专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110141924A1 System and Method for Filtering High Priority Signaling and Data for Fixed and Mobile Networks 审中-公开
标题翻译：用于过滤固定和移动网络的高优先级信令和数据的系统和方法
公开(公告)号：US20110141924A1
公开(公告)日：2011-06-16
申请号：US12639213
申请日：2009-12-16
申请人： Robert W. Froehlich , Seshu Dommaraju
发明人： Robert W. Froehlich , Seshu Dommaraju
IPC分类号： H04L12/26
CPC分类号： H04L43/028 , H04L41/0893 , H04L43/12
摘要： A system and method for monitoring IP flows in a telecommunications network is disclosed. Data packets are captured from the links in the telecommunications network via a plurality of monitoring probes. The data packets are filtered, using an interface processor, to classify the data packets by subscriber identification and link identification to create classified packets. The classified packets are filtered by application, using a packet processor, to create call session records. A subscriber record is created, using a subscriber session processor, the subscriber record binding subscriber information from the call session records, the subscriber record comprising a plurality of fields including a high value tag. One or more of the network nodes are controlled using a configuration manager according to policy rules that correspond to the high value tag.
摘要翻译：公开了一种用于监视电信网络中的IP流的系统和方法。经由多个监视探测器从电信网络中的链路捕获数据分组。使用接口处理器对数据分组进行过滤，通过用户标识和链路标识对数据分组进行分类，以创建分类分组。分类的分组被应用程序使用分组处理器进行过滤，以创建呼叫会话记录。使用订户会话处理器创建订户记录，来自呼叫会话记录的订户记录绑定订户信息，订户记录包括包括高价值标签的多个字段。根据与高价值标签对应的策略规则，使用配置管理器控制一个或多个网络节点。

2. 发明授权

US5328087A Thermally and electrically conductive adhesive material and method of bonding with same 失效
标题翻译：导电粘合材料及其粘接方法
公开(公告)号：US5328087A
公开(公告)日：1994-07-12
申请号：US38420
申请日：1993-03-29
申请人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
发明人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
IPC分类号： C09J9/02 , H01B1/22 , H01R4/04 , H05K3/32 , H01L21/58
CPC分类号： H01L24/29 , C09J9/02 , H01B1/22 , H01L24/32 , H01R4/04 , H05K3/323 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29311 , H01L2224/29499 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H05K2201/0209 , H05K2201/023 , H05K2201/10719 , H05K2203/0425 , Y10T29/49126
摘要： The present invention discloses a thermally and electrically conductive adhesive material comprising a hardened adhesive, and a non-solidified filler containing a liquid metal dispersed in separate spaced regions of the adhesive. The hardened adhesive provides a mechanical bond whereas the filler provides continuous thermal and electrical metal bridges, each bridge extending through the adhesive and contacting the bonded surfaces. The method includes (a) dispersing a filler containing a liquid metal into an unhardened adhesive, (b) contacting the unhardened adhesive and the filler in non-solidified state to the surfaces resulting in separate spaced regions of the non-solidified filler contacting both surfaces, and (c) hardening the adhesive.
摘要翻译：本发明公开了一种导热粘合剂材料，其包括硬化粘合剂，以及含有液体金属的非固化填料，其分散在粘合剂的分开间隔的区域中。硬化的粘合剂提供机械结合，而填料提供连续的热和电金属桥，每个桥延伸通过粘合剂并接触粘结表面。该方法包括（a）将含有液态金属的填料分散在未硬化的粘合剂中，（b）将未硬化的粘合剂和非固化状态的填料接触到表面，从而形成与两个表面接触的非固化填料的分开的间隔区域，和（c）硬化粘合剂。

