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    • 4. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20090194808A1
    • 2009-08-06
    • US12362019
    • 2009-01-29
    • Ryota FUJITSUKAYoshio OzawaKatsuaki Natori
    • Ryota FUJITSUKAYoshio OzawaKatsuaki Natori
    • H01L29/792
    • H01L27/11568H01L27/112
    • A semiconductor device includes an element region having a channel region, and a unit gate structure inducing a channel in the channel region, the unit gate structure including a tunnel insulating film formed on the element region, a charge storage insulating film formed on the tunnel insulating film, a block insulating film formed on the charge storage insulating film, and a control gate electrode formed on the block insulating film, wherein a distance between the element region and the control gate electrode is shorter at a center portion of the unit gate structure than at both ends thereof, as viewed in a section parallel to a channel width direction.
    • 半导体器件包括具有沟道区域的元件区域和在沟道区域中引起沟道的单元栅极结构,所述单元栅极结构包括形成在元件区域上的隧道绝缘膜,形成在隧道绝缘层上的电荷存储绝缘膜 形成在电荷存储绝缘膜上的块绝缘膜和形成在块绝缘膜上的控制栅极电极,其中元件区域和控制栅电极之间的距离在单元栅极结构的中心部分较短 在与通道宽度方向平行的部分中看到的两端。
    • 6. 发明申请
    • NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
    • 非易失性存储器件及其制造方法
    • US20110175048A1
    • 2011-07-21
    • US13004287
    • 2011-01-11
    • Katsuyuki SEKINERyota FUJITSUKAYoshio OZAWA
    • Katsuyuki SEKINERyota FUJITSUKAYoshio OZAWA
    • H01L45/00H01L21/02
    • H01L45/1273H01L27/2409H01L27/2481H01L45/08H01L45/1226H01L45/1233H01L45/146H01L45/16
    • According to one embodiment, a nonvolatile memory device includes first and second conductive layers, a resistance change layer, and a rectifying element. The first conductive layer has first and second major surfaces. The second conductive layer has third and fourth major surfaces, a side face, and a corner part. The third major surface faces the first major surface and includes a plane parallel to the first major face and is provided between the fourth and first major surfaces. The corner part is provided between the third major surface and the side face. The corner part has a curvature higher than that of the third major surface. The resistance change layer is provided between the first and second conductive layers. The rectifying element faces the second major surface of the first conductive layer. An area of the third major surface is smaller than that the second major surface.
    • 根据一个实施例,非易失性存储器件包括第一和第二导电层,电阻变化层和整流元件。 第一导电层具有第一和第二主表面。 第二导电层具有第三和第四主表面,侧面和拐角部分。 第三主表面面向第一主表面并且包括平行于第一主面的平面,并且设置在第四主表面和第一主表面之间。 角部设置在第三主表面和侧面之间。 角部具有高于第三主表面的曲率。 电阻变化层设置在第一和第二导电层之间。 整流元件面向第一导电层的第二主表面。 第三主表面的面积小于第二主表面的面积。