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1. 发明申请

US20060070789A1 Rotatable vehicle accessory 审中-公开
标题翻译：可旋转车辆附件
公开(公告)号：US20060070789A1
公开(公告)日：2006-04-06
申请号：US11238803
申请日：2005-09-29
申请人： John Dirkson
发明人： John Dirkson
IPC分类号： B60K13/04 , A63H33/40
CPC分类号： B60Q1/2688 , B60K13/04 , B62J11/00 , B62J99/00 , B62J2099/0086 , F01N13/082
摘要： A decorative rotatable accessory includes one or more rotatable decorative elements mounted about a cylindrical vehicle component, such as an automobile exhaust, a motorcycle fork, a head lamp, handle bar, or the like. In one implementation, an assembly comprises an interface that is mounted to the vehicle component. A rotator, which is operably coupled to one or more decorative elements, is coupled to the interface component in such a way that the one or more decorative elements can rotate in response to a wind or air force. In particular, when an air force, such as wind or exhaust pushes against one or more of the decorative elements, or against one or more impeller blades coupled to the decorative elements, the decorative elements rotate, creating a decorative motion effect.
摘要翻译：装饰性旋转配件包括围绕圆柱形车辆部件安装的一个或多个可旋转的装饰元件，例如汽车排气，摩托车叉，头灯，手柄等。在一个实施方式中，组件包括安装到车辆部件的接口。可操作地联接到一个或多个装饰元件的旋转器以这样的方式联接到界面部件，使得一个或多个装饰元件可以响应于风或空气力而旋转。特别地，当诸如风或排气的空气推动装饰元件中的一个或多个或与装饰元件连接的一个或多个叶轮叶片时，装饰元件旋转，产生装饰运动效果。

2. 发明申请

US20050215081A1 Method and apparatus for testing PCBA subcomponents 失效
标题翻译：用于测试PCBA子组件的方法和设备
公开(公告)号：US20050215081A1
公开(公告)日：2005-09-29
申请号：US10809880
申请日：2004-03-25
申请人： Samantha Bench , John Dirkson , Alex Fishman
发明人： Samantha Bench , John Dirkson , Alex Fishman
IPC分类号： G01R1/04 , G01R31/28 , G06F17/50 , H05K1/14 , H05K3/32
CPC分类号： G01R31/2808 , G01R1/0408 , H05K1/141 , H05K3/325
摘要： An evaluator board for testing a printed circuit board assembly device subcomponent includes one or more receiving surfaces mounted on the evaluator board, and a securing mechanism positioned over at least one of the one or more receiving surfaces. The receiving surfaces can include a connection base and an electronic receptacle for receiving conductive elements of the subcomponent to be tested. In one implementation, at least one of the one or more receiving surfaces is configured to receive an edge connector of a form factor pluggable printed circuit board. In addition, one or more active and passive circuitry components can be mounted on opposing surfaces of the evaluator board in order to minimize the size and number of components used in the testing of the PCBA subcomponent.
摘要翻译：用于测试印刷电路板组装装置子部件的评估板包括安装在评估器板上的一个或多个接收表面和位于所述一个或多个接收表面中的至少一个上的固定机构。接收表面可以包括连接基座和用于接收待测试子部件的导电元件的电子插座。在一个实施方式中，一个或多个接收表面中的至少一个被配置为接收形状因素可插拔印刷电路板的边缘连接器。此外，一个或多个有源和无源电路组件可以安装在评估器板的相对表面上，以便最小化PCBA子部件测试中使用的部件的尺寸和数量。

