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    • 4. 发明授权
    • Method for forming a sequence of crosslinked pigmented coatings on ceramic substrates
    • 在陶瓷基板上形成交联着色涂层序列的方法
    • US06214414B1
    • 2001-04-10
    • US09359471
    • 1999-07-22
    • Robert H. TangYingchao ZhangLouis J. NehmsmannAlan E. WangGeorge D. MorrisRobert A. Montague
    • Robert H. TangYingchao ZhangLouis J. NehmsmannAlan E. WangGeorge D. MorrisRobert A. Montague
    • B05D136
    • C03C17/3405C03C2217/445C03C2217/485
    • A method comprising heating to elevated temperature a ceramic substrate having thereon a sequence of coatings of pigmented coating compositions wherein each of said pigmented coating compositions comprises: (a) reactive organic resin which is polyhydroxy-functional, polyepoxy-functional, or both epoxy-functional and hydroxy-functional; (b) reactive wax; (c) color-imparting pigment; and (d) blocked polyisocyanate; wherein: (e) the pigmented coating composition of at least one coating of the sequence is substantially free of amino-functional curing agent; and (f) the pigmented coating composition of at least one other coating of the sequence further comprises amino-functional curing agent; to crosslink all of the pigmented coating compositions of the coatings of the sequence and to adhere the sequence to the ceramic substrate. The preferred ceramic substrates are glass bottles.The outermost coating of the sequence may optionally be overlain with a coating of substantially clear overcoating composition which comprises reactive organic resin which is polyhydroxy-functional, polyepoxy-functional, or both epoxy-functional and hydroxy-functional. Upon heating to the elevated curing temperature, the substantially clear overcoating composition is crosslinked together with the pigmented coating compositions.
    • 一种方法,包括将具有着色涂料组合物涂层序列的陶瓷基材加热到高温,其中每种所述着色涂料组合物包含:(a)反应性有机树脂,其为多羟基官能团,聚环氧官能团或环氧官能团 和羟基官能团; (b)活性蜡; (c)赋颜色剂; 和(d)封端的多异氰酸酯; 其中:(e)所述序列的至少一种涂层的着色涂料组合物基本上不含氨基官能的固化剂; 和(f)该序列的至少一种其它涂层的着色涂料组合物还包含氨基官能的固化剂; 以使所述序列的涂层的所有着色涂料组合物交联并将该序列粘附到陶瓷基材上。 优选的陶瓷基材是玻璃瓶。该顺序的最外涂层可以任选地与基本上透明的涂层组合物的涂层重叠,该涂层组合物包含反应性有机树脂,其是多羟基官能的,聚环氧官能的或环氧官能的和羟基官能的 。 加热至升高的固化温度后,基本上透明的外涂层组合物与着色涂料组合物一起交联。
    • 5. 发明授权
    • Inkjet printing media
    • 喷墨打印介质
    • US06340725B1
    • 2002-01-22
    • US09416154
    • 1999-10-11
    • Alan E. WangLouis J. NehmsmannSuk H. ChoRobert H. TangWilliam C. Allison
    • Alan E. WangLouis J. NehmsmannSuk H. ChoRobert H. TangWilliam C. Allison
    • C08L3326
    • B41M5/52B41M5/506B41M5/5218B41M5/5236B41M5/5245B41M5/5254Y10T428/31895
    • A printing medium comprising a substrate having at least one surface and a coating on the surface wherein the coating comprises: (a) binder comprising: (1) organic polymer which is substantially free of ammonium groups, (2) first cationic addition polymer consisting essentially of quaternary ammonium-containing mer units derived from addition monomer and ammonium-free mer units derived from addition monomer, and (3) second cationic addition polymer consisting essentially of secondary, tertiary, or both secondary and tertiary ammonium-containing mer units derived from addition monomer and ammonium-free mer units derived from addition monomer, wherein the binder constitutes from 20 to 90 percent by weight of the coating; and (b) finely divided substantially water-insoluble filler particles which have a maximum dimension of less than 500 nanometers, are distributed throughout the binder, and constitute from 10 to 80 percent by weight of coating.
    • 一种印刷介质,包括具有至少一个表面的基材和在所述表面上的涂层,其中所述涂层包含:(a)粘合剂,其包含:(1)基本上不含铵基团的有机聚合物,(2)基本上组成的第一阳离子加成聚合物 由加成单体衍生的含季铵的mer单元和衍生自加成单体的无铵的单体单元,和(3)基本上由二级,三级或两级衍生的仲二级,三级或二级仲铵基的单体组成的第二阳离子加成聚合物 衍生自加成单体的单体和无铵的共聚单体,其中粘合剂占涂料的20至90重量%; 和(b)具有最大尺寸小于500纳米的基本上非水不溶性的填料颗粒分布在整个粘合剂中,并且构成涂层的10至80重量%。
    • 9. 发明授权
    • Process for creating holes in polymeric substrates
    • 在聚合物基材中形成孔的方法
    • US06824959B2
    • 2004-11-30
    • US10183674
    • 2002-06-27
    • Kevin C. OlsonAlan E. Wang
    • Kevin C. OlsonAlan E. Wang
    • G03F700
    • H05K3/002H05K3/4644Y10T428/12361Y10T428/24322
    • Provided is a process for creating a via through a substrate including the steps of (a) providing a substantially void-free film of a curable composition; (b) applying a resist onto the curable film; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the curable film; (e) removing the exposed areas of the curable film to form holes through the curable film; and (f) heating the curable film of step (e) to a temperature and for a time sufficient to cure the curable composition. Also disclosed is a process of fabricating a circuit assembly which includes building patterned circuit layers upon a substrate that has vias provided by the aformentioned process.
    • 提供了一种通过基板形成通孔的方法,包括以下步骤:(a)提供可固化组合物的基本上无空隙的膜; (b)将抗蚀剂涂布在可固化膜上; (c)在预定位置对抗蚀剂进行成像; (d)显影抗蚀剂以暴露可固化膜的预定区域; (e)去除可固化膜的暴露区域以形成穿过可固化膜的孔; 和(f)将步骤(e)的可固化膜加热至足以固化可固化组合物的温度和时间。 还公开了一种制造电路组件的方法,其包括在具有由上述工艺提供的通孔的基板上构建图案化电路层。