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1. 发明授权

US08198551B2 Power core for use in circuitized substrate and method of making same 有权
标题翻译：用于电路化基板的电源芯及其制造方法
公开(公告)号：US08198551B2
公开(公告)日：2012-06-12
申请号：US12782187
申请日：2010-05-18
申请人： Robert M. Japp , Kostas Papathomas , John Steven Kresge , Timothy Antesberger
发明人： Robert M. Japp , Kostas Papathomas , John Steven Kresge , Timothy Antesberger
IPC分类号： H05K1/11
CPC分类号： H05K3/4641 , H05K3/4617 , H05K2201/068 , Y10T29/49117
摘要： A power core adapted for use as part of a circuitized substrate, e.g., a PCB or LCC. The core includes a first layer of low expansion dielectric and two added layers of a different low expansion dielectric bonded thereto, with two conductive layers positioned on the two added low expansion dielectric layers. At least one of the conductive layers serves as a power plane for the power core, which in turn is usable within a circuitized substrate, also provided. Methods of making the power core and circuitized substrate are also provided. The use of different low expansion dielectric materials for the power core enables the use of support enhancing fiberglass in one layer while such use is precluded in the other two dielectric layers, thus preventing CAF shorting problems in highly precisely defined thru holes formed within the power core.
摘要翻译：适于用作电路化基板（例如PCB或LCC）的一部分的电源核心。芯包括第一层低膨胀电介质和两个相邻的不同的低膨胀电介质结合的层，其中两个导电层位于两个添加的低膨胀介电层上。导电层中的至少一个用作功率芯的功率平面，而功率芯也可以在电路化的衬底内使用。还提供了制造电源芯和电路化基板的方法。使用不同的低膨胀电介质材料用于电源芯可以在一层中使用支撑增强玻璃纤维，而在其他两个电介质层中排除这种用途，从而防止形成在功率芯内的高度精确定义的通孔中的CAF短路问题。

2. 发明申请

US20110284273A1 POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME 有权
标题翻译：在电路基板中使用的电源芯及其制造方法
公开(公告)号：US20110284273A1
公开(公告)日：2011-11-24
申请号：US12782187
申请日：2010-05-18
申请人： Robert M. Japp , Kostas Papathomas , John S. Kresge , Timothy Antesberger
发明人： Robert M. Japp , Kostas Papathomas , John S. Kresge , Timothy Antesberger
IPC分类号： H05K1/09 , H05K1/00 , H01R43/00 , H05K1/11
CPC分类号： H05K3/4641 , H05K3/4617 , H05K2201/068 , Y10T29/49117
摘要： A power core adapted for use as part of a circuitized substrate, e.g., a PCB or LCC. The core includes a first layer of low expansion dielectric and two added layers of a different low expansion dielectric bonded thereto, with two conductive layers positioned on the two added low expansion dielectric layers. At least one of the conductive layers serves as a power plane for the power core, which in turn is usable within a circuitized substrate, also provided. Methods of making the power core and circuitized substrate are also provided. The use of different low expansion dielectric materials for the power core enables the use of support enhancing fiberglass in one layer while such use is precluded in the other two dielectric layers, thus preventing CAF shorting problems in highly precisely defined thru holes formed within the power core.
摘要翻译：适于用作电路化基板（例如PCB或LCC）的一部分的电源核心。芯包括第一层低膨胀电介质和两个相邻的不同的低膨胀电介质结合的层，其中两个导电层位于两个添加的低膨胀介电层上。导电层中的至少一个用作功率芯的功率平面，而功率芯也可以在电路化的衬底内使用。还提供了制造电源芯和电路化基板的方法。使用不同的低膨胀电介质材料用于电源芯可以在一层中使用支撑增强玻璃纤维，而在其他两个电介质层中排除这种用途，从而防止形成在功率芯内的高度精确定义的通孔中的CAF短路问题。

3. 发明授权

US06207595B1 Laminate and method of manufacture thereof 失效
标题翻译：层压板及其制造方法
公开(公告)号：US06207595B1
公开(公告)日：2001-03-27
申请号：US09033505
申请日：1998-03-02
申请人： Bernd K. Appelt , Lawrence R. Blumberg , William T. Fotorny , Ross D. Havens , Robert M. Japp , Kostas Papathomas , Jan Obrzut , Mark D. Poliks , Amarjit S. Rai
发明人： Bernd K. Appelt , Lawrence R. Blumberg , William T. Fotorny , Ross D. Havens , Robert M. Japp , Kostas Papathomas , Jan Obrzut , Mark D. Poliks , Amarjit S. Rai
IPC分类号： B32B2704
CPC分类号： H01L23/564 , H01L23/08 , H01L23/145 , H01L2924/0002 , H05K1/0366 , H05K2201/029 , H05K2201/0761 , Y10T442/2475 , Y10T442/2959 , Y10T442/2992 , H01L2924/00
摘要： A fabric material and method of its manufacture suitable for use in electronic packages including chip carriers. High insulation resistance is exhibited when subjected to high temperatures and humidity stress conditions.
摘要翻译：一种其制造的织物材料及其制造方法，其适用于包括芯片载体的电子封装。当受到高温和高湿度条件的影响时，表现出高的绝缘电阻。

