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1. 发明申请

US20150050418A1 CHANGING PRINTING CONTROL PARAMETERS BASED ON MEASURED SOLDER PASTE DEPOSITS IN CERTAIN SUBAREAS OF A PRINTED CIRCUIT BOARD 有权
标题翻译：根据印刷电路板某些子类中测量的焊膏沉积物改变打印控制参数
公开(公告)号：US20150050418A1
公开(公告)日：2015-02-19
申请号：US14302677
申请日：2014-06-12
申请人： Mathew GREER , Robert GRAY
发明人： Mathew GREER , Robert GRAY
IPC分类号： H05K3/12 , H05K3/00
CPC分类号： H05K3/1216 , B05D1/26 , B23K1/0016 , B23K3/0638 , B23K2101/42 , C23C2/006 , C23C2/08 , C23C2/10 , H05K3/0091 , H05K3/3478 , H05K3/3484 , H05K2203/163
摘要： It is described a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board (150, 250). The described method comprises (a) identifying first subareas (256, 258) of the printed circuit board (150, 250), which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), (b) identifying second subareas (252, 254) of the printed circuit board (150, 250), which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), wherein the first repeatability is smaller than the second repeatability, (c) transferring solder paste onto the printed circuit board (150, 250) at least at the second subareas (252, 254) of the printed circuit board (150, 250), (d) measuring the amount of solder paste which has been transferred to the second subareas (252, 254), and (e) changing the parameters for controlling a transfer of solder paste onto the printed circuit board (150, 250) in response to the measured amount of solder paste which has been transferred to the second subareas (252, 254). It is further described a corresponding processing device, a system comprising such a processing device and a computer program for controlling and/or for carrying out such a method.
摘要翻译：描述了一种用于改变用于控制焊膏转移到印刷电路板（150,250）上的参数的方法。所描述的方法包括（a）识别印刷电路板（150,250）的第一子区域（256,258），其相对于假定要传送到印刷电路板上的焊膏的量显示出第一可重复性（ 150,250），（b）识别印刷电路板（150,250）的第二子区域（252,254），其相对于假定要传送到印刷电路板上的焊膏的量显示出第二可重复性（150,250），其中所述第一重复性小于所述第二重复性，（c）至少在所述印刷电路板的所述第二子区（252,254）处将焊膏转移到所述印刷电路板（150,250）上（d）测量已经转移到第二子区（252,254）的焊膏的量，以及（e）改变用于控制焊膏向印刷电路板（150,250）的转移的参数， 250）响应于测量的溶胶量已经转移到第二子区（252,254）的糊状物。进一步描述相应的处理装置，包括这种处理装置的系统和用于控制和/或执行这种方法的计算机程序。

2. 发明申请

US20150283637A1 DEVICE AND METHOD FOR PRINTING A THIXOTROPIC MEDIUM ONTO A PCB 审中-公开
标题翻译：将印刷介质印刷到PCB上的装置和方法
公开(公告)号：US20150283637A1
公开(公告)日：2015-10-08
申请号：US14245401
申请日：2014-04-04
申请人： Robert GRAY , Gabriel de Jesus PARDAVE
发明人： Robert GRAY , Gabriel de Jesus PARDAVE
IPC分类号： B23K3/06 , B23K31/02 , B23K37/00 , B23K1/00 , B23K1/20
CPC分类号： H05K3/1233 , H05K3/3484
摘要： A device for printing a thixotropic medium onto a PCB comprising a printing head adapted to apply the thixotropic medium to a surface of the PCB is characterized in that the device further comprises a surface area where the thixotropic medium is locatable to be repeatably worked upon in a kneading operation during which at least a part of the thixotropic medium is kneaded while the printing head is not in use for applying the thixotropic medium onto the PCB.
摘要翻译：用于将触变介质印刷到PCB上的装置，其包括适于将触变介质施加到PCB的表面的打印头，其特征在于，所述装置还包括其中所述触变介质可定位成在其中重复加工的表面区域在打印头不用于将触变介质施加到PCB上时，至少一部分触变介质被捏合的捏合操作。

