聚酰胺树脂以及使用它们的环氧树脂组合物
公开(公告)号：US20100096169A1
公开(公告)日：2010-04-22
申请号：US12516971
申请日：2007-12-11
申请人： Ryutaro Tanaka , Makoto Uchida , Mitsuyo Nishitoh
发明人： Ryutaro Tanaka , Makoto Uchida , Mitsuyo Nishitoh
IPC分类号： H05K1/03 , C08L77/00 , B32B27/38
CPC分类号： B32B15/08 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/34 , B32B27/38 , B32B2270/00 , B32B2307/206 , B32B2307/306 , B32B2307/3065 , B32B2307/50 , B32B2307/546 , B32B2457/08 , C08G59/621 , C08L63/00 , C09J163/00 , H05K1/0353 , H05K3/281 , H05K3/386 , Y10T428/31529
摘要： The invention provides a phenolic hydroxyl group-containing rubber-modified polyamide resin capable of providing a cured product with excellent heat resistance, adhesion properties, electrically insulating property and flame retardance and having a sufficient flexibility when being shaped into a film, which is characterized by having in its molecule (a) a phenolic hydroxyl group-containing aromatic polyamide segment represented by the following formula (1): (in the formula (1), m and n are average values and satisfy a relationship of 0.005≦n/(m+n)≦1.00 and m+n is an integer of 2-200, and Ar1 is a bivalent aromatic group, Ar2 is a bivalent aromatic group having a phenolic hydroxyl group and Ar3 is a bivalent aromatic group) and (b) a hydrogenated butadiene polymer segment.
摘要翻译：本发明提供一种含酚羟基的橡胶改性聚酰胺树脂，其能够提供具有优异的耐热性，粘合性，电绝缘性和阻燃性的固化产物，并且当成形为膜时具有足够的柔韧性，其特征在于在其分子（a）由下式（1）表示的含酚羟基的芳族聚酰胺链段：（式（1）中，m和n是平均值，满足0.005＆nlE; n /（ m + n）＆nlE; 1.00，m + n为2〜200的整数，Ar 1为二价芳香族基团，Ar 2为具有酚性羟基的二价芳香族基团，Ar 3为二价芳香族基团），（b）氢化丁二烯聚合物链段。

2. 发明申请

US20100233476A1 Copper foil with primer resin layer and laminated sheet using the same 审中-公开
标题翻译：具有底漆树脂层的铜箔和使用其的层压片
公开(公告)号：US20100233476A1
公开(公告)日：2010-09-16
申请号：US12308308
申请日：2007-06-19
申请人： Makoto Uchida , Ryutaro Tanaka , Shigeo Hayashimoto , Shigeru Moteki , Mitsuyo Nishitoh
发明人： Makoto Uchida , Ryutaro Tanaka , Shigeo Hayashimoto , Shigeru Moteki , Mitsuyo Nishitoh
IPC分类号： B32B15/088 , C08L79/04 , C08L81/06
CPC分类号： H05K3/386 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2255/06 , B32B2255/205 , B32B2255/26 , B32B2307/306 , B32B2307/538 , B32B2307/546 , B32B2457/08 , C08G73/10 , C08G73/1046 , C08G73/1064 , C08G73/1067 , C08G73/1082 , C09D5/002 , C09D179/08 , C09J179/08 , H05K1/0393 , H05K2201/0154 , H05K2201/0358 , Y10T428/2804
摘要： The present invention relates to a copper foil having a primer resin layer which improves the adhesive strength between a copper foil surface without roughening treatment and a substrate resin and a laminated sheet using the same and is characterized by using a polyimide represented by the following formula (1): (wherein, R1 represents a quadrivalent aromatic group which is a residual group of a dicarboxylic acid dianhydride ingredient (pyromellitic acid anhydride, 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, 3,3′,4,4′-benzophenontetracarboxylic acid dianhydride or 2,3,6,7-naphthalenetetracarboxylic acid dianhydride), R2 represents a divalent aromatic group which is a residual group of a diamine ingredient (1,3-bis-(3-aminophenoxy)benzene, 3,3′-diamino-4,4′-dihydroxydiphenylsulfone or/and 4,4′-diamino-3,3′,5,5′-tetraethyldiphenylmethane), and n1 represents a repeating number) as a primer resin; and copper foils and laminated sheets having said polyimide layer as a primer have high adhesive strength and are suitable for flexible printed wiring boards.
摘要翻译：本发明涉及一种具有底漆树脂层的铜箔，该底漆树脂层提高了不进行粗糙化处理的铜箔表面与基材树脂之间的粘合强度，使用该底漆树脂层和使用其的层叠片材，其特征在于，使用下述式 1）:(式中，R 1表示作为二羧酸二酐成分的残留基的四价芳香族基团（均苯四酸酐，3,3'，4,4'-联苯四羧酸二酐，3,3'，4,4 二苯甲酮酸二酐或2,3,6,7-萘四羧酸二酐），R2表示作为二胺成分（1,3-双 - （3-氨基苯氧基）苯，3,3-双（3-氨基苯氧基）苯的残基的二价芳香族基团， 3'-二氨基-4,4'-二羟基二苯基砜或/和4,4'-二氨基-3,3'，5,5'-四乙基二苯基甲烷），n1表示重复数）作为底漆树脂; 并且具有所述聚酰亚胺层作为底漆的铜箔和层压片具有高粘合强度并且适用于柔性印刷线路板。