3. 发明申请

US20050025449A1 Methods and structures for testing optical subassemblies at higher and lower temperatures 审中-公开
标题翻译：在较高和较低温度下测试光学组件的方法和结构
公开(公告)号：US20050025449A1
公开(公告)日：2005-02-03
申请号：US10929944
申请日：2004-08-30
申请人： John Dirkson , James Douma , Rudolf Hofmeister , Samantha Bench , Dev Kumar
发明人： John Dirkson , James Douma , Rudolf Hofmeister , Samantha Bench , Dev Kumar
IPC分类号： G02B6/00 , H04B10/08
CPC分类号： H04B10/07
摘要： An assembly and method for testing an optical subassembly by locally heating or cooling the optical subassembly. Locally heating or cooling the optical subassembly can include using a thermal transfer assembly. The thermal transfer assembly can include a thermoelectric cooler. A clamping assembly is provided to place the optical subassembly in electrical communication with a testing assembly. The thermal transfer assembly can be associated with the clamping assembly. After achieving the desired temperature, a data stream is transmitted through the optical subassembly and evaluated for compliance.
摘要翻译：通过局部加热或冷却光学组件来测试光学组件的组件和方法。局部加热或冷却光学组件可包括使用热转印组件。热转印组件可以包括热电冷却器。提供夹紧组件以将光学子组件放置成与测试组件电连通。热转印组件可与夹紧组件相关联。达到所需温度后，通过光学组件传输数据流并进行评估。

4. 发明申请

US20070272041A1 SYSTEMS, DEVICES AND METHODS FOR THERMAL TESTING OF AN OPTOELECTRONIC MODULE 有权
标题翻译：用于光电模块热测试的系统，装置和方法
公开(公告)号：US20070272041A1
公开(公告)日：2007-11-29
申请号：US11838141
申请日：2007-08-13
申请人： Samantha Bench , John Dirkson , Darin Douma
发明人： Samantha Bench , John Dirkson , Darin Douma
IPC分类号： G01N17/00
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4266
摘要： Devices, systems and methods for thermal testing of optoelectronic modules are disclosed. The device includes a frame member, a thermoelectric cooler, a plate in thermal contact with the DUT, a heat sink in thermal contact with the frame, and a metallic clip for attaching the thermal testing device to the module (DUT). The clip secures the thermoelectric cooler to the DUT. The method includes the steps of providing a testing apparatus having a printed circuit board with a test circuit formed thereon. The test board also has an electrical interface disposed in electrical communication with the test circuit, and a thermal testing assembly. A temporary electrical connection is formed between the DUT device and the interface. The thermal testing assembly is used to maintain a test temperature of the DUT device. A data stream is transmitted through the DUT device and then evaluated for adherence to a defined specification.
摘要翻译：公开了用于光电模块的热测试的装置，系统和方法。该装置包括框架构件，热电冷却器，与DUT热接触的板，与框架热接触的散热器和用于将热测试装置附接到模块（DUT）的金属夹。夹子将热电冷却器固定到DUT。该方法包括以下步骤：提供具有印刷电路板的测试装置，其上形成有测试电路。测试板还具有与测试电路电连通的电接口以及热测试组件。在DUT设备和接口之间形成临时电连接。热测试组件用于保持DUT设备的测试温度。数据流通过DUT设备传输，然后根据定义的规范进行评估。

5. 发明申请

US20060245712A1 Devices, systems and methods for testing optoelectronic modules 审中-公开
标题翻译：用于测试光电子模块的器件，系统和方法
公开(公告)号：US20060245712A1
公开(公告)日：2006-11-02
申请号：US11117784
申请日：2005-04-29
申请人： Alexander Fishman , Peter Scranton , John Dirkson
发明人： Alexander Fishman , Peter Scranton , John Dirkson
IPC分类号： G02B6/00
CPC分类号： G01R1/0408
摘要： Embodiments of the present invention provide devices, systems and methods to test optoelectronic modules. In one embodiment, the testing device can include a printed circuit board (PCB) and a first portion attached to the PCB. A second portion can be attached to the first portion. The second portion can include at least one testing device that can be used to test an optoelectronic module disposed between the first portion and the second portion. The optoelectronic module can be electrically and mechanically connected to at least one of the PCB and the first portion. Additionally, in some embodiments, the at least one testing device can be electrically connected to an electrical circuit or host device that is external to the apparatus
摘要翻译：本发明的实施例提供了测试光电子模块的装置，系统和方法。在一个实施例中，测试装置可以包括印刷电路板（PCB）和连接到PCB的第一部分。第二部分可以附接到第一部分。第二部分可以包括至少一个可用于测试设置在第一部分和第二部分之间的光电子模块的测试装置。光电子模块可以电和机械地连接到PCB和第一部分中的至少一个。另外，在一些实施例中，至少一个测试装置可以电连接到设备外部的电路或主机设备

