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1. 发明申请

US20050064743A1 Electrical testing system with electrical adapter 失效
标题翻译：带电器的电气测试系统
公开(公告)号：US20050064743A1
公开(公告)日：2005-03-24
申请号：US10994581
申请日：2004-11-22
申请人： Rudolf Hofmeister , Samantha Bench
发明人： Rudolf Hofmeister , Samantha Bench
IPC分类号： H01R20060101 , H01R9/03 , H01R12/00 , H01R12/71 , H01R13/64 , H01R25/00 , H01R27/00 , H01R27/02 , H01R31/00 , H01R33/88 , H05K1/00
CPC分类号： H01R12/716 , H01R2201/20
摘要： A system for using an electrical adapter to test an electrical device is provided. The system includes a tester, an electrical device, and the electrical adapter. The electrical adapter includes a board having first and second planar surfaces, a first electrical socket coupled to the first planar surface of the printed circuit board and a second electrical socket coupled to the second planar surface of the printed circuit board. The board includes electrical connectors electrically coupling the first and second electrical sockets to each other. The first electrical socket of the adapter is suitable for temporary connection to an electrical interface of the tester, and the second electrical socket is suitable for temporary connection to an electrical interface of the electrical device. The electrical device can be one of a plurality of electrical devices and the tester can be one of a plurality of testers.
摘要翻译：提供了一种使用电气适配器测试电气设备的系统。该系统包括测试仪，电气设备和电气适配器。电适配器包括具有第一和第二平面的板，连接到印刷电路板的第一平面的第一电插座和耦合到印刷电路板的第二平面的第二电插座。该电路板包括将第一和第二电插座彼此电耦合的电连接器。适配器的第一个电源插座适合临时连接到测试仪的电气接口，第二个电源插座适合临时连接到电气设备的电气接口。电气设备可以是多个电气设备中的一个，测试器可以是多个测试仪中的一个。

2. 发明申请

US20050025449A1 Methods and structures for testing optical subassemblies at higher and lower temperatures 审中-公开
标题翻译：在较高和较低温度下测试光学组件的方法和结构
公开(公告)号：US20050025449A1
公开(公告)日：2005-02-03
申请号：US10929944
申请日：2004-08-30
申请人： John Dirkson , James Douma , Rudolf Hofmeister , Samantha Bench , Dev Kumar
发明人： John Dirkson , James Douma , Rudolf Hofmeister , Samantha Bench , Dev Kumar
IPC分类号： G02B6/00 , H04B10/08
CPC分类号： H04B10/07
摘要： An assembly and method for testing an optical subassembly by locally heating or cooling the optical subassembly. Locally heating or cooling the optical subassembly can include using a thermal transfer assembly. The thermal transfer assembly can include a thermoelectric cooler. A clamping assembly is provided to place the optical subassembly in electrical communication with a testing assembly. The thermal transfer assembly can be associated with the clamping assembly. After achieving the desired temperature, a data stream is transmitted through the optical subassembly and evaluated for compliance.
摘要翻译：通过局部加热或冷却光学组件来测试光学组件的组件和方法。局部加热或冷却光学组件可包括使用热转印组件。热转印组件可以包括热电冷却器。提供夹紧组件以将光学子组件放置成与测试组件电连通。热转印组件可与夹紧组件相关联。达到所需温度后，通过光学组件传输数据流并进行评估。

