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1. 发明授权

US09240506B2 Transparent ceramic photo-optical semiconductor high power switches 有权
标题翻译：透明陶瓷光电半导体大功率开关
公开(公告)号：US09240506B2
公开(公告)日：2016-01-19
申请号：US12633671
申请日：2009-12-08
申请人： Roger W. Werne , James S. Sullivan , Richard L. Landingham
发明人： Roger W. Werne , James S. Sullivan , Richard L. Landingham
IPC分类号： H01L29/15 , H01L31/0352 , C04B35/575 , C04B35/58 , C04B35/581 , C04B35/626 , C04B35/645 , H01L31/08 , H01L31/18
CPC分类号： H01L31/035209 , C04B35/5755 , C04B35/58 , C04B35/581 , C04B35/6263 , C04B35/62635 , C04B35/62665 , C04B35/6269 , C04B35/645 , C04B2235/3239 , C04B2235/3262 , C04B2235/3272 , C04B2235/3895 , C04B2235/5445 , C04B2235/6023 , C04B2235/666 , C04B2235/77 , C04B2235/9653 , H01L31/08 , H01L31/1812 , H01L31/1848 , H01L31/1864 , Y02E10/544 , Y02P70/521
摘要： A photoconductive semiconductor switch according to one embodiment includes a structure of sintered nanoparticles of a high band gap material exhibiting a lower electrical resistance when excited by light relative to an electrical resistance thereof when not exposed to the light. A method according to one embodiment includes creating a mixture comprising particles, at least one dopant, and at least one solvent; adding the mixture to a mold; forming a green structure in the mold; and sintering the green structure to form a transparent ceramic. Additional system, methods and products are also presented.
摘要翻译：根据一个实施方案的光导半导体开关包括当不暴露于光时相对于其电阻而被光激发时表现出较低电阻的高带隙材料的烧结纳米颗粒的结构。根据一个实施方案的方法包括产生包含颗粒，至少一种掺杂剂和至少一种溶剂的混合物; 将混合物加入到模具中; 在模具中形成绿色结构; 并烧结绿色结构以形成透明陶瓷。还介绍了其他系统，方法和产品。

2. 发明申请

US20110133203A1 TRANSPARENT CERAMIC PHOTO-OPTICAL SEMICONDUCTOR HIGH POWER SWITCHES 有权
标题翻译：透明陶瓷光电半导体高功率开关
公开(公告)号：US20110133203A1
公开(公告)日：2011-06-09
申请号：US12633671
申请日：2009-12-08
申请人： Roger W. Werne , James S. Sullivan , Richard L. Landingham
发明人： Roger W. Werne , James S. Sullivan , Richard L. Landingham
IPC分类号： H01L31/0248 , H01L29/12 , C04B35/64 , H01L31/18
CPC分类号： H01L31/035209 , C04B35/5755 , C04B35/58 , C04B35/581 , C04B35/6263 , C04B35/62635 , C04B35/62665 , C04B35/6269 , C04B35/645 , C04B2235/3239 , C04B2235/3262 , C04B2235/3272 , C04B2235/3895 , C04B2235/5445 , C04B2235/6023 , C04B2235/666 , C04B2235/77 , C04B2235/9653 , H01L31/08 , H01L31/1812 , H01L31/1848 , H01L31/1864 , Y02E10/544 , Y02P70/521
摘要： A photoconductive semiconductor switch according to one embodiment includes a structure of sintered nanoparticles of a high band gap material exhibiting a lower electrical resistance when excited by light relative to an electrical resistance thereof when not exposed to the light. A method according to one embodiment includes creating a mixture comprising particles, at least one dopant, and at least one solvent; adding the mixture to a mold; forming a green structure in the mold; and sintering the green structure to form a transparent ceramic. Additional system, methods and products are also presented.
摘要翻译：根据一个实施方案的光导半导体开关包括当不暴露于光时相对于其电阻而被光激发时表现出较低电阻的高带隙材料的烧结纳米颗粒的结构。根据一个实施方案的方法包括产生包含颗粒，至少一种掺杂剂和至少一种溶剂的混合物; 将混合物加入到模具中; 在模具中形成绿色结构; 并烧结绿色结构以形成透明陶瓷。还介绍了其他系统，方法和产品。

3. 发明授权

US08125089B2 Optically-initiated silicon carbide high voltage switch 有权
标题翻译：光电式碳化硅高压开关
公开(公告)号：US08125089B2
公开(公告)日：2012-02-28
申请号：US12952949
申请日：2010-11-23
申请人： George J. Caporaso , Stephen E. Sampayan , James S. Sullivan , David M. Sanders
发明人： George J. Caporaso , Stephen E. Sampayan , James S. Sullivan , David M. Sanders
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L31/09 , H05H7/00
摘要： An improved photoconductive switch having a SIC or other wide band gap substrate material, such as GaAs and field-grading liners composed of preferably SiN formed on the substrate adjacent the electrode perimeters or adjacent the substrate perimeters for grading the electric fields.
摘要翻译：一种改进的光导开关，其具有SIC或其它宽带隙衬底材料，例如GaAs，并且优选地由SiN形成的场分级衬垫形成在邻近电极周边的衬底上或邻近衬底周边以分级电场。

