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    • 3. 发明授权
    • Non-volatile, programmable semiconductor memory having reduced testing
time
    • 非易失性,可编程半导体存储器具有缩短的测试时间
    • US4862418A
    • 1989-08-29
    • US266346
    • 1988-11-01
    • Roger CuppensJoannes J. M. Koomen
    • Roger CuppensJoannes J. M. Koomen
    • H01L27/10G11C16/04G11C17/00G11C29/00G11C29/24
    • G11C29/24
    • In programmable memories of the EPROM or EEPROM type, a row and/or column of test memory cells are added to the matrix of rows and columns of non-volatile memory cells for the testing of the peripheral circuits which select and read the memory cells. The test memory cells have a very short write time as compared with the non-volatile memory cells and may be of the dynamic (or volatile) type. The write time for a memory cell of the EPROM or EEPROM may be, for example, 10 msec. The write time for a dynamic memory cell, however, is 100 nsec. The time required for testing the peripheral circuits can therefore be reduced by a factor of 80 (for a 16 Kbit memory) or higher (for memories larger than 16 Kbits).
    • 在EPROM或EEPROM类型的可编程存储器中,测试存储器单元的行和/或列被添加到非易失性存储单元的行和列的矩阵中,用于测试选择和读取存储单元的外围电路。 测试存储单元与非易失性存储单元相比具有非常短的写入时间,并且可以是动态(或易失性)类型。 EPROM或EEPROM的存储单元的写入时间可以是例如10毫秒。 然而,动态存储单元的写入时间为100ns。 因此,测试外围电路所需的时间可以降低80倍(对于16 Kbit存储器)或更高(对于大于16 Kbits的存储器)。
    • 7. 发明授权
    • Semiconductor device having a non-volatile memory and method of
manufacturing such a semiconductor device
    • 具有非易失性存储器的半导体器件和制造这种半导体器件的方法
    • US5895950A
    • 1999-04-20
    • US838247
    • 1997-04-17
    • Andrew J. WalkerRoger CuppensAlwin N. Kronert
    • Andrew J. WalkerRoger CuppensAlwin N. Kronert
    • H01L21/8247G11C16/16H01L27/105H01L27/115H01L29/788H01L29/792
    • H01L29/7885G11C16/16H01L27/105H01L27/11526
    • The invention relates to a non-volatile memory with floating gate, in particular a Flash-EPROM, in which writing takes place through injection of hot electrons into the floating gate and in which erasing takes place through injection of hot holes. To keep the write and erase voltages sufficiently low, p-type zones which locally increase the background doping concentration of the p-type substrate are provided around the n-type source and drain zones. These p-type zones cause an increased field strength at the drain zone whereby hot electrons are formed at the pinch-off point also at lower voltages. This increased background concentration in addition reduces the breakdown voltage of the pn junction of the source and drain zones, so that hot holes for erasing can be formed by pn breakdown at comparatively low voltages. The device is particularly suitable for being integrated into a signal processing IC manufactured in a standard process, such as a microcontroller.
    • 本发明涉及一种具有浮动栅极,特别是闪存EPROM的非易失性存储器,其中通过将热电子注入到浮动栅极中进行写入,并且其中通过注入热孔进行擦除。 为了保持写入和擦除电压足够低,在n型源极和漏极区域周围设置有局部增加p型衬底的背景掺杂浓度的p型区域。 这些p型区域在漏极区域引起增加的场强,从而也在较低电压下在夹断点处形成热电子。 此外,这种增加的背景浓度还降低了源区和漏区的pn结的击穿电压,从而可以通过在较低电压下的pn击穿来形成用于擦除的热孔。 该器件特别适合于集成到诸如微控制器的标准处理中制造的信号处理IC中。
    • 8. 发明授权
    • Electrically-programmable semiconductor memories with buried injector
region
    • 具有埋入式注射器区域的电可编程半导体存储器
    • US5216269A
    • 1993-06-01
    • US745992
    • 1991-08-08
    • Jan MiddelhoekGerrit-Jan HeminkRutger C. M. WijburgLouis PraamsmaRoger Cuppens
    • Jan MiddelhoekGerrit-Jan HeminkRutger C. M. WijburgLouis PraamsmaRoger Cuppens
    • H01L29/788
    • H01L29/7884
    • Each memory cell of an electrically-programmable semiconductor memory has a field-effect transistor with a charge-storage region. Efficient and fast injection of hot carriers into the charge-storage region is achieved by vertical punch-through of a depletion layer to a buried injector region, by application of programming voltages to a control gate and to the surface of the punch-through region. Non-injected carriers are removed via at least the transistor drain during the programming. A well-defined punch-through region can be obtained with a higher-doped boundary region at at least one side of the punch-through region to restrict the lateral spread of the depletion layer(s) and prevent parasitic connections. This permits closer spacing of the injector region to other regions of the memory cell, e.g. source and drain regions, and the injector region may adjoin an inset insulating field pattern. A compact cell array layout can be formed with a common connection region for the injector regions of two adjacent cells and for either a source or drain region of four other adjacent cells. The control gate and an erase gate may both be coupled in the same manner to the charge-storage region, and the cell can be operated with complementary voltage levels for writing and erasing. A feed-back mechanism with the start of injection from the punch-through and injector regions can provide a well-defined charge level limit for the erasure.
    • 电可编程半导体存储器的每个存储单元具有具有电荷存储区域的场效应晶体管。 通过将编程电压施加到控制栅极和穿通区域的表面,通过将耗尽层垂直穿透到埋入式注入器区域来实现热载流子进入电荷存储区域的高效和快速注入。 在编程期间,非注入载流子至少通过晶体管漏极去除。 可以在穿通区域的至少一侧具有较高掺杂的边界区域来获得明确的穿通区域,以限制耗尽层的横向扩展并防止寄生连接。 这允许注射器区域与存储器单元的其它区域的更近的间隔,例如, 源极和漏极区域,并且注入器区域可以邻接插入绝缘场图案。 紧凑的单元阵列布局可以形成有用于两个相邻单元的注入器区域和四个其它相邻单元的源极或漏极区域的公共连接区域。 控制栅极和擦除栅极都可以以相同的方式耦合到电荷存储区域,并且可以以互补的电压电平对单元进行操作以进行写入和擦除。 具有从穿通和注射器区域的注入开始的反馈机构可以为擦除提供明确定义的电荷水平限制。