3. 发明申请

US20050201431A1 Temperature and jitter compensation controller circuit and method for fiber optics device 有权
标题翻译：温度和抖动补偿控制器电路和光纤设备的方法
公开(公告)号：US20050201431A1
公开(公告)日：2005-09-15
申请号：US11054999
申请日：2005-02-10
申请人： Ruldolf Hofmeister , Samantha Bench , Dmitri Bannikov
发明人： Ruldolf Hofmeister , Samantha Bench , Dmitri Bannikov
IPC分类号： H01S5/042 , H01S3/13
CPC分类号： H01S5/042
摘要： This disclosure concerns methods for calibrating an operating optoelectronic devices. In one example, a calibration method involves adjusting, at a first temperature, a control parameter until a device operating requirement is satisfied. The associated value of the control parameter is then recorded. This process of adjustment and recording is then repeated at one or more additional temperatures. During operation of the device, an associated temperature is sensed and the control parameter values associated with that temperature are used as a basis for generation of control signals that adjust performance of the device until a device operating requirement is satisfied.
摘要翻译：本公开涉及用于校准操作的光电子器件的方法。在一个示例中，校准方法包括在第一温度下调节控制参数，直到满足设备操作要求。然后记录控制参数的相关值。然后在一个或多个附加温度下重复该调节和记录过程。在装置的操作期间，感测到相关联的温度，并且将与该温度相关联的控制参数值用作生成控制信号的基础，所述控制信号调整装置的性能直到满足设备操作要求。

4. 发明申请

US20070272041A1 SYSTEMS, DEVICES AND METHODS FOR THERMAL TESTING OF AN OPTOELECTRONIC MODULE 有权
标题翻译：用于光电模块热测试的系统，装置和方法
公开(公告)号：US20070272041A1
公开(公告)日：2007-11-29
申请号：US11838141
申请日：2007-08-13
申请人： Samantha Bench , John Dirkson , Darin Douma
发明人： Samantha Bench , John Dirkson , Darin Douma
IPC分类号： G01N17/00
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4266
摘要： Devices, systems and methods for thermal testing of optoelectronic modules are disclosed. The device includes a frame member, a thermoelectric cooler, a plate in thermal contact with the DUT, a heat sink in thermal contact with the frame, and a metallic clip for attaching the thermal testing device to the module (DUT). The clip secures the thermoelectric cooler to the DUT. The method includes the steps of providing a testing apparatus having a printed circuit board with a test circuit formed thereon. The test board also has an electrical interface disposed in electrical communication with the test circuit, and a thermal testing assembly. A temporary electrical connection is formed between the DUT device and the interface. The thermal testing assembly is used to maintain a test temperature of the DUT device. A data stream is transmitted through the DUT device and then evaluated for adherence to a defined specification.
摘要翻译：公开了用于光电模块的热测试的装置，系统和方法。该装置包括框架构件，热电冷却器，与DUT热接触的板，与框架热接触的散热器和用于将热测试装置附接到模块（DUT）的金属夹。夹子将热电冷却器固定到DUT。该方法包括以下步骤：提供具有印刷电路板的测试装置，其上形成有测试电路。测试板还具有与测试电路电连通的电接口以及热测试组件。在DUT设备和接口之间形成临时电连接。热测试组件用于保持DUT设备的测试温度。数据流通过DUT设备传输，然后根据定义的规范进行评估。

5. 发明授权

US07024329B2 Method and apparatus for testing PCBA subcomponents 失效
标题翻译：用于测试PCBA子组件的方法和设备
公开(公告)号：US07024329B2
公开(公告)日：2006-04-04
申请号：US10809880
申请日：2004-03-25
申请人： Samantha Bench , John Dirkson , Alex Fishman
发明人： Samantha Bench , John Dirkson , Alex Fishman
IPC分类号： G01R31/02
CPC分类号： G01R31/2808 , G01R1/0408 , H05K1/141 , H05K3/325
摘要： An evaluator board for testing a printed circuit board assembly device subcomponent includes one or more receiving surfaces mounted on the evaluator board, and a securing mechanism positioned over at least one of the one or more receiving surfaces. The receiving surfaces can include a connection base and an electronic receptacle for receiving conductive elements of the subcomponent to be tested. In one implementation, at least one of the one or more receiving surfaces is configured to receive an edge connector of a form factor pluggable printed circuit board. In addition, one or more active and passive circuitry components can be mounted on opposing surfaces of the evaluator board in order to minimize the size and number of components used in the testing of the PCBA subcomponent.
摘要翻译：用于测试印刷电路板组装装置子部件的评估板包括安装在评估器板上的一个或多个接收表面和位于所述一个或多个接收表面中的至少一个上的固定机构。接收表面可以包括连接基座和用于接收待测试子部件的导电元件的电子插座。在一个实施方式中，一个或多个接收表面中的至少一个被配置为接收形状因素可插拔印刷电路板的边缘连接器。此外，一个或多个有源和无源电路组件可以安装在评估器板的相对表面上，以便最小化PCBA子部件测试中使用的部件的尺寸和数量。