4. 发明申请

US20090175000A1 Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same 有权
标题翻译：具有减少热膨胀的无卤素电路化基板，其制造方法，利用其的多层基板结构以及利用其的信息处理系统
公开(公告)号：US20090175000A1
公开(公告)日：2009-07-09
申请号：US12380618
申请日：2009-03-02
申请人： Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
发明人： Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
IPC分类号： H05K7/00 , H05K3/30
CPC分类号： H05K3/4688 , H01L23/145 , H01L23/3733 , H01L23/49833 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/3011 , H05K1/0366 , H05K1/0373 , H05K3/4652 , H05K3/4655 , H05K2201/0209 , H05K2201/0278 , H05K2201/09309 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , H01L2224/0401
摘要： A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.
摘要翻译：一种电路化基板，包括复合层，该复合层包括由不含卤素的树脂和分散在其中的纤维构成的第一介电子层和不含纤维的第二电介质子层，并且还包括无卤素树脂和无机颗粒。还提供了制造这种基板的方法，以及包括一个或多个这样的电路化基板的多层组件，可能与其它基板组合。还提供了设计用于具有一个或多个这样的电路化基板的信息处理系统。

5. 发明申请

US20090173426A1 Multilayered circuitized substrate with p-aramid dielectric layers and method of making same 失效
标题翻译：具有对芳族聚酰胺介电层的多层电路基板及其制造方法
公开(公告)号：US20090173426A1
公开(公告)日：2009-07-09
申请号：US12380617
申请日：2009-03-02
申请人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
发明人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
IPC分类号： B32B37/12 , B44C1/22
CPC分类号： H01L23/145 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2924/0002 , H01L2924/12044 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068 , Y10T29/4913 , Y10T156/10 , H01L2924/00
摘要： A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.
摘要翻译：一种多层电路化基板，包括多个介电层，每个电介质层由浸渍有不含卤素的低吸湿性树脂的对芳族聚酰胺纸构成，所述不含卤素的低吸湿性树脂包括无机填料，但不包括连续或半连续的玻璃纤维作为其一部分，电路层位于第一介电层上。还提供了制造该基板的方法。

6. 发明申请

US20080191354A1 Circuitized substrate with p-aramid dielectric layers and method of making same 失效
标题翻译：具有对位芳族聚酰胺介电层的电路基板及其制造方法
公开(公告)号：US20080191354A1
公开(公告)日：2008-08-14
申请号：US12081051
申请日：2008-04-10
申请人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
发明人： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
IPC分类号： H01L23/50 , H05K3/30
CPC分类号： H01L23/145 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068 , Y10T29/4913 , H01L2224/0401
摘要： A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided.
摘要翻译：一种电路化基板，包括具有浸渍有无卤低吸湿树脂的对芳族聚酰胺纸，并且不包括作为其一部分的连续或半连续玻璃纤维纤维的介电层和位于介电层上的第一电路层。还提供了制造该基板的方法。

7. 发明申请

US20080168651A1 Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein 有权
标题翻译：在其中提供具有边缘连接部分和/或多个空腔的印刷电路板的方法
公开(公告)号：US20080168651A1
公开(公告)日：2008-07-17
申请号：US11652633
申请日：2007-01-12
申请人： Ashwinkumar C. Bhatt , Robert J. Harendza , Robert M. Japp
发明人： Ashwinkumar C. Bhatt , Robert J. Harendza , Robert M. Japp
IPC分类号： H05K3/36
CPC分类号： H05K1/117 , H05K1/112 , H05K3/4611 , H05K2201/09127 , H05K2201/0919 , H05K2201/09472 , H05K2201/09845 , H05K2203/061 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165 , Y10T29/49169
摘要： A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each opening including a cover member located therein. During lamination, the cover members for a seal and prevent dielectric material (e.g., resin) liquefied during the lamination from contacting the conductive layers on the opposed surfaces of the inner (first) substrate. A PCB is thus formed with either a projecting edge portion or a plurality of cavities therein such that electrical connection may be made to the PCB using an edge connector or the like.
摘要翻译：制造印刷电路板的方法，其中至少三个基板被对准并结合在一起（例如，使用层压）。两个基板具有形成在其中的开口，每个开口包括位于其中的盖构件。在层压期间，用于密封和防止介电材料（例如树脂）的盖构件在层压期间液化以接触内（第一）衬底的相对表面上的导电层。因此，PCB在其中形成有突出边缘部分或多个空腔，使得可以使用边缘连接器等对PCB进行电连接。