4. 发明授权

US08258632B1 Optically-initiated silicon carbide high voltage switch with contoured-profile electrode interfaces 有权
标题翻译：光电式碳化硅高压开关，具有轮廓型电极接口
公开(公告)号：US08258632B1
公开(公告)日：2012-09-04
申请号：US13171281
申请日：2011-06-28
申请人： James S. Sullivan , Steven A. Hawkins
发明人： James S. Sullivan , Steven A. Hawkins
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L31/09 , H05H7/02 , H05H2007/022 , H05H2007/227
摘要： An improved photoconductive switch having a SiC or other wide band gap substrate material with opposing contoured profile cavities which have a contoured profile selected from one of Rogowski, Bruce, Chang, Harrison, and Ernst profiles, and two electrodes with matching contoured-profile convex interface surfaces.
摘要翻译：具有SiC或其它宽带隙衬底材料的改进的光导开关，其具有相对的轮廓轮廓空腔，其具有选自Rogowski，Bruce，Chang，Harrison和Ernst轮廓之一的轮廓轮廓，以及具有匹配轮廓轮廓凸形界面的两个电极表面。

5. 发明授权

US5666385A Jitter compensation circuit 失效
标题翻译：抖动补偿电路
公开(公告)号：US5666385A
公开(公告)日：1997-09-09
申请号：US340408
申请日：1994-11-15
申请人： James S. Sullivan , Don G. Ball
发明人： James S. Sullivan , Don G. Ball
IPC分类号： H03K7/08 , H04K1/02 , H04L25/03 , H04L25/49
CPC分类号： H03K7/08
摘要： The instantaneous V.sub.co signal on a charging capacitor is sampled and the charge voltage on capacitor C.sub.o is captured just prior to its discharge into the first stage of magnetic modulator. The captured signal is applied to an averaging circuit with a long time constant and to the positive input terminal of a differential amplifier. The averaged V.sub. co signal is split between a gain stage (G=0.975) and a feedback stage that determines the slope of the voltage ramp applied to the high speed comparator. The 97.5% portion of the averaged V.sub.co signal is applied to the negative input of a differential amplifier gain stage (G=10). The differential amplifier produces an error signal by subtracting 97.5% of the averaged V.sub.co signal from the instantaneous value of sampled V.sub.co signal and multiplying the difference by ten. The resulting error signal is applied to the positive input of a high speed comparator. The error signal is then compared to a voltage ramp that is proportional to the averaged V.sub.co values squared divided by the total volt-second product of the magnetic compression circuit.
摘要翻译：对充电电容器上的瞬时Vco信号进行采样，并且在放电到磁调制器的第一级之前，电容器Co上的充电电压被捕获。捕获的信号被施加到具有长时间常数的平均电路和差分放大器的正输入端。平均V + E，uns co + EE信号在增益级（G = 0.975）和确定施加到高速比较器的电压斜坡的斜率的反馈级之间分配。平均Vco信号的97.5％部分被施加到差分放大器增益级（G = 10）的负输入端。差分放大器通过从采样Vco信号的瞬时值中减去平均Vco信号的97.5％并将差乘以10来产生误差信号。所产生的误差信号被施加到高速比较器的正输入端。然后将误差信号与与平均Vco值平方成正比的电压斜坡进行比较，除以磁压缩电路的总伏秒乘积。

6. 发明授权

US08655125B2 High voltage photo switch package module 有权
标题翻译：高压照相开关封装模块
公开(公告)号：US08655125B2
公开(公告)日：2014-02-18
申请号：US13171372
申请日：2011-06-28
申请人： James S. Sullivan , David M. Sanders , Steven A. Hawkins , Stephen E. Sampayan
发明人： James S. Sullivan , David M. Sanders , Steven A. Hawkins , Stephen E. Sampayan
IPC分类号： G02B6/26 , G02B6/42
CPC分类号： G02F1/313 , G02F2201/02 , G02F2201/12
摘要： A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces, and at least one light-input surface. First metallic layers are formed on the electrode-interface surfaces, and one or more optical waveguides having input and output ends are bonded to the substrate so that the output end of each waveguide is bonded to a corresponding one of the light-input surfaces of the photo-conductive substrate. This forms a waveguide-substrate interface for coupling light into the photo-conductive wafer. A dielectric material such as epoxy is then used to encapsulate the photo-conductive substrate and optical waveguide so that only the metallic layers and the input end of the optical waveguide are exposed. Second metallic layers are then formed on the first metallic layers so that the waveguide-substrate interface is positioned under the second metallic layers.
摘要翻译：一种光电导体开关封装模块，其具有带有相对的电极界面表面的光导基板或晶片，以及至少一个光输入表面。第一金属层形成在电极界面表面上，并且具有输入和输出端的一个或多个光波导接合到基板上，使得每个波导的输出端被接合到相应的一个光输入表面光导基板。这形成用于将光耦合到光导晶片中的波导 - 衬底界面。然后使用诸如环氧树脂的介电材料来封装光导基板和光波导，使得只有金属层和光波导的输入端被暴露。然后在第一金属层上形成第二金属层，使得波导 - 基板界面位于第二金属层下方。

