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1. 发明授权

US4604552A Retrofit fluorescent lamp energy management/dimming system 失效
标题翻译：改造荧光灯能量管理/调光系统
公开(公告)号：US4604552A
公开(公告)日：1986-08-05
申请号：US645593
申请日：1984-08-30
申请人： Robert P. Alley , Paul G. Huber , Joseph M. Sullivan
发明人： Robert P. Alley , Paul G. Huber , Joseph M. Sullivan
IPC分类号： H05B41/392 , H05B37/00
CPC分类号： H05B41/3924 , Y10S315/04 , Y10S315/07
摘要： In a retrofit dimming installation for a fluorescent lighting system with a conventional ballast, filament power is maintained, even when the lamps are dimmed, by providing a high frequency component to the ballast voltage. The selected high frequency component allows heating of the filaments without adding to the light output of the lamps, thereby practically eliminating the shortened lamp life usually resulting from operating the lamp in a dimmed condition.
摘要翻译：在用于具有常规镇流器的荧光照明系统的改进调光装置中，通过向镇流器电压提供高频分量，即使灯变暗，仍保持灯丝功率。所选择的高频分量允许加热灯丝而不增加灯的光输出，从而实际上消除了通常由于将灯操作在暗淡状态而引起的灯泡寿命缩短。

2. 发明授权

US06678949B2 Process for forming a multi-level thin-film electronic packaging structure 失效
标题翻译：用于形成多层薄膜电子封装结构的方法
公开(公告)号：US06678949B2
公开(公告)日：2004-01-20
申请号：US09886326
申请日：2001-06-21
申请人： Chandrika Prasad , Roy Yu , Richard L. Canull , Giulio DiGiacomo , Ajay P. Giri , Lewis S. Goldmann , Kimberley A. Kelly , Bouwe W. Leenstra , Voya R. Markovich , Eric D. Perfecto , Sampath Purushothaman , Joseph M. Sullivan
发明人： Chandrika Prasad , Roy Yu , Richard L. Canull , Giulio DiGiacomo , Ajay P. Giri , Lewis S. Goldmann , Kimberley A. Kelly , Bouwe W. Leenstra , Voya R. Markovich , Eric D. Perfecto , Sampath Purushothaman , Joseph M. Sullivan
IPC分类号： H05K334
CPC分类号： H01L21/6835 , H01L21/4857 , H01L23/16 , H01L23/49833 , H01L2221/68359 , H01L2221/68368 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H05K1/141 , H05K3/20 , H05K3/284 , H05K3/3436 , H05K3/467 , H05K7/023 , H05K2201/049 , H05K2201/10977 , H05K2201/2036 , H05K2203/0182 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49149 , Y10T29/49165 , Y10T29/49169 , Y10T29/49174 , Y10T29/49211 , Y10T29/49213 , H01L2924/00 , H01L2924/00014
摘要： A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.
摘要翻译：一种用于安装电子设备的结构。该结构使用介于下面的载体和上覆薄膜之间的非导电的兼容间隔物。间隔件包括通孔的图形，其与载体和薄膜的相对表面上的相对互连匹配。以这种方式，焊接连接可以在通孔中延伸，以将薄膜电连接到载体上并平滑地形。在用于形成结构的相关方法中，薄膜建立在第一牺牲载体上，然后在第二牺牲载体上进一步处理，以防止其在其加工期间变形，膨胀或以其它方式受到不利影响。使用封闭的焊料接合工艺形成薄膜和载体之间的焊接连接。间隔件与层压卡一起使用以在携带薄膜的卡的部分上产生热应力释放结构。