3. 发明申请

US20100129604A1 COPPER FOIL WITH RESIN LAYER 审中-公开
标题翻译：铜箔与树脂层
公开(公告)号：US20100129604A1
公开(公告)日：2010-05-27
申请号：US12451359
申请日：2008-05-13
申请人： Makoto Uchida , Ryutaro Tanaka , Shigeo Hayashimoto
发明人： Makoto Uchida , Ryutaro Tanaka , Shigeo Hayashimoto
IPC分类号： B32B15/088 , B32B15/092 , B32B3/10
CPC分类号： H05K1/0346 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/281 , B32B27/34 , B32B27/38 , B32B2262/101 , B32B2264/10 , B32B2264/102 , B32B2264/104 , B32B2307/202 , B32B2307/208 , B32B2307/21 , B32B2307/306 , B32B2307/3065 , B32B2307/718 , B32B2457/08 , C08G69/32 , C09D177/10 , H05K3/384 , H05K2201/0358 , Y10T428/24355 , Y10T428/31529 , Y10T428/31681
摘要： An object of the present invention is to provide a copper foil with a resin layer to be used as a resin substrate for a flexible printed wiring board and having good adhesiveness between the copper foil, to which no roughening treatment is applied, and a raw material resin layer.A copper foil with a resin layer characterized in that a copper foil having no roughening treatment applied thereto is directly joined to a resin layer, which contains a phenolic hydroxyl group-containing aromatic polyamide resin having a structure represented by the following formula (1): in the formula (1), m and n denote average values and satisfy the relationship: 0.005≦n/(m+n)
摘要翻译：本发明的目的是提供一种铜箔，其具有用作柔性印刷线路板的树脂基板的树脂层，并且在不进行粗糙化处理的铜箔和原料之间具有良好的粘附性树脂层。一种具有树脂层的铜箔，其特征在于将不进行粗糙化处理的铜箔直接接合到树脂层上，所述树脂层含有具有由下式（1）表示的结构的含酚羟基的芳族聚酰胺树脂：在式（1）中，m和n表示平均值，满足关系式：0.005＆nlE; n /（m + n）<0.05，m + n为2〜200; Ar1是二价芳族基团; Ar 2是具有酚性羟基的二价芳香族基团，Ar 3是二价芳香族基团。

