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1. 发明授权

US07387812B2 Heat-curable resin composition 有权
标题翻译：热固性树脂组合物
公开(公告)号：US07387812B2
公开(公告)日：2008-06-17
申请号：US10498036
申请日：2002-11-21
申请人： Roger Pierre-Elie Salvin , Martin Roth , Masato Hoshino , Yasuharu Nojima
发明人： Roger Pierre-Elie Salvin , Martin Roth , Masato Hoshino , Yasuharu Nojima
IPC分类号： C08J7/04 , C08J3/28 , B32B3/10 , G03C1/00
CPC分类号： H05K3/285 , B32B27/26 , C08F290/04 , C08F290/06 , C08F297/02 , C08L19/006 , C08L51/085 , C08L53/00 , C08L63/00 , Y10T428/24917 , C08L2666/24 , C08L2666/04 , C08L2666/02
摘要： The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under the action of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns which are produced using the formulation according to the invention have excellent adhesion properties, chemical stability, good electrical properties and high resistance to rapid temperature ranges. The compositions are suitable in particular as solder resists in the production of circuit boards.
摘要翻译：本发明涉及一种树脂组合物，其包括在热作用下可固化的至少双官能预聚物（A），遥爪弹性体和具有弹性体芯和热塑性壳的颗粒材料。使用本发明的制剂生产的层和图案具有优异的粘合性能，化学稳定性，良好的电性能和对快速温度范围的高耐受性。该组合物特别适用于生产电路板中的阻焊剂。

2. 发明申请

US20050032935A1 Heat-curable resin composition 有权
标题翻译：热固性树脂组合物
公开(公告)号：US20050032935A1
公开(公告)日：2005-02-10
申请号：US10498036
申请日：2002-11-21
申请人： Roger Salvin , Martin Roth , Masato Hoshino , Yasuharu Nojima
发明人： Roger Salvin , Martin Roth , Masato Hoshino , Yasuharu Nojima
IPC分类号： G03F7/032 , B32B27/26 , C08F2/00 , C08F290/04 , C08F290/06 , C08F297/02 , C08G81/02 , C08L19/00 , C08L51/08 , C08L53/00 , C08L63/00 , G03F7/004 , G03F7/027 , H05K3/28
CPC分类号： H05K3/285 , B32B27/26 , C08F290/04 , C08F290/06 , C08F297/02 , C08L19/006 , C08L51/085 , C08L53/00 , C08L63/00 , Y10T428/24917 , C08L2666/24 , C08L2666/04 , C08L2666/02
摘要： The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under ection of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns which are produced using the formulation according to the invention have excellent adhesion properties, chemical stability, good electrical properties and high resistance to rapid temperature ranges. The compositions are suitable in particular as solder resists in the production of circuit boards.
摘要翻译：本发明涉及一种树脂组合物，其包含至少在热作用下可固化的双功能预聚物（A），遥爪弹性体和具有弹性体芯和热塑性壳的颗粒材料。使用本发明的制剂生产的层和图案具有优异的粘合性能，化学稳定性，良好的电性能和对快速温度范围的高耐受性。该组合物特别适用于生产电路板中的阻焊剂。

3. 发明授权

US07097958B2 Positive type photosensitive epoxy resin composition and printed circuit board using the same 失效
公开(公告)号：US07097958B2
公开(公告)日：2006-08-29
申请号：US10416978
申请日：2001-11-06
申请人： Yasuaki Sugano , Yasuharu Nojima
发明人： Yasuaki Sugano , Yasuharu Nojima
IPC分类号： G03F7/38 , G03F7/40 , G03F7/30 , G03F7/038 , G03F7/039 , B32B3/10 , H05K1/00
CPC分类号： G03F7/038 , G03F7/0045 , H05K3/287 , H05K3/4644 , Y10T428/24802
摘要： A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.

4. 发明授权

US06399277B1 Photopolymerizable thermosetting resin composition 失效
标题翻译：光聚合性热固性树脂组合物
公开(公告)号：US06399277B1
公开(公告)日：2002-06-04
申请号：US09214053
申请日：1998-12-28
申请人： Yasuharu Nojima , Toyoyuki Ido
发明人： Yasuharu Nojima , Toyoyuki Ido
IPC分类号： G03F7027
CPC分类号： G03F7/0388 , G03F7/032 , G03F7/033 , H05K3/287
摘要： A photopolymeriziable thermosetting resin composition comprising (A) a mixture consisting of (a) an active energy ray-setting resin and obtained by reacting an unsaturated monobasic acid copolymer resin with a cycloaliphatic epoxy group-containing unsaturated compound or reacting a cycloaliphatic epoxy group containing copolymer resin with an acid group-containing unsaturated compound and (b) an photosensitive prepolymer obtained by esterifying a novolak type epoxy compound with an alpha-beta-unsaturated carboxylic acid and then further reacting with polybasic acid anhydride (and in one embodiment further reacting with an unsaturated isocyanate).
摘要翻译：一种可光聚合的热固性树脂组合物，其包含（A）由（a）活性能量射线固化树脂组成的混合物，所述混合物由不饱和一元酸共聚物树脂与含脂环族环氧基的不饱和化合物反应或使含脂环氧基的共聚物具有含酸基的不饱和化合物的树脂和（b）通过将酚醛清漆型环氧化合物与α-β-不饱和羧酸酯化，然后与多元酸酐进一步反应获得的光敏预聚物（并且在一个实施方案中进一步与不饱和异氰酸酯）。

5. 发明授权

US07378228B2 Positive type photosensitive epoxy resin composition and printed circuit board using the same 失效
标题翻译：正型感光环氧树脂组合物和使用其的印刷电路板
公开(公告)号：US07378228B2
公开(公告)日：2008-05-27
申请号：US11471871
申请日：2006-06-21
申请人： Yasuaki Sugano , Yasuharu Nojima
发明人： Yasuaki Sugano , Yasuharu Nojima
IPC分类号： G03F7/40
CPC分类号： G03F7/038 , G03F7/0045 , H05K3/287 , H05K3/4644 , Y10T428/24802
摘要： A printed circuit board comprising an insulating layer prepared with the aid of a positive type photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule; (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent, and (d) a photosensitive acid generator.
摘要翻译：一种印刷电路板，包括借助于正型感光性环氧树脂组合物制备的绝缘层，所述正型感光性环氧树脂组合物包含（a）在一个分子中具有两个或更多个环氧基的环氧树脂; （b）具有三嗪环的改性酚醛树脂，（c）潜碱性固化剂和（d）感光酸产生剂。

6. 发明申请

US20060240356A1 Positive type photosensitive epoxy resin composition and printed circuit board using the same 失效
标题翻译：正型感光环氧树脂组合物和使用其的印刷电路板
公开(公告)号：US20060240356A1
公开(公告)日：2006-10-26
申请号：US11471871
申请日：2006-06-21
申请人： Yasuaki Sugano , Yasuharu Nojima
发明人： Yasuaki Sugano , Yasuharu Nojima
IPC分类号： G03C1/00
CPC分类号： G03F7/038 , G03F7/0045 , H05K3/287 , H05K3/4644 , Y10T428/24802
摘要： A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.
摘要翻译：一种正型感光性环氧树脂组合物，其包含（a）在一个分子中具有两个或更多个环氧基的环氧树脂，（b）具有三嗪环的改性酚醛树脂，（c）潜碱性固化剂和（d）光敏酸发生器; 以及使用所述组合物作为绝缘层的构建模式的优选多层印刷电路板。

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