3. 发明授权

US06281452B1 Multi-level thin-film electronic packaging structure and related method 失效
标题翻译：多层薄膜电子封装结构及相关方法
公开(公告)号：US06281452B1
公开(公告)日：2001-08-28
申请号：US09204851
申请日：1998-12-03
申请人： Chandrika Prasad , Roy Yu , Richard L. Canull , Giulio DiGiacomo , Ajay P. Giri , Lewis S. Goldmann , Kimberley A. Kelly , Bouwe W. Leenstra , Voya R. Markovich , Eric D. Perfecto , Sampath Purushothaman , Joseph M. Sullivan
发明人： Chandrika Prasad , Roy Yu , Richard L. Canull , Giulio DiGiacomo , Ajay P. Giri , Lewis S. Goldmann , Kimberley A. Kelly , Bouwe W. Leenstra , Voya R. Markovich , Eric D. Perfecto , Sampath Purushothaman , Joseph M. Sullivan
IPC分类号： H01R1204
CPC分类号： H01L21/6835 , H01L21/4857 , H01L23/16 , H01L23/49833 , H01L2221/68359 , H01L2221/68368 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H05K1/141 , H05K3/20 , H05K3/284 , H05K3/3436 , H05K3/467 , H05K7/023 , H05K2201/049 , H05K2201/10977 , H05K2201/2036 , H05K2203/0182 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49149 , Y10T29/49165 , Y10T29/49169 , Y10T29/49174 , Y10T29/49211 , Y10T29/49213 , H01L2924/00 , H01L2924/00014
摘要： A structure for mounting electronic devices which uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern of through-vias which matches opposing interconnects on opposing surfaces of the carrier and the thin film. In this way, solder connections can extend in the through-vias to electrically connect the thin film to the carrier and smooth out topography. In a related process for forming the structure, the thin film is built on a first sacrificial carrier and then further processed on a second sacrificial carrier to keep it from distorting, expanding, or otherwise suffering adversely during its processing. The solder connections between the thin film and the carrier are formed using a closed solder joining process. The spacer is used with laminate cards to create thermal stress release structures on portions of the cards carrying a thin film.
摘要翻译：一种用于安装电子器件的结构，其使用插入在下面的载体和上覆薄膜之间的非导电兼容间隔物。间隔件包括通孔的图形，其与载体和薄膜的相对表面上的相对互连匹配。以这种方式，焊接连接可以在通孔中延伸，以将薄膜电连接到载体上并平滑地形。在用于形成结构的相关方法中，薄膜建立在第一牺牲载体上，然后在第二牺牲载体上进一步处理，以防止其在其加工期间变形，膨胀或以其它方式受到不利影响。使用封闭的焊料接合工艺形成薄膜和载体之间的焊接连接。间隔件与层压卡一起使用以在携带薄膜的卡的部分上产生热应力释放结构。

4. 发明授权

US06497805B2 Method for shorting pin grid array pins for plating 失效
标题翻译：短路针格阵列针电镀方法
公开(公告)号：US06497805B2
公开(公告)日：2002-12-24
申请号：US09758324
申请日：2001-01-12
申请人： Arden S. Lake , Emanuele F. Lopergolo , Joseph M. Sullivan
发明人： Arden S. Lake , Emanuele F. Lopergolo , Joseph M. Sullivan
IPC分类号： C25D500
CPC分类号： H01L23/58 , C25D7/00 , G01R3/00 , H01L21/4853 , H01L2924/0002 , H01L2924/00
摘要： A method, system and structure for a pin grid or pad grid array structure includes a plurality of pins connected to an electronic structure, a power plane within the electronic structure electrically connected to power pins, a ground plane within the electronic structure, and fuse portions electrically connecting the ground plane to ground pins and signal pins. The power plane and the ground plane create a charge in the pins during electroplating of the pins. The fuse portions disconnecting the signal pins from the ground plane after the electroplating.
摘要翻译：针栅格或焊盘格栅阵列结构的方法，系统和结构包括连接到电子结构的多个引脚，电连接到电源引脚的电子结构内的电源平面，电子结构内的接地平面和熔丝部分将接地层电连接到接地引脚和信号引脚。电源平面和接地平面在引脚电镀期间在引脚上产生电荷。保险丝部分在电镀之后将信号引脚与地平面断开。

5. 发明授权

US5729148A Probe assembly 失效
标题翻译：探头装配
公开(公告)号：US5729148A
公开(公告)日：1998-03-17
申请号：US672877
申请日：1996-06-28
申请人： Joseph M. Sullivan , Emanuele F. Lopergolo
发明人： Joseph M. Sullivan , Emanuele F. Lopergolo
IPC分类号： G01R1/04 , G01R1/073 , G01R31/02
CPC分类号： G01R1/04 , G01R1/07378
摘要： A probe assembly comprising a frame and at least one contact carrier within the frame wherein the carrier has a plurality of tie strips and a plurality of contacts and each contact is contiguous with a corresponding group of tie strips. Each contact becomes discontiguous from the corresponding group of tie strips when a force is applied to the tie strips. The probe assembly further comprising at least two rails attached to the frame. Each rail has a top portion for receiving the contacts and tie strips and a bottom portion having a plurality of regions for contacting the tie strips. The carrier is positioned between the top portion of one of the rails and the bottom portion of the other rail. When a compressive force is applied to the rails and carrier, the regions forcibly contact the tie strips such that all the contacts simultaneously become discontiguous from the tie strips.
摘要翻译：一种探针组件，包括框架和框架内的至少一个接触载体，其中所述载体具有多个连接条和多个触点，并且每个触点与相应的一组连接条相邻。当将力施加到连接条上时，每个接触件从相应的连接带组中变得不连续。所述探针组件还包括连接到所述框架的至少两个导轨。每个轨道具有用于接收触头和连接条的顶部部分和具有用于接合连接条带的多个区域的底部部分。载体位于轨道之一的顶部和另一个轨道的底部之间。当对轨道和载体施加压缩力时，区域强制地接触连接条，使得所有触点同时从连接带变得不连续。

