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    • 1. 发明授权
    • Process for producing polyamides from aminonitriles
    • 从氨腈制备聚酰胺的方法
    • US06194538B1
    • 2001-02-27
    • US09242714
    • 1999-02-22
    • Robert WeissDieter KraussDieter KellerGunter PipperWolfgang HarderAlfons LudwigRalf Mohrschladt
    • Robert WeissDieter KraussDieter KellerGunter PipperWolfgang HarderAlfons LudwigRalf Mohrschladt
    • C08G6904
    • C08G69/04C08G69/08C08G69/28C08G69/36
    • A process for preparing a polyamide by reacting at least one aminonitrile with water comprises: (1) reacting at least one aminonitrile with water at a temperature from 100 to 360° C. and a pressure from 0.1 to 35×106 Pa to obtain a reaction mixture, (2) further reacting the reaction mixture at a temperature from 150 to 400° C. and a pressure which is lower than the pressure in step 1, the temperature and the pressure being selected so as to obtain a first gas phase and a first liquid or a first solid phase or a mixture of first solid and first liquid phase, and the first gas phase is separated from the first liquid or the first solid phase or from the mixture of first liquid and first solid phase, and (3) admixing the first liquid or the first solid phase or the mixture of first liquid and first solid phase with a gaseous or liquid phase comprising water at a temperature from 150 to 360° C. and a pressure from 0.1 to 30×106 Pa to obtain a product mixture.
    • 通过使至少一种氨基腈与水反应制备聚酰胺的方法包括:(1)在100至360℃的温度和0.1至35×10 6 Pa的压力下使至少一种氨基腈与水反应,得到反应混合物, (2)在150-400℃的温度和低于步骤1中的压力的​​压力下使反应混合物进一步反应,选择温度和压力以获得第一气相和第一液体 或第一固相或第一固相和第一液相的混合物,并且第一气相与第一液体或第一固相或第一液体和第一固相的混合物分离,以及(3)将 第一液体或第一固相或第一液体和第一固相的混合物与气相或液相在150至360℃的温度和0.1至30×10 6 Pa的压力下包含水以获得产物混合物。
    • 3. 发明授权
    • Simultaneous double-side grinding of semiconductor wafers
    • 同时双面研磨半导体晶圆
    • US08197300B2
    • 2012-06-12
    • US12242959
    • 2008-10-01
    • Joachim JungeRobert Weiss
    • Joachim JungeRobert Weiss
    • B24B49/00
    • B24B37/08B24B49/00
    • Correction of grinding spindle positions in double-side grinding machines for the simultaneous double-side machining of semiconductor wafers is achieved by torsionally coupling the two grinding spindles, each comprising a grinding disk flange for receiving a grinding disk, and providing a measuring unit with an inclinometer and two sensors for distance measurement, between the two grinding disk flanges such that the grinding spindles are essentially in the position they would have with mounted grinding disks during the grinding process, wherein the coupled grinding spindles are rotated while inclinometer and sensors determine radial and axial correction values of axial alignment to adjust the grinding spindles to a symmetrical orientation. The spindle positions may be corrected under the action of process forces.
    • 通过扭转联接两个研磨主轴来实现用于双面研磨机的双面研磨机中的研磨主轴位置的修正,每个研磨主轴包括用于接收研磨盘的研磨盘凸缘,并且提供具有 倾斜计和两个用于距离测量的传感器,在两个研磨盘凸缘之间,使得研磨主轴基本上处于其在研磨过程中具有安装的研磨盘的位置,其中联接的研磨主轴旋转,而倾斜仪和传感器确定径向和 轴向对准的轴向校正值,以将研磨主轴调整到对称取向。 主轴位置可以在加工力的作用下进行修正。
    • 4. 发明申请
    • Method for Producing a Printed Product
    • 生产印刷产品的方法
    • US20100214615A1
    • 2010-08-26
    • US12680675
    • 2008-09-26
    • Peter SchulmeisterRobert WeissFlorian Fejfar
    • Peter SchulmeisterRobert WeissFlorian Fejfar
    • G06K15/02
    • B41F13/46
    • A method for producing a printed product, wherein at least one printing substrate webs are transported through at least one printing form-based printing unit for static printing of at least one printing substrate webs with a printed image which remains unchanged for printed copies of the printed product. In addition, at least one of the statically printed printing substrate webs is printed inline dynamically with the static printing in a region of at least one printing device of the web press without a printing form with access data, e.g., a prize code, which is individualized for at least some printed copies. Here, information content, such as a prize, which extends beyond the printed product can be accessed by the access data for a purchaser of the printed product over an interactive medium, such as the Internet. Access data specific to a target person and/or a target group are printed in the printed copies as individual access data.
