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    • 1. 发明授权
    • Thermophoretic particle removing system
    • 热解颗粒去除系统
    • US06685842B2
    • 2004-02-03
    • US10039477
    • 2001-12-31
    • Ruei-Hung JangChih-Lin YingTien-Hsing WooShan-Hua WuMing-Kuo Yu
    • Ruei-Hung JangChih-Lin YingTien-Hsing WooShan-Hua WuMing-Kuo Yu
    • B01D1709
    • B01D21/009
    • A method and apparatus for carrying out a method for thermophoretically removing particles from a particulate containing liquid the method including providing a heated turbulent flowing particulate contain liquid through a first conduit; redirecting a portion of the particulate containing liquid through a second conduit to provide laminar flow having a flow direction substantially parallel to the first conduit; forming a thermal gradient in said second conduit substantially perpendicular to the flow direction; concentrating particles in the particulate containing liquid in a portion of the second conduit aided at least in part by thermophoretic forces; and, separating the particulate containing liquid into at least a relatively concentrated particle containing portion and a relatively unconcentrated particle containing portion.
    • 一种用于实施用于从含颗粒的液体中热去除颗粒的方法的方法和装置,该方法包括提供加热的紊流流动的颗粒通过第一导管容纳液体; 通过第二导管将含部分颗粒的液体重新定向以提供具有基本上平行于第一导管的流动方向的层流; 在所述第二导管中基本上垂直于所述流动方向形成热梯度; 在第二导管的一部分中将颗粒聚集在含微粒的液体中至少部分地通过热电解力来辅助; 并且将含微粒的液体分离成至少相对浓缩的含有颗粒的部分和相对不浓缩的含颗粒的部分。
    • 2. 发明授权
    • In-line fluid heater
    • 在线流体加热器
    • US06687456B1
    • 2004-02-03
    • US10196595
    • 2002-07-15
    • Tien-Hsing WooRuei-Hung JangChih-Lin YingMing-Kuo YuShih-Shiung Chen
    • Tien-Hsing WooRuei-Hung JangChih-Lin YingMing-Kuo YuShih-Shiung Chen
    • F21V700
    • H01L21/67115
    • An in-line fluid heater including a heater housing that contains a parabolic lamp vessel which houses an infrared lamp. A parabolic reflection vessel in the heater housing is separated from the parabolic lamp vessel by a convex lens. A quartz plate seals the heater housing, and at least one, and typically, multiple leak detectors may be provided in the heater housing. The interior reflective surface of the reflection vessel reflects the heat energy in parallel rays through the quartz plate and to the fluid to be heated. The leak detectors may be connected to an RC circuit which operates a controller to actuate a buzzer or alarm and terminate operation of the heater upon leakage of fluid into the heater housing.
    • 一种在线流体加热器,其包括加热器壳体,该加热器壳体包含容纳红外灯的抛物面灯管。 加热器壳体中的抛物面反射容器通过凸透镜与抛物线灯容器分离。 石英板密封加热器壳体,并且可以在加热器壳体中提供至少一个,并且通常多个泄漏检测器。 反射容器的内部反射表面将平行射线中的热能反射通过石英板和待加热的流体。 泄漏检测器可以连接到RC电路,RC电路操作控制器来致动蜂鸣器或报警器,并且在将流体泄漏到加热器壳体中时终止加热器的操作。
    • 4. 发明授权
    • Fluid leak detection via thermal sensing
    • 通过热敏感检测流体泄漏
    • US06571607B2
    • 2003-06-03
    • US09881389
    • 2001-06-13
    • Ruei-Hung JangChih-Lin YingTien-Hsing WooMing-Kuo Yu
    • Ruei-Hung JangChih-Lin YingTien-Hsing WooMing-Kuo Yu
    • G01N1700
    • G01M3/002
    • Fluid leak detection through thermal sensing is disclosed. A sensor includes one or more flexible, thermally conductive, fluid isolating layers, and a thermally sensitive detector situated within the flexible, thermally conductive, fluid isolating layers. The detector is responsive to a temperature change resulting from leaking fluid coming in contact with the sensor. The sensor may also including an affixing mechanism, such as glue, on the isolating layers, to affix the sensor to a potential fluid leak source, such as a tank or a piping line. The sensor may further include connectors located at its ends. The detector may be a thermally sensitive resistor, such as platinum or nickel, and the, fluid isolating layers may be capton.
    • 公开了通过热感测的流体泄漏检测。 传感器包括一个或多个柔性的,导热的流体隔离层,以及位于柔性导热的流体隔离层内的热敏检测器。 检测器响应于与传感器接触的泄漏流体导致的温度变化。 传感器还可以在隔离层上包括诸如胶水的固定机构,以将传感器固定到潜在的流体泄漏源,例如罐或管道。 传感器还可以包括位于其端部的连接器。 检测器可以是热敏电阻器,例如铂或镍,并且流体隔离层可以是卡顿的。
    • 5. 发明授权
    • Method for metal etchback with self aligned etching mask
    • 使用自对准蚀刻掩模的金属回蚀方法
    • US06818555B2
    • 2004-11-16
    • US10266177
    • 2002-10-07
    • How-Cheng TsaiHung-Hsin LiuChung-Daw YoungMing-Kuo Yu
    • How-Cheng TsaiHung-Hsin LiuChung-Daw YoungMing-Kuo Yu
    • H01L2144
    • H01L21/7684
    • A method for a metal etchback process to form a metal filled semiconductor feature having improved planarity and electrical resistance including a semiconductor wafer having an etched opening lined with a refractory metal containing layer and a blanket deposited metal layer filling the etched opening; spin coating a spin on layer selected from the group consisting of an organic resinous layer and a spin-on glass layer over the metal layer; dry etching in a first etchback process to remove a first portion of the SOL layer to reveal a portion of the metal layer leaving a second portion of the SOL layer overlying the etched opening; dry etching in a second etchback process to remove the metal layer to reveal a portion of the refractory metal containing layer; and, removing the second portion of the SOL layer to form a substantially planar metal filled etched opening.
    • 一种用于形成金属回蚀工艺的方法,其形成具有改善的平面度和电阻的金属填充半导体特征,该半导体特征包括半导体晶片,该半导体晶片具有衬有难熔金属含有层的蚀刻开口和填充蚀刻开口的覆盖沉积金属层; 旋转涂覆选自由金属层上的有机树脂层和旋涂玻璃层组成的组中的旋涂层; 在第一回蚀工艺中进行干蚀刻以去除SOL层的第一部分以露出金属层的一部分,留下覆盖在蚀刻开口上的SOL层的第二部分; 在第二回蚀工艺中进行干蚀刻以去除金属层以露出含难熔金属层的一部分; 并且去除SOL层的第二部分以形成基本平坦的金属填充蚀刻开口。