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    • 4. 发明申请
    • Hardmask Process for Forming a Reverse Tone Image
    • 形成反向色调图像的硬掩模处理
    • US20100040838A1
    • 2010-02-18
    • US12192621
    • 2008-08-15
    • David J. AbdallahRalph R. DammelMark Neisser
    • David J. AbdallahRalph R. DammelMark Neisser
    • B44C1/22B32B5/00
    • G03F7/40G03F7/0752H01L21/0273H01L21/0337H01L21/31055H01L21/31116H01L21/31138Y10T428/24802
    • The present invention relates to a process for forming an reverse tone image on a device comprising; a) forming an absorbing underlayer on a substrate; b) forming a coating of a positive photoresist over the underlayer; c) forming a photoresist pattern; d) treating the first photoresist pattern with a hardening compound, thereby forming a hardened photoresist pattern; e) forming a silicon coating over the hardened photoresist pattern from a silicon coating composition; f) dry etching the silicon coating to remove the silicon coating till the silicon coating has about the same thickness as the photoresist pattern; and, g) dry etching to remove the photoresist and the underlayer, thereby forming a trench beneath the original position of the photoresist pattern. The invention further relates to a product of the above process and to a microelectronic device made from using the above process.
    • 本发明涉及一种在装置上形成反向色调图像的方法,包括: a)在基底上形成吸收性底层; b)在底层上形成正性光致抗蚀剂的涂层; c)形成光致抗蚀剂图案; d)用硬化化合物处理第一光致抗蚀剂图案,从而形成硬化的光致抗蚀剂图案; e)从硅涂层组合物在硬化的光致抗蚀剂图案上形成硅涂层; f)干蚀刻硅涂层以去除硅涂层,直到硅涂层具有与光致抗蚀剂图案大致相同的厚度; 并且g)干蚀刻以除去光致抗蚀剂和底层,从而在光致抗蚀剂图案的原始位置下形成沟槽。 本发明还涉及上述方法的产品和使用上述方法制造的微电子器件。