6. 发明申请

US20080285964A1 Modular heating system for tankless water heater 有权
标题翻译：无罐式热水器模块化加热系统
公开(公告)号：US20080285964A1
公开(公告)日：2008-11-20
申请号：US12151675
申请日：2008-05-07
申请人： Joseph M. Sullivan
发明人： Joseph M. Sullivan
IPC分类号： F24H1/10 , H05B1/02
CPC分类号： H05B3/78 , F24H1/142 , F24H9/2028
摘要： There is provided a tankless water heater for heating water passing therethrough. The tankless water heater includes a control module with a controller and a heating system, each of which are configured in a modular/separate arrangement. The heating system includes an inlet portion, an outlet portion, and a modular heater interconnected therebetween. The modular heater comprises a plurality of heating units, each heating unit comprising a heating tube and a coupler, wherein each heating tube defines an interior region and each heating tube includes a helical structure whereby the helical structure imparts a swirling motion on water passing through the interior region of the tube. A heating element is also disposed within the interior region of the heating tube, and electric power applied to the heating element acts to heat the water passing through the tube. A first temperature sensor may be positioned so as to detect water temperature proximate the inlet portion, and the first temperature sensor is in communication with the controller. Also, a second temperature sensor positioned so as to detect water temperature proximate the outlet portion, and the second temperature sensor is in communication with the controller. Additionally, a flow meter is positioned proximate the inlet portion, and the flow meter, which detects fluid flow (and thereby fluid volume), is in communication with the controller. The controller, receiving the signals from the temperature sensors and the flow meter, directs signals to switches positioned at each tube so as to apply electric current to the heating elements.
摘要翻译：提供了一种用于加热穿过其中的水的无罐式热水器。无罐式热水器包括具有控制器和加热系统的控制模块，每个控制器配置为模块化/单独配置。加热系统包括入口部分，出口部分和在它们之间互连的模块式加热器。模块化加热器包括多个加热单元，每个加热单元包括加热管和耦合器，其中每个加热管限定内部区域，每个加热管包括螺旋结构，由此螺旋结构在通过管的内部区域。加热元件还设置在加热管的内部区域内，并且施加到加热元件的电力用于加热通过管的水。可以将第一温度传感器定位成检测入口部分附近的水温，并且第一温度传感器与控制器连通。而且，第二温度传感器被定位以便检测靠近出口部分的水温，而第二温度传感器与控制器连通。此外，流量计位于入口部分附近，并且检测流体流量（从而流体体积）的流量计与控制器连通。接收来自温度传感器和流量计的信号的控制器将信号引导到位于每个管的开关，以便向加热元件施加电流。

7. 发明授权

US07088915B1 Modular tankless water heater 失效
标题翻译：模块式无罐热水器
公开(公告)号：US07088915B1
公开(公告)日：2006-08-08
申请号：US11360124
申请日：2006-02-23
申请人： William R. Sturm , Joseph M. Sullivan , Thomas J. Shortland , Kevin Hay , Gregg C. Johnson
发明人： William R. Sturm , Joseph M. Sullivan , Thomas J. Shortland , Kevin Hay , Gregg C. Johnson
IPC分类号： F24H1/10
CPC分类号： F24H9/2028 , F24H1/102
摘要： A tankless water heater module is disclosed and includes a casing having a first end, a second end and a plurality of conduits formed therein. A top head manifold is coupled to the first end of the casing and includes a port aligned with each of the plurality of conduits. A bottom head manifold is coupled to the second end of the casing and includes a port aligned with each of the plurality of conduits. An immersion heating element extends through each port of the top head manifold and into the conduit aligned therewith. A flow path extends through the plurality of conduits, the plurality of conduits coupled in fluid communication by channels between ports of the top head manifold and a channel between ports of the bottom head manifold.
摘要翻译：公开了一种无罐式热水器模块，并且包括具有形成在其中的第一端，第二端和多个导管的壳体。顶部歧管联接到壳体的第一端并且包括与多个管道中的每一个对准的端口。底部头歧管联接到壳体的第二端并且包括与多个管道中的每一个对准的端口。浸没式加热元件延伸穿过顶部头部歧管的每个端口并且与其对齐。流路延伸穿过多个管道，多个管道通过顶部歧管的端口和底部歧管的端口之间的通道之间的通道流体连通地连接。