7. 发明申请

US20110101376A1 Optically-Initiated Silicon Carbide High Voltage Switch 有权
标题翻译：光学发射碳化硅高压开关
公开(公告)号：US20110101376A1
公开(公告)日：2011-05-05
申请号：US12952949
申请日：2010-11-23
申请人： George J. Caporaso , Stephen E. Sampayan , James S. Sullivan , David M. Sanders
发明人： George J. Caporaso , Stephen E. Sampayan , James S. Sullivan , David M. Sanders
IPC分类号： H01L31/0312 , H01L31/0304
CPC分类号： H01L31/09 , H05H7/00
摘要： An improved photoconductive switch having a SIC or other wide band gap substrate material, such as GaAs and field-grading liners composed of preferably SiN formed on the substrate adjacent the electrode perimeters or adjacent the substrate perimeters for grading the electric fields.
摘要翻译：一种改进的光导开关，其具有SIC或其它宽带隙衬底材料，例如GaAs，并且优选地由SiN形成的场分级衬垫形成在邻近电极周边的衬底上或邻近衬底周边以分级电场。

8. 发明授权

US07893541B2 Optically initiated silicon carbide high voltage switch 有权
标题翻译：光电启动碳化硅高压开关
公开(公告)号：US07893541B2
公开(公告)日：2011-02-22
申请号：US11586468
申请日：2006-10-24
申请人： George J. Caporaso , Stephen E. Sampayan , James S. Sullivan , David M. Sanders
发明人： George J. Caporaso , Stephen E. Sampayan , James S. Sullivan , David M. Sanders
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L31/09 , H05H7/00
摘要： An improved photoconductive switch having a SiC or other wide band gap substrate material, such as GaAs and field-grading liners composed of preferably SiN formed on the substrate adjacent the electrode perimeters or adjacent the substrate perimeters for grading the electric fields.
摘要翻译：一种具有SiC或其它宽带隙衬底材料的改进的光导开关，例如GaAs和优选SiN形成的场分级衬垫，其形成在邻近电极周边的衬底上或邻近衬底周边以分级电场。

9. 发明申请

US20120082411A1 HIGH VOLTAGE PHOTO SWITCH PACKAGE MODULE 有权
标题翻译：高电压照片开关封装模块
公开(公告)号：US20120082411A1
公开(公告)日：2012-04-05
申请号：US13171372
申请日：2011-06-28
申请人： James S. Sullivan , David M. Sanders , Steven A. Hawkins , Stephen A. Sampayan
发明人： James S. Sullivan , David M. Sanders , Steven A. Hawkins , Stephen A. Sampayan
IPC分类号： G02B6/12
CPC分类号： G02F1/313 , G02F2201/02 , G02F2201/12
摘要： A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces, and at least one light-input surface. First metallic layers are formed on the electrode-interface surfaces, and one or more optical waveguides having input and output ends are bonded to the substrate so that the output end of each waveguide is bonded to a corresponding one of the light-input surfaces of the photo-conductive substrate. This forms a waveguide-substrate interface for coupling light into the photo-conductive wafer. A dielectric material such as epoxy is then used to encapsulate the photo-conductive substrate and optical waveguide so that only the metallic layers and the input end of the optical waveguide are exposed. Second metallic layers are then formed on the first metallic layers so that the waveguide-substrate interface is positioned under the second metallic layers.
摘要翻译：一种光电导体开关封装模块，其具有带有相对的电极界面表面的光导基板或晶片，以及至少一个光输入表面。第一金属层形成在电极界面表面上，并且具有输入和输出端的一个或多个光波导接合到基板上，使得每个波导的输出端被接合到相应的一个光输入表面光导基板。这形成用于将光耦合到光导晶片中的波导 - 衬底界面。然后使用诸如环氧树脂的介电材料来封装光导基板和光波导，使得只有金属层和光波导的输入端被暴露。然后在第一金属层上形成第二金属层，使得波导 - 基板界面位于第二金属层下方。

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