6. 发明授权

US07024329B2 Method and apparatus for testing PCBA subcomponents 失效
标题翻译：用于测试PCBA子组件的方法和设备
公开(公告)号：US07024329B2
公开(公告)日：2006-04-04
申请号：US10809880
申请日：2004-03-25
申请人： Samantha Bench , John Dirkson , Alex Fishman
发明人： Samantha Bench , John Dirkson , Alex Fishman
IPC分类号： G01R31/02
CPC分类号： G01R31/2808 , G01R1/0408 , H05K1/141 , H05K3/325
摘要： An evaluator board for testing a printed circuit board assembly device subcomponent includes one or more receiving surfaces mounted on the evaluator board, and a securing mechanism positioned over at least one of the one or more receiving surfaces. The receiving surfaces can include a connection base and an electronic receptacle for receiving conductive elements of the subcomponent to be tested. In one implementation, at least one of the one or more receiving surfaces is configured to receive an edge connector of a form factor pluggable printed circuit board. In addition, one or more active and passive circuitry components can be mounted on opposing surfaces of the evaluator board in order to minimize the size and number of components used in the testing of the PCBA subcomponent.
摘要翻译：用于测试印刷电路板组装装置子部件的评估板包括安装在评估器板上的一个或多个接收表面和位于所述一个或多个接收表面中的至少一个上的固定机构。接收表面可以包括连接基座和用于接收待测试子部件的导电元件的电子插座。在一个实施方式中，一个或多个接收表面中的至少一个被配置为接收形状因素可插拔印刷电路板的边缘连接器。此外，一个或多个有源和无源电路组件可以安装在评估器板的相对表面上，以便最小化PCBA子部件测试中使用的部件的尺寸和数量。

7. 发明申请

US20050152663A1 Systems, devices and methods for thermal testing of an optoelectronic module 有权
标题翻译：用于光电子模块热测试的系统，设备和方法
公开(公告)号：US20050152663A1
公开(公告)日：2005-07-14
申请号：US11027765
申请日：2004-12-30
申请人： Samantha Bench , John Dirkson , Darin Douma
发明人： Samantha Bench , John Dirkson , Darin Douma
IPC分类号： G02B6/42 , G02B6/00 , G02B6/36
CPC分类号： G02B6/4246 , G02B6/4201 , G02B6/4266
摘要： Devices, systems and methods for thermal testing of optoelectronic modules are disclosed. The device includes a frame member, a thermoelectric cooler, a plate in thermal contact with the DUT, a heat sink in thermal contact with the frame, and a metallic clip for attaching the thermal testing device to the module (DUT). The clip secures the thermoelectric cooler to the DUT. The method includes the steps of providing a testing apparatus having a printed circuit board with a test circuit formed thereon. The test board also has an electrical interface disposed in electrical communication with the test circuit, and a thermal testing assembly. A temporary electrical connection is formed between the DUT device and the interface. The thermal testing assembly is used to maintain a test temperature of the DUT device. A data stream is transmitted through the DUT device and then evaluated for adherence to a defined specification.
摘要翻译：公开了用于光电模块的热测试的装置，系统和方法。该装置包括框架构件，热电冷却器，与DUT热接触的板，与框架热接触的散热器和用于将热测试装置附接到模块（DUT）的金属夹。夹子将热电冷却器固定到DUT。该方法包括以下步骤：提供具有印刷电路板的测试装置，其上形成有测试电路。测试板还具有与测试电路电连通的电接口以及热测试组件。在DUT设备和接口之间形成临时电连接。热测试组件用于保持DUT设备的测试温度。数据流通过DUT设备传输，然后根据定义的规范进行评估。

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