8. 发明授权

US07046922B1 Modular tankless water heater 失效
公开(公告)号：US07046922B1
公开(公告)日：2006-05-16
申请号：US11080300
申请日：2005-03-15
申请人： William R. Sturm , Joseph M. Sullivan , Thomas J. Shortland , Kevin Hay , Gregg C. Johnson
发明人： William R. Sturm , Joseph M. Sullivan , Thomas J. Shortland , Kevin Hay , Gregg C. Johnson
IPC分类号： F24H1/10
CPC分类号： F24H9/2028 , F24H1/102
摘要： A tankless water heater module is disclosed and includes a casing having a first end, a second end and a plurality of conduits formed therein. A top head manifold is coupled to the first end of the casing and includes a port aligned with each of the plurality of conduits. A bottom head manifold is coupled to the second end of the casing and includes a port aligned with each of the plurality of conduits. An immersion heating element extends through each port of the top head manifold and into the conduit aligned therewith. A flow path extends through the plurality of conduits, the plurality of conduits coupled in fluid communication by channels between ports of the top head manifold and a channel between ports of the bottom head manifold.

9. 发明授权

US06214180B1 Method for shorting pin grid array pins for plating 失效
标题翻译：短路针格阵列针电镀方法
公开(公告)号：US06214180B1
公开(公告)日：2001-04-10
申请号：US09257816
申请日：1999-02-25
申请人： Arden S. Lake , Emanuele F. Lopergolo , Joseph M. Sullivan
发明人： Arden S. Lake , Emanuele F. Lopergolo , Joseph M. Sullivan
IPC分类号： C25D1700
CPC分类号： H01L23/58 , C25D7/00 , G01R3/00 , H01L21/4853 , H01L2924/0002 , H01L2924/00
摘要： A method, system and structure for a pin grid or pad grid array structure includes a plurality of pins connected to an electronic structure, a power plane within the electronic structure electrically connected to power pins, a ground plane within the electronic structure, and fuse portions electrically connecting the ground plane to ground pins and signal pins. The power plane and the ground plane create a charge in the pins during electroplating of the pins. The fuse portions disconnecting the signal pins from the ground plane after the electroplating.
摘要翻译：针栅格或焊盘格栅阵列结构的方法，系统和结构包括连接到电子结构的多个引脚，电连接到电源引脚的电子结构内的电源平面，电子结构内的接地平面和熔丝部分将接地层电连接到接地引脚和信号引脚。电源平面和接地平面在引脚电镀期间在引脚上产生电荷。保险丝部分在电镀之后将信号引脚与地平面断开。

10. 发明授权

US08165461B2 Modular heating system for tankless water heater 有权
标题翻译：无罐式热水器模块化加热系统
公开(公告)号：US08165461B2
公开(公告)日：2012-04-24
申请号：US12151675
申请日：2008-05-07
申请人： Joseph M. Sullivan
发明人： Joseph M. Sullivan
IPC分类号： F24H1/10
CPC分类号： H05B3/78 , F24H1/142 , F24H9/2028
摘要： There is provided a tankless water heater for heating water passing therethrough. The modular heater comprises a plurality of heating units, each heating unit comprising a heating tube and a coupler, wherein each heating tube defines an interior region and each heating tube includes a helical structure whereby the helical structure imparts a swirling motion on water passing through the interior region of the tube. A heating element is also disposed within the interior region of the heating tube, and electric power applied to the heating element acts to heat the water passing through the tube. Temperature sensors may be positioned so as to detect water temperature proximate the inlet portion, and the outlet portion. Additionally, a flow meter is positioned proximate the inlet portion. The controller directs signals to switches positioned at each tube so as to apply electric current to the heating elements.
摘要翻译：提供了一种用于加热穿过其中的水的无罐式热水器。模块化加热器包括多个加热单元，每个加热单元包括加热管和耦合器，其中每个加热管限定内部区域，每个加热管包括螺旋结构，由此螺旋结构在通过管的内部区域。加热元件还设置在加热管的内部区域内，并且施加到加热元件的电力用于加热通过管的水。温度传感器可以被定位以便检测靠近入口部分和出口部分的水温。此外，流量计位于入口部分附近。控制器将信号引导到位于每个管的开关，以便向加热元件施加电流。

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