4. 发明申请

US20100207282A1 PRIMER RESIN FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 失效
标题翻译：用于半导体器件和半导体器件的PRIMER树脂
公开(公告)号：US20100207282A1
公开(公告)日：2010-08-19
申请号：US12733635
申请日：2008-09-18
申请人： Makoto Uchida , Shigeru Moteki , Ryutaro Tanaka , Hiromi Morita
发明人： Makoto Uchida , Shigeru Moteki , Ryutaro Tanaka , Hiromi Morita
IPC分类号： H01L23/29 , C08L33/24 , C08L63/00 , H01L21/56
CPC分类号： C08L79/08 , C08G73/10 , C08G73/1046 , C08G73/106 , C08L63/00 , C08L2666/22 , C09J5/02 , C09J163/00 , C09J179/08 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, R1 represents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3′,4′-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3′,4′-benzophenone tetracarboxylic acid, R2 represents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4′-hydroxydiphenylsulfone, 4,4′-diamino-3,3′5,5′-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor device has an extremely improved adhesiveness between said lead frame and a cured product of a sealing resin composition and also is excellent in heat resistance and low moisture absorption.
摘要翻译：本发明涉及一种半导体器件用底漆树脂，其包含下述式（1）表示的聚酰胺树脂：（其中，R1表示选自均苯四酸，3,4，...的四价芳香族四羧酸残基 '，4'-二苯基醚四羧酸，2,3,6,7-萘四甲酸和3,4,3'，4'-二苯甲酮四羧酸，R2表示选自以下的至少一种二价二胺残基：的二氨基-4,4'-羟基二苯基砜，4,4'-二氨基-3,3'5,5'-四乙基二苯基甲烷和1,3-双 - （氨基苯氧基）苯，n为重复数，表示正数 10至1000），并具有包括铜或42合金的引线框架，在包括铜或42合金的引线框架和密封树脂的固化产物之间具有所述底漆树脂层的半导体器件和含有说底线树脂; 并且所述半导体器件在所述引线框与密封树脂组合物的固化产物之间具有非常改善的粘合性，并且还具有优异的耐热性和低吸湿性。

5. 发明申请

US20100035182A1 PHOTOSENSITIVE RESIN COMPOSITION 审中-公开
标题翻译：感光树脂组合物
公开(公告)号：US20100035182A1
公开(公告)日：2010-02-11
申请号：US12450319
申请日：2008-04-07
申请人： Ryutaro Tanaka , Makoto Uchida , Kenji Sekine
发明人： Ryutaro Tanaka , Makoto Uchida , Kenji Sekine
IPC分类号： G03F7/004
CPC分类号： G03F7/0233 , C08G73/1039 , C08G73/1042 , C08G73/1046 , C08G73/1064 , C08G73/1067 , C08G73/1071 , C08K5/235 , C08L63/00 , C08L79/08 , H05K2201/0154 , H05K2203/065 , C08L2666/20 , C08L2666/22
摘要： The present invention relates to a positive type photosensitive polyimide resin composition comprising a phenolic hydroxy group-containing soluble polyimide resin (A) formed from a tetrabasic acid dianhydride (a), an aminophenol compound having at least two amino groups and at least one phenolic hydroxy group in one molecule (b), and a diamino compound (c); a diazo-based positive type photosensitizer (B); and an epoxy resin (C). Using the positive type photosensitive polyimide resin composition of the present invention, a resin composition which allows easy patterning, satisfies various properties such as flame retardancy, heat resistance, mechanical properties and flexibility, and is capable of coping with high functionalization of various electronic devices, and a cured product thereof can be provided.
摘要翻译：本发明涉及一种正型感光性聚酰亚胺树脂组合物，其包含由四元酸二酐（a）形成的含酚羟基的可溶性聚酰亚胺树脂（A），具有至少两个氨基的氨基苯酚化合物和至少一种酚羟基在一个分子（b）中的基团和二氨基化合物（c）; 重氮基正型光敏剂（B）; 和环氧树脂（C）。使用本发明的正型感光性聚酰亚胺树脂组合物，能够容易地进行图案化的树脂组合物满足阻燃性，耐热性，机械性能，柔软性等各种性能，能够应对各种电子器件的高功能化，并且可以提供其固化产物。