3. 发明授权

US08004969B2 Cell level congestion policy management 失效
标题翻译：小区级拥塞策略管理
公开(公告)号：US08004969B2
公开(公告)日：2011-08-23
申请号：US10289638
申请日：2002-11-07
申请人： Robert W. Froehlich , Rangaprasad Govindarajan , Jogen K Pathak , Vyankatesh Shanbhag
发明人： Robert W. Froehlich , Rangaprasad Govindarajan , Jogen K Pathak , Vyankatesh Shanbhag
IPC分类号： G08C15/00
CPC分类号： H04W72/1226 , H04L47/10 , H04L47/14 , H04L47/2416 , H04L47/2433 , H04L47/2458 , H04L47/2475 , H04L47/2491 , H04W72/1236 , H04W72/1242
摘要： A system and method for transmitting data packets to a wireless client is shown. The data packets are received by a wireless content switch in the wireless network. The wireless content switch determines a quality of service value for the wireless client. The wireless content switch assigns the priority of transmission for the data packet based on the assigned quality of service value. The data packet is transmitted according to the priority.
摘要翻译：示出了向无线客户端发送数据分组的系统和方法。数据分组由无线网络中的无线内容交换机接收。无线内容交换机确定无线客户端的服务质量值。无线内容交换机根据分配的服务质量值分配数据包的传输优先级。根据优先级传输数据包。

4. 发明授权

US5508228A Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same 失效
标题翻译：适用于粘合倒装芯片集成电路器件的电连接凸块及其形成方法
公开(公告)号：US5508228A
公开(公告)日：1996-04-16
申请号：US195434
申请日：1994-02-14
申请人： Ernest R. Nolan , Diana C. Duane , Todd H. Herder , Thomas A. Bishop , Kimcuc T. Tran , Robert W. Froehlich , Randy L. German , Richard D. Nelson , Chung J. Lee , Mark R. Breen , Kathryn V. Keswick
发明人： Ernest R. Nolan , Diana C. Duane , Todd H. Herder , Thomas A. Bishop , Kimcuc T. Tran , Robert W. Froehlich , Randy L. German , Richard D. Nelson , Chung J. Lee , Mark R. Breen , Kathryn V. Keswick
IPC分类号： H01L23/52 , H01L21/3205 , H01L21/56 , H01L21/60 , H01L23/485 , H01L23/498 , H01L21/44
CPC分类号： H01L24/12 , H01L21/563 , H01L23/49811 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/48 , H01L2224/0231 , H01L2224/03912 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/11902 , H01L2224/13099 , H01L2224/1319 , H01L2224/48091 , H01L2224/48465 , H01L2224/73203 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/19042 , Y10S438/903
摘要： Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.
摘要翻译：用于粘合倒装芯片集成电路器件的合适的电连接凸块和用于形成凸块的各种方法包括以下步骤：在衬底或集成电路裸片上形成聚合物凸块并用金属化层涂覆聚合物凸块。聚合物凸块形成步骤包括以下步骤：在基材上涂覆聚合物材料，固化聚合物和从聚合物材料蚀刻凸块图案。外涂步骤包括在聚合物凸块上无电镀电镀金属如金。

5. 发明授权

US5445308A Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal 失效
标题翻译：与基质材料和含有液态金属的随机分散填料的导热连接
公开(公告)号：US5445308A
公开(公告)日：1995-08-29
申请号：US263623
申请日：1994-06-22
申请人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
发明人： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
IPC分类号： C09J9/02 , H01B1/22 , H01R4/04 , H05K3/32 , B23K35/26
CPC分类号： C09J9/02 , H01B1/22 , H01L24/29 , H01L24/32 , H01R4/04 , H05K3/323 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29311 , H01L2224/83101 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H05K2201/0209 , H05K2201/023 , H05K2201/10719 , H05K2203/0425
摘要： A method of providing a thermally conductive connection between spaced surfaces includes (a) mixing a thermally conductive filler containing a liquid metal into an unhardened matrix material, and (b) contacting the unhardened matrix material and randomly dispersed, separate spaced non-solidified regions of filler within the unhardened matrix material to the surfaces. A solid mechanical bond may be provided by hardening the matrix material or by providing a separate adhesive between the surfaces. Preferably, the regions of filler form separate spaced continuous thermally and electrically conductive paths between the surfaces.
摘要翻译：在间隔表面之间提供导热连接的方法包括（a）将含有液态金属的导热填料混合到未硬化的基体材料中，和（b）使未硬化的基体材料和随机分散的分开的非固化区域未固化的基体材料中的填料到表面。可以通过硬化基质材料或通过在表面之间提供单独的粘合剂来提供固体机械结合。优选地，填料区域在表面之间形成分开的连续的热和导电路径。