6. 发明申请

US20050152663A1 Systems, devices and methods for thermal testing of an optoelectronic module 有权
标题翻译：用于光电子模块热测试的系统，设备和方法
公开(公告)号：US20050152663A1
公开(公告)日：2005-07-14
申请号：US11027765
申请日：2004-12-30
申请人： Samantha Bench , John Dirkson , Darin Douma
发明人： Samantha Bench , John Dirkson , Darin Douma
IPC分类号： G02B6/42 , G02B6/00 , G02B6/36
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4266
摘要： Devices, systems and methods for thermal testing of optoelectronic modules are disclosed. The device includes a frame member, a thermoelectric cooler, a plate in thermal contact with the DUT, a heat sink in thermal contact with the frame, and a metallic clip for attaching the thermal testing device to the module (DUT). The clip secures the thermoelectric cooler to the DUT. The method includes the steps of providing a testing apparatus having a printed circuit board with a test circuit formed thereon. The test board also has an electrical interface disposed in electrical communication with the test circuit, and a thermal testing assembly. A temporary electrical connection is formed between the DUT device and the interface. The thermal testing assembly is used to maintain a test temperature of the DUT device. A data stream is transmitted through the DUT device and then evaluated for adherence to a defined specification.
摘要翻译：公开了用于光电模块的热测试的装置，系统和方法。该装置包括框架构件，热电冷却器，与DUT热接触的板，与框架热接触的散热器和用于将热测试装置附接到模块（DUT）的金属夹。夹子将热电冷却器固定到DUT。该方法包括以下步骤：提供具有印刷电路板的测试装置，其上形成有测试电路。测试板还具有与测试电路电连通的电接口以及热测试组件。在DUT设备和接口之间形成临时电连接。热测试组件用于保持DUT设备的测试温度。数据流通过DUT设备传输，然后根据定义的规范进行评估。

7. 发明申请

US20050215081A1 Method and apparatus for testing PCBA subcomponents 失效
标题翻译：用于测试PCBA子组件的方法和设备
公开(公告)号：US20050215081A1
公开(公告)日：2005-09-29
申请号：US10809880
申请日：2004-03-25
申请人： Samantha Bench , John Dirkson , Alex Fishman
发明人： Samantha Bench , John Dirkson , Alex Fishman
IPC分类号： G01R1/04 , G01R31/28 , G06F17/50 , H05K1/14 , H05K3/32
CPC分类号： G01R31/2808 , G01R1/0408 , H05K1/141 , H05K3/325
摘要： An evaluator board for testing a printed circuit board assembly device subcomponent includes one or more receiving surfaces mounted on the evaluator board, and a securing mechanism positioned over at least one of the one or more receiving surfaces. The receiving surfaces can include a connection base and an electronic receptacle for receiving conductive elements of the subcomponent to be tested. In one implementation, at least one of the one or more receiving surfaces is configured to receive an edge connector of a form factor pluggable printed circuit board. In addition, one or more active and passive circuitry components can be mounted on opposing surfaces of the evaluator board in order to minimize the size and number of components used in the testing of the PCBA subcomponent.
摘要翻译：用于测试印刷电路板组装装置子部件的评估板包括安装在评估器板上的一个或多个接收表面和位于所述一个或多个接收表面中的至少一个上的固定机构。接收表面可以包括连接基座和用于接收待测试子部件的导电元件的电子插座。在一个实施方式中，一个或多个接收表面中的至少一个被配置为接收形状因素可插拔印刷电路板的边缘连接器。此外，一个或多个有源和无源电路组件可以安装在评估器板的相对表面上，以便最小化PCBA子部件测试中使用的部件的尺寸和数量。

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