3. 发明申请

US20150027328A1 APPARATUS FOR PASTE MATERIAL PRINTING, AND PRINTING METHOD 有权
标题翻译：用于油料印刷和印刷方法的装置
公开(公告)号：US20150027328A1
公开(公告)日：2015-01-29
申请号：US13951637
申请日：2013-07-26
申请人： Robert GRAY
发明人： Robert GRAY
IPC分类号： B41F15/18
CPC分类号： B41F15/18 , B41F15/085 , B41F15/16 , B41M1/12 , B41P2215/00 , B41P2215/114 , H05K3/1216 , H05K3/1225
摘要： A screen printer 100 for paste material printing is disclosed herein. In a described embodiment, the screen printer 100 comprises a printing chamber 104; and a plurality of support members in the form of lifting tables 114, 116 arranged adjacent to one another along a single conveying path for individually supporting a respective PCB 202, 240 in the printing chamber 104. The screen printer 100 further includes a stencil 120 having a plurality of print patterns 124, 126 with each print pattern 124, 126 arranged adjacent to another print pattern to correspond to the positions of the lifting tables 114, 116 with each print pattern 124, 126 corresponding to a desired paste pattern to be printed onto the PCBs. The screen printer 100 also includes a paste printer arranged to print paste material on the at least one substrate using at least one of the print patterns. A screen printing method is also disclosed.
摘要翻译：本文公开了一种用于糊料印刷的丝网印刷机100。在所描述的实施例中，丝网印刷机100包括印刷室104; 以及沿着单个输送路径彼此相邻布置的升降台114,116的形式的多个支撑构件，用于单独地支撑印刷室104中的相应PCB 202,240。丝网印刷机100还包括具有多个打印图案124,126，其中每个打印图案124,126布置成与另一打印图案相邻，以对应于提升台114,116的位置，其中每个打印图案124,126对应于要打印的所需粘贴图案 PCBs。丝网印刷机100还包括粘贴印刷机，其布置成使用至少一个印刷图案将浆料材料印刷在至少一个基板上。还公开了丝网印刷方法。

4. 发明申请

US20140366756A1 CLEANING ASSEMBLY AND METHOD FOR A PASTE MATERIAL PRINTER 审中-公开
标题翻译：清洁组件和方法，用于膏料材料打印机
公开(公告)号：US20140366756A1
公开(公告)日：2014-12-18
申请号：US13920688
申请日：2013-06-18
申请人： Robert GRAY
发明人： Robert GRAY
IPC分类号： B41F15/06
CPC分类号： B41F15/06 , B41F15/0881 , B41F33/0027 , B41F33/0081 , B41F35/005 , B41P2235/21 , H05K1/0269 , H05K3/0008 , H05K3/1233 , H05K3/3478 , H05K2201/09918
摘要： A cleaning assembly 114 and cleaning method for a screen printer 100 for paste material printing is disclosed herein. In a described embodiment, the cleaning assembly 114 comprises an image capturing device having a fiducial camera 124 arranged to move to respective fiducial positions for performing fiducial recognition of a number of fiduciary markers 202,204 on the PCB 200 and on a stencil 112 of the screen printer 100; and a cleaning device in the form of a cleaning blade 128 that is arranged to clean the stencil 112 during the movement of the image capturing device 124.
摘要翻译：本文公开了清洁组件114和用于糊状材料印刷的丝网印刷机100的清洁方法。在所描述的实施例中，清洁组件114包括具有基准相机124的图像捕获装置，其被布置成移动到相应的基准位置，用于对PCB 200上的多个受信标记202,204以及丝网印刷机的模板112进行基准识别 100; 以及清洁刀片128形式的清洁装置，其被布置成在图像捕获装置124的移动期间清洁模板112。

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