6. 发明申请

US20120288725A1 Heat-Resistant Adhesive 审中-公开
标题翻译：耐热粘合剂
公开(公告)号：US20120288725A1
公开(公告)日：2012-11-15
申请号：US13575614
申请日：2011-03-10
申请人： Ryutaro Tanaka , Makoto Uchida , Shigeru Moteki , Yasumasa Akatsuka
发明人： Ryutaro Tanaka , Makoto Uchida , Shigeru Moteki , Yasumasa Akatsuka
IPC分类号： C09J177/00 , B32B15/08
CPC分类号： B32B15/01 , C08G69/265 , C08G69/32 , C08K3/013 , C08K3/28 , C08K3/38 , C08L63/00 , C08L77/10 , C08L2666/22 , C09D177/06 , C09D177/10 , C09J163/00 , C09J177/06 , C09J177/10 , H01L2924/0002 , Y10T428/31681 , H01L2924/00
摘要： Disclosed is a heat-resistant adhesive including: a phenolic hydroxy group-containing aromatic polyamide resin (A) having a structure represented by the following formula (1) (in the formula, m and n each represent an average and satisfy the relation: 0.005≦n/(m+n)
摘要翻译：公开了一种耐热粘合剂，其包括：具有由下式（1）表示的结构的酚羟基的芳族聚酰胺树脂（A）（式中，m和n各自表示平均值，满足关系式：0.005 ＆nlE; n /（m + n）<1，m + n是大于0但等于或小于200的整数，Ar 1表示二价芳族基团，Ar 2表示具有酚羟基的二价芳基，Ar 3表示二价芳香族基团），环氧树脂（B），固化催化剂（C），无机填料（D），以及作为任意成分的成分（A）以外的环氧树脂固化剂，其中组分（D）的含量相对于组分（A）至（C）和环氧树脂固化剂的总量相对于100质量份为任意成分为30〜950质量份。当电路等和散热板彼此粘合时，粘合剂的固化层不仅具有高耐热性和高粘合性，而且具有高导热性，并且还具有高导热性绝佳的保温性能。此外，固化的粘合剂是阻燃剂，因此粘合剂作为高功能半导体周边材料是非常有用的。

7. 发明授权

US08410620B2 Primer resin for semiconductor device and semiconductor device 失效
标题翻译：用于半导体器件和半导体器件的底漆树脂
公开(公告)号：US08410620B2
公开(公告)日：2013-04-02
申请号：US12733635
申请日：2008-09-18
申请人： Makoto Uchida , Shigeru Moteki , Ryutaro Tanaka , Hiromi Morita
发明人： Makoto Uchida , Shigeru Moteki , Ryutaro Tanaka , Hiromi Morita
IPC分类号： H01L23/29
CPC分类号： C08L79/08 , C08G73/10 , C08G73/1046 , C08G73/106 , C08L63/00 , C08L2666/22 , C09J5/02 , C09J163/00 , C09J179/08 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, R1 represents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3′,4′-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3′,4′-benzophenone tetracarboxylic acid, R2 represents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4′-hydroxydiphenylsulfone, 4,4′-diamino-3,3′5,5′-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor device has an extremely improved adhesiveness between said lead frame and a cured product of a sealing resin composition and also is excellent in heat resistance and low moisture absorption.
摘要翻译：本发明涉及一种半导体器件用底漆树脂，其包含下述式（1）表示的聚酰胺树脂：（其中，R1表示选自均苯四酸，3,4，...的四价芳香族四羧酸残基 '，4'-二苯基醚四羧酸，2,3,6,7-萘四甲酸和3,4,3'，4'-二苯甲酮四羧酸，R2表示选自以下的至少一种二价二胺残基：的二氨基-4,4'-羟基二苯基砜，4,4'-二氨基-3,3'5,5'-四乙基二苯基甲烷和1,3-双 - （氨基苯氧基）苯，n为重复数，表示正数 10至1000），并具有包括铜或42合金的引线框架，在包括铜或42合金的引线框架和密封树脂的固化产物之间具有所述底漆树脂层的半导体器件和含有说底线树脂; 并且所述半导体器件在所述引线框与密封树脂组合物的固化产物之间具有非常改善的粘合性，并且还具有优异的耐热性和低吸湿性。

