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1. 发明授权

US06896421B2 Method and apparatus for assembly of an optoelectronic device with an optical connector 失效
标题翻译：用于组装具有光学连接器的光电子器件的方法和装置
公开(公告)号：US06896421B2
公开(公告)日：2005-05-24
申请号：US10375570
申请日：2003-02-26
申请人： Robert J. Monson , Richard L. Cellini , Jianhua Yan , Thomas Derco , Charles Kryzak , Brian Leininger
发明人： Robert J. Monson , Richard L. Cellini , Jianhua Yan , Thomas Derco , Charles Kryzak , Brian Leininger
IPC分类号： G02B6/42 , G02B6/43 , G02B6/00
CPC分类号： G02B6/4228 , G02B6/4239
摘要： A method of positioning an optoelectronic device, for example a vertical cavity surface emitting laser, onto an optical fiber connector and maintaining that exact alignment while testing the quality of the optical output prior to applying an adhesive to make the interface permanent. The method includes the utilization of a multi-piece fixture which clamps the elements into position, allows for testing, and provides a fixture to maintain position throughout the curing process.
摘要翻译：将光电子器件（例如垂直腔表面发射激光器）定位到光纤连接器上并在施加粘合剂以使接口永久化之前测试光输出的质量的同时保持精确对准的方法。该方法包括使用将元件夹持在适当位置的多片固定装置，允许测试，并提供固定装置以在整个固化过程中保持位置。

2. 发明申请

US20050225864A1 LENS ARRAY PACKAGE AND FABRICATION METHOD 有权
标题翻译：镜头阵列和制造方法
公开(公告)号：US20050225864A1
公开(公告)日：2005-10-13
申请号：US10815908
申请日：2004-03-31
申请人： William Kornrumpf , Samhita Dasgupta , Brian Leininger , Charles Kryzak
发明人： William Kornrumpf , Samhita Dasgupta , Brian Leininger , Charles Kryzak
IPC分类号： G02B3/00 , G02B6/42 , G02B6/43 , G02B7/02 , G02B27/10 , H01S5/00 , H01S5/42
CPC分类号： G02B3/0075 , G02B6/4206 , G02B6/4228 , G02B6/43 , H01S5/005 , H01S5/02284 , H01S5/423
摘要： An optical lens structure includes a substantially transparent substrate a lens array attached to the substrate with lenses of the lens array situated opposite the substrate and packaging material surrounding at least the periphery of the lens array, the packaging material including at least two alignment holes which are aligned with respect to positions of the lenses. In one example, the structure is fabricated by attaching a lens array to a substrate with lenses of the lens array situated opposite the substrate, surrounding a periphery of the lens array with a packaging material, the packaging material being attached to the substrate, planarizing the packaging material, and providing alignment holes through the packaging material.
摘要翻译：光学透镜结构包括基本上透明的基板，透镜阵列，其附接到基板，透镜阵列的透镜位于与基板相对的透镜阵列和至少围绕透镜阵列周围的包装材料上，该包装材料包括至少两个对准孔，对准镜片的位置。在一个示例中，通过将透镜阵列附接到基底上而制造结构，透镜阵列的透镜位于与基底相对的透镜阵列周围，用包装材料围绕透镜阵列的外围，该包装材料附着到基底上，包装材料，并且通过包装材料提供对准孔。