    • 一种用于生产印刷产品的方法,其中至少一个印刷基材幅材通过至少一个基于印刷形式的印刷单元输送,用于静态印刷至少一个印刷基材幅材,其印刷图像保持不变,以便印刷的印刷品 产品。 此外,至少一个静态印刷的印刷基材幅材与静态印刷动态地印刷在幅材印刷机的至少一个印刷装置的区域中,而没有印刷形式,具有存取数据,例如奖品代码 个性化至少一些打印副本。 这里,可以通过诸如因特网之类的交互介质的印刷产品的购买者的访问数据来访问延伸到印刷品之外的诸如奖品的信息内容。 访问目标人员和/或目标群体的特定数据,作为个人访问数据打印在打印的副本中。
    • 7. 发明申请
    • Photocatalytic air purifier
    • 光催化空气净化器
    • US20060280660A1
    • 2006-12-14
    • US11148218
    • 2005-06-09
    • Robert Weiss
    • Robert Weiss
    • B01J19/12
    • A61L9/205B01D53/88B01D2255/20707B01D2255/20738B01D2255/802F24F2003/1667
    • A photocatalytic air purifier is disclosed wherein the photocatalytic air purifier includes an ultraviolet light source that generates heat and a support member having a photocatalyst coated on a first surface of the support member. The support member is positionable distal to the ultraviolet light source, the support member exposing an optimal amount of surface area to the light source such that such that the light source may irradiate the photocatalyst coated on the first surface of the support member. The heat generated by the light source draws ambient air between the first surface member and the light source by convection such that the first surface is in continuous contact with the ambient air.
    • 公开了一种光催化空气净化器,其中光催化空气净化器包括产生热的紫外光源和具有涂覆在支撑构件的第一表面上的光催化剂的支撑构件。 支撑构件可位于远离紫外光源的位置,支撑构件向光源暴露最佳量的表面积,使得光源可以照射涂覆在支撑构件的第一表面上的光催化剂。 由光源产生的热量通过对流在第一表面件和光源之间吸收环境空气,使得第一表面与环境空气连续接触。
    • 8. 发明申请
    • METHOD FOR REMOVING MATERIAL FROM A SEMICONDUCTOR WAFER
    • 从半导体滤波器中去除材料的方法
    • US20060211338A1
    • 2006-09-21
    • US11377946
    • 2006-03-16
    • Alexander HeilmaierRobert DrexlerAnton HuberRobert Weiss
    • Alexander HeilmaierRobert DrexlerAnton HuberRobert Weiss
    • B24B51/00
    • B24B37/042
    • The invention relates to a method for removing material from a semiconductor wafer by machining, in which a semiconductor wafer held on a wafer holder and a grinding wheel lying opposite it are rotated independently of one another, the grinding wheel being arranged laterally offset with respect to the semiconductor wafer and being positioned in such a way that an axial center of the semiconductor wafer passes into a working range of the grinding wheel, the grinding wheel being moved in the direction of the semiconductor wafer at an infeed rate, with the result that grinding wheel and semiconductor wafer are advanced toward one another while the semiconductor wafer and grinding wheel are rotating about parallel axes, so that a surface of the semiconductor wafer is ground, with the grinding wheel being moved back at a return rate after a defined amount of material has been removed, wherein the grinding wheel and semiconductor wafer are advanced toward one another by a distance of 0.03-0.5 μm during one revolution of the semiconductor wafer.
    • 本发明涉及通过机械加工从半导体晶片去除材料的方法,其中保持在晶片保持器上的半导体晶片和与其相对的研磨轮彼此独立地旋转,所述砂轮相对于 半导体晶片并且以这样的方式定位,使得半导体晶片的轴向中心进入砂轮的工作范围,砂轮以进给速度沿半导体晶片的方向移动,结果是研磨 轮和半导体晶片彼此前进,同时半导体晶片和砂轮围绕平行轴线旋转,使得半导体晶片的表面被研磨,其中砂轮在定义量的材料之后以返回速率返回 已经被除去,其中砂轮和半导体晶片相对于彼此前进0.03-0的距离。 在半导体晶片的一圈内的5um。