8. 发明授权

US08080319B2 Thermosetting resin composition and use thereof 有权
标题翻译：热固性树脂组合物及其用途
公开(公告)号：US08080319B2
公开(公告)日：2011-12-20
申请号：US12083588
申请日：2006-10-18
申请人： Ryutaro Tanaka , Makoto Uchida , Hiroo Koyanagi
发明人： Ryutaro Tanaka , Makoto Uchida , Hiroo Koyanagi
IPC分类号： B32B27/38 , C08G69/26 , C08L63/00
CPC分类号： C08L63/00 , C08G59/4042 , C08G73/1039 , C08G73/1046 , C08G73/1064 , C08J5/24 , C08J2363/00 , C08J2379/08 , C08L79/08 , Y10T428/31511 , Y10T428/31529 , Y10T428/31721 , C08L2666/20 , C08L2666/22
摘要： Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.
摘要翻译：本发明涉及一种热固性树脂组合物，其包含具有酚羟基的聚酰亚胺树脂（A），优选由氨基苯酚（a），二氨基化合物（b）和四元酸二酐（c）制备的聚酰亚胺树脂（A））和环氧树脂（B）; 及其固化物。树脂组合物的保存稳定性优异，得到阻燃性和耐热性优异的固化物。此外，当固化产物为薄膜形式时，产品具有足够的柔韧性和优异的耐折性。

9. 发明申请

US20090286087A1 Thermosetting Resin Composition and Use thereof 有权
标题翻译：热固性树脂组合物及其用途
公开(公告)号：US20090286087A1
公开(公告)日：2009-11-19
申请号：US12083588
申请日：2006-10-18
申请人： Ryutaro Tanaka , Makoto Uchida , Hiroo Koyanagi
发明人： Ryutaro Tanaka , Makoto Uchida , Hiroo Koyanagi
IPC分类号： B32B27/38 , C08L79/08 , C08L63/00 , B32B27/08
CPC分类号： C08L63/00 , C08G59/4042 , C08G73/1039 , C08G73/1046 , C08G73/1064 , C08J5/24 , C08J2363/00 , C08J2379/08 , C08L79/08 , Y10T428/31511 , Y10T428/31529 , Y10T428/31721 , C08L2666/20 , C08L2666/22
摘要： Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.
摘要翻译：本发明涉及一种热固性树脂组合物，其包含具有酚羟基的聚酰亚胺树脂（A），优选由氨基苯酚（a），二氨基化合物（b）和四元酸二酐（c）制备的聚酰亚胺树脂（A））和环氧树脂（B）; 及其固化物。树脂组合物的保存稳定性优异，得到阻燃性和耐热性优异的固化物。此外，当固化产物为薄膜形式时，产品具有足够的柔韧性和优异的耐折性。

10. 发明申请

US20090202793A1 Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin and Photosensitive Resin Composition Containing the same 审中-公开
标题翻译：感光性水溶性碱性溶液可溶性聚酰亚胺树脂和含有它的感光性树脂组合物
公开(公告)号：US20090202793A1
公开(公告)日：2009-08-13
申请号：US12309059
申请日：2007-07-09
申请人： Ryutaro Tanaka , Makoto Uchida
发明人： Ryutaro Tanaka , Makoto Uchida
IPC分类号： B32B3/10 , C08G73/10 , G03F7/004 , G03F7/039
CPC分类号： G03F7/0387 , C08G59/182 , C08G73/101 , C08G73/1021 , C08G73/1025 , G03F7/0233 , H05K3/287 , Y10T428/24802
摘要： The present invention relates to a photosensitive, aqueous alkaline solution-soluble polyimide resin (A) obtained by reacting a polyimide resin (a) which can be obtained by a tetracarboxylic acid dianhydride with a diamine compound with an energy ray-curing type aqueous alkaline solution-soluble resin (b); the resin has excellent photosensitivity obtained by mixing with a photopolymerization initiator and the like; the obtained cured products can be photosensitive resin compositions excellent in flexibility, low warping property, adhesion properties, solvent resistance, acid resistance, heat resistance, gold plating resistance and the like.
摘要翻译：本发明涉及通过使能够通过四羧酸二酐得到的聚酰亚胺树脂（a）与二胺化合物与能量射线固化型碱性水溶液反应得到的感光性碱溶性水溶性聚酰亚胺树脂（A） - 可溶性树脂（b）; 该树脂通过与光聚合引发剂等混合而获得优异的光敏性; 得到的固化物可以是柔软性，低翘曲性，粘合性，耐溶剂性，耐酸性，耐热性，耐镀金性等优异的感光性树脂组合物。

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