3. 发明授权

US06301247B1 Pad and cable geometries for spring clip mounting and electrically connecting flat flexible multiconductor printed circuit cables to switching chips on spaced-parallel planar modules 有权
标题翻译：用于弹簧夹安装的焊盘和电缆几何形状，并将扁平柔性多导体印刷电路电缆电连接到间隔平行平面模块上的切换芯片
公开(公告)号：US06301247B1
公开(公告)日：2001-10-09
申请号：US09426501
申请日：1999-10-26
申请人： Brian Ralph Larson , Charles Kryzak
发明人： Brian Ralph Larson , Charles Kryzak
IPC分类号： H04L1250
CPC分类号： H04L49/45 , H04L49/1515 , H04L49/309 , H04L2012/5627
摘要： Dense physical and electrical connection of (i) flat flexible multiconductor cables of the printed circuit or ribbon types, to (ii) to spaced-parallel planar modules, particularly to switching modules containing switching chips, is realized by (1) a particular connection geometry in combination with (2) a spring clip connector. Flat flexible multiconductor cables routed through free space either in (i) “X” and, optionally also, “Z” planes, or else in (ii) “Y” planes exclusively, have their conductors' ends stripped and bent 90° so as to lie upon conductive pads, arrayed along lines angled 45° to both the “X” and “Y” planes, located on the substrates of switching modules that are within “Z” planes. A substantially square, substantially planar, spring clip mounts and re-mounts to the substrate by, preferably, two tabs fitting in a corresponding two holes in the substrate, so as to hold exposed conductor ends of each cable bent 90° compressively against a portion of the arrayed conductive pads, making electrical connections.
摘要翻译：（i）印刷电路或色带类型的扁平柔性多导体电缆的密集物理和电气连接，通过（1）特定的连接几何形状实现（ii）到间隔平行的平面模块，特别是包含开关芯片的开关模块与（2）弹簧夹连接器组合。扁平柔性多导体电缆通过（i）“X”和（可选地）“Z”平面或另外在（ii）“Y”平面中的自由空间布线，其导线端部被剥离并弯曲90°，以便位于导电焊盘上，沿着与“Z”平面内的开关模块的基板上的“X”和“Y”平面成45°角的线排列。基本上为方形的，基本上平面的弹簧夹通过优选地安装在衬底中并重新安装到衬底，优选地，两个接头嵌合在衬底中的相应的两个孔中，以便将每个电缆弯曲90°的每个电缆的暴露的导体端部压缩抵抗部分的阵列导电焊盘，进行电气连接。

4. 发明授权

US06504841B1 Three-dimensional interconnection geometries for multi-stage switching networks using flexible ribbon cable connection between multiple planes 失效
标题翻译：用于多层交换网络的三维互连几何，使用多个平面之间的柔性带状电缆连接
公开(公告)号：US06504841B1
公开(公告)日：2003-01-07
申请号：US09426466
申请日：1999-10-26
申请人： Brian Ralph Larson , Charles Kryzak
发明人： Brian Ralph Larson , Charles Kryzak
IPC分类号： H04L1250
CPC分类号： H04L49/45 , H04L49/1515 , H04L49/309 , H04L2012/5627
摘要： Scalable Computer Interconnect (CSI) compliant multi-stage switching networks compactly electrically communicatively interconnect a large number N of electrically communicating devices, typically computers or memories, in three-dimensional space. The logic networks, including a preferred “layered network” of U.S. Pat. No. 4,833,468, are (i) rotated, (ii) folded and (iii) squared per companion U.S. Pat. No. 6,301,247 so as to assume optimal topology. The topologically-optimized switching network logic is physically realized as (i) planar panels each mounting multi-chip modules, or tiles, each having logic switchpoints each realized by switch dice, plus vias through the tiles, plus pads upon both sides of the tiles, plus connective wiring layers upon the tile, connected by (ii) multi-conductor flexible flat printed circuit cables located between the adjacent panels. System peak performance is 24 teraflops/second.
摘要翻译：可扩展计算机互连（CSI）兼容的多级交换网络在三维空间中紧密地电通信地将大量N个电通信设备（通常为计算机或存储器）互连。逻辑网络，包括美国专利的优选“分层网络” （i）旋转，（ii）折叠，（iii）每个伴侣美国专利。 6,301,247，以便采取最佳的拓扑结构。拓扑优化的交换网络逻辑在物理上实现为：（i）平面板，每个安装多个芯片模块或瓦片，每个具有逻辑切换点，每个逻辑切换点各自由开关骰子实现，加上通过瓦片的通孔，以及瓦片两侧的焊盘，以及瓦片上的连接布线层，由（ii）位于相邻面板之间的多导体柔性平面印刷电路电缆连接。系统峰值性能为24 teraflops /秒。

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