8. 发明授权

US06996903B2 Formation of multisegmented plated through holes 失效
公开(公告)号：US06996903B2
公开(公告)日：2006-02-14
申请号：US10641182
申请日：2003-08-14
申请人： Donald S. Farquhar , Robert M. Japp , John M. Lauffer , Konstantinos I. Papathomas
发明人： Donald S. Farquhar , Robert M. Japp , John M. Lauffer , Konstantinos I. Papathomas
IPC分类号： H01K3/10
CPC分类号： H05K3/429 , H05K2201/0187 , H05K2201/096 , H05K2201/09645 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917
摘要： A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole is formed through the substrate. The through hole passes through nonplatable dielectric material within the dielectric layer. As a result, subsequent seeding and electroplating of the through hole results in a conductive metal plating forming at a wall of the through hole on a segment of the first laminate layer and on a segment of the second laminate layer, but not on the nonplatable dielectric material of the dielectric layer. Thus, the conductive metal plating is not continuous from the first laminate layer to the second laminate layer.

9. 发明授权

US06834426B1 Method of fabricating a laminate circuit structure 失效
标题翻译：制造层叠电路结构的方法
公开(公告)号：US06834426B1
公开(公告)日：2004-12-28
申请号：US09625135
申请日：2000-07-25
申请人： Robert M. Japp , Gregory A. Kevern , William J. Rudik
发明人： Robert M. Japp , Gregory A. Kevern , William J. Rudik
IPC分类号： H05K320
CPC分类号： H05K3/4641 , H05K3/4069 , H05K3/445 , H05K3/4614 , H05K2201/09536 , H05K2201/096 , H05K2201/09881 , H05K2201/10378 , Y10T29/49126 , Y10T29/49128 , Y10T29/49165
摘要： A method for fabricating a laminate circuit structure is provided. The method comprises: providing at least two modularized circuitized voltage plane subassemblies wherein each of the subassemblies comprise at least two signal planes having an external and internal surface disposed about an internal voltage plane; providing a dielectric material between the signal and voltage planes; and providing dielectric on each external surface of each signal plane; and providing a non-cured or partially cured curable dielectric composition between the subassemblies wherein the dielectric composition comprises, dielectric material that is of the same material as the dielectric material used in said subassemblies, aligning the subassemblies, and then laminating to cause bonding of the subassemblies.
摘要翻译：提供一种制造叠层电路结构的方法。该方法包括：提供至少两个模块化的电路化电压平面子组件，其中每个子组件包括至少两个具有围绕内部电压平面设置的外部和内部表面的信号平面; 在信号和电压平面之间提供介电材料; 并在每个信号平面的每个外表面上提供电介质; 并且在所述子组件之间提供未固化或部分固化的可固化电介质组合物，其中所述电介质组合物包括与所述子组件中使用的介电材料具有相同材料的介电材料，对准所述子组件，然后层压以引起子组件

10. 发明授权

US06459047B1 Laminate circuit structure and method of fabricating 失效
标题翻译：层压电路结构及其制造方法
公开(公告)号：US06459047B1
公开(公告)日：2002-10-01
申请号：US09947130
申请日：2001-09-05
申请人： Robert M. Japp , Voya R. Markovich , Konstantinos I. Papathomas
发明人： Robert M. Japp , Voya R. Markovich , Konstantinos I. Papathomas
IPC分类号： H05K109
CPC分类号： H05K3/382 , H05K1/056 , H05K3/383 , H05K3/384 , H05K3/388 , H05K3/389 , H05K3/445 , H05K2201/0209 , H05K2201/0355 , H05K2203/0307 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A substrate and a method of making the substrate is provided. The substrate includes a layer of metal with at least one through hole therein, the layer of metal having an adhesion promoting layer thereon. A layer of a partially cured low-loss polymer or polymer precursor is positioned on the adhesion promoting layer and a plurality of conductive circuit lines are positioned on a portion of the partially cured dielectric layer. The substrate can be used as a building block in the fabrication of a multilayered printed circuit board.
摘要翻译：提供了基板和制造基板的方法。衬底包括金属层，其中具有至少一个通孔，金属层在其上具有粘附促进层。部分固化的低损失聚合物或聚合物前体层位于粘附促进层上，并且多个导电电路线位于部分固化的介电层的一部分上。衬底可以用作制造多层印刷电路板的构件。

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