6. 发明授权

US08559967B2 System and method for managing subscriber bandwidth based on cell congestion analysis 有权
标题翻译：基于小区拥塞分析管理用户带宽的系统和方法
公开(公告)号：US08559967B2
公开(公告)日：2013-10-15
申请号：US12870592
申请日：2010-08-27
申请人： Robert W. Froehlich , Fang Tang , Shankar Selvavinayagam
发明人： Robert W. Froehlich , Fang Tang , Shankar Selvavinayagam
IPC分类号： H04B17/00 , H04W72/00
CPC分类号： H04W28/02 , H04L47/14 , H04W24/08 , H04W28/16
摘要： A system and method for enforcing network policies is disclosed. Data is captured from network interfaces. A cell congestion level is determined from the captured data. Cells having a congestion level above a first threshold are identified. A first alert is transmitted to a network policy management entity when the cell is above the first threshold. Cells having a congestion level above a second threshold are identified. A second alert is transmitted to the network policy management entity when the cell is above the second threshold. The first threshold set at a point below a maximum capacity of the cell, and the second threshold set at a point near or at the maximum capacity of the cell.
摘要翻译：公开了一种用于执行网络策略的系统和方法。数据从网络接口捕获。从捕获的数据确定小区拥塞级别。识别具有高于第一阈值的拥塞程度的小区。当小区高于第一阈值时，将第一警报发送到网络策略管理实体。识别具有高于第二阈值的拥塞水平的小区。当小区高于第二阈值时，向网络策略管理实体发送第二警报。在低于小区的最大容量的点处设置的第一阈值，以及设置在小区的接近或处于最大容量的点处的第二阈值。

7. 发明申请

US20120052866A1 System and Method for Managing Subscriber Bandwidth Based on Cell Congestion Analysis 有权
标题翻译：基于小区拥塞分析管理用户带宽的系统和方法
公开(公告)号：US20120052866A1
公开(公告)日：2012-03-01
申请号：US12870592
申请日：2010-08-27
申请人： Robert W. Froehlich , Fang Tang , Shankar Selvavinayagam
发明人： Robert W. Froehlich , Fang Tang , Shankar Selvavinayagam
IPC分类号： H04W40/00
CPC分类号： H04W28/02 , H04L47/14 , H04W24/08 , H04W28/16
摘要： A system and method for enforcing network policies is disclosed. Data is captured from network interfaces. A cell congestion level is determined from the captured data. Cells having a congestion level above a first threshold are identified. A first alert is transmitted to a network policy management entity when the cell is above the first threshold. Cells having a congestion level above a second threshold are identified. A second alert is transmitted to the network policy management entity when the cell is above the second threshold. The first threshold set at a point below a maximum capacity of the cell, and the second threshold set at a point near or at the maximum capacity of the cell.
摘要翻译：公开了一种用于执行网络策略的系统和方法。数据从网络接口捕获。从捕获的数据确定小区拥塞级别。识别具有高于第一阈值的拥塞程度的小区。当小区高于第一阈值时，将第一警报发送到网络策略管理实体。识别具有高于第二阈值的拥塞水平的小区。当小区高于第二阈值时，向网络策略管理实体发送第二警报。在低于小区的最大容量的点处设置的第一阈值，以及设置在小区的接近或处于最大容量的点处的第二阈值。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式