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1. 发明授权

US09240335B2 Wafer cleaning apparatus and wafer cleaning method using the same 有权
标题翻译：晶圆清洗装置及使用其的晶圆清洗方法
公开(公告)号：US09240335B2
公开(公告)日：2016-01-19
申请号：US13383201
申请日：2009-12-03
申请人： Robert Henry Pagliaro , Sung Ho Hong , Jin Tae Kim , Deok Ho Kim
发明人： Robert Henry Pagliaro , Sung Ho Hong , Jin Tae Kim , Deok Ho Kim
IPC分类号： B08B3/08 , H01L21/02 , H01L21/67
CPC分类号： H01L21/02052 , B08B3/08 , H01L21/67017
摘要： The object of the present invention is to provide a wafer cleaning apparatus that reduces the amount of dissolved oxygen, without using hydrogen peroxide, to be able to reduce the deformation, etc. of a wafer and to reduce silicon consumption and a wafer cleaning method using the same.The present invention provides a wafer cleaning apparatus comprising: a first thin film contactor that receives drug solution for removing an oxide film or ultra pure water to separate and discharge gas dissolved in the drug solution for removing the oxide film or the ultra pure water; a second thin film contactor that receives the drug solution for removing the oxide film or the ultra pure water discharged from the first thin film contactor; a vacuum pump that discharges gas separated in the first and second thin film contactors to the outside; and a process vessel that stores the drug solution for removing the oxide film or the ultra pure water discharged from the second thin film contactor, and a wafer cleaning method using the same.
摘要翻译：本发明的目的是提供一种在不使用过氧化氢的情况下减少溶解氧量能够减少晶片的变形等并减少硅消耗的晶圆清洗装置以及使用一样。本发明提供了一种晶片清洗装置，包括：第一薄膜接触器，其接收用于去除氧化膜或超纯水的药物溶液，以分离和排出溶解在药物溶液中的气体，以除去氧化膜或超纯水; 接收用于除去从第一薄膜接触器排出的氧化膜或超纯水的药液的第二薄膜接触器; 将在第一和第二薄膜接触器分离的气体排出到外部的真空泵; 以及存储用于除去从第二薄膜接触器排出的氧化膜或超纯水的药液的处理容器，以及使用其的晶片清洗方法。

2. 发明申请

US20120152276A1 WAFER CLEANING APPARATUS AND WAFER CLEANING METHOD USING THE SAME 有权
标题翻译： WAFER清洗装置和使用该方法的WAFER清洗方法
公开(公告)号：US20120152276A1
公开(公告)日：2012-06-21
申请号：US13383201
申请日：2009-12-03
申请人： Robert Henry Pagliaro , Sung Ho Hong , Jin Tac Kim , Deok Ho Kim
发明人： Robert Henry Pagliaro , Sung Ho Hong , Jin Tac Kim , Deok Ho Kim
IPC分类号： B08B3/08 , B01D19/00
CPC分类号： H01L21/02052 , B08B3/08 , H01L21/67017
摘要： The object of the present invention is to provide a wafer cleaning apparatus that reduces the amount of dissolved oxygen, without using hydrogen peroxide, to be able to reduce the deformation, etc. of a wafer and to reduce silicon consumption and a wafer cleaning method using the same.The present invention provides a wafer cleaning apparatus comprising: a first thin film contactor that receives drug solution for removing an oxide film or ultra pure water to separate and discharge gas dissolved in the drug solution for removing the oxide film or the ultra pure water; a second thin film contactor that receives the drug solution for removing the oxide film or the ultra pure water discharged from the first thin film contactor; a vacuum pump that discharges gas separated in the first and second thin film contactors to the outside; and a process vessel that stores the drug solution for removing the oxide film or the ultra pure water discharged from the second thin film contactor, and a wafer cleaning method using the same.
摘要翻译：本发明的目的是提供一种在不使用过氧化氢的情况下减少溶解氧量能够减少晶片的变形等并减少硅消耗的晶圆清洗装置以及使用一样。本发明提供了一种晶片清洗装置，包括：第一薄膜接触器，其接收用于去除氧化膜或超纯水的药物溶液，以分离和排出溶解在药物溶液中的气体，以除去氧化膜或超纯水; 接收用于除去从第一薄膜接触器排出的氧化膜或超纯水的药液的第二薄膜接触器; 将在第一和第二薄膜接触器分离的气体排出到外部的真空泵; 以及存储用于除去从第二薄膜接触器排出的氧化膜或超纯水的药液的处理容器，以及使用其的晶片清洗方法。

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