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    • 3. 发明授权
    • Method for reducing condensation water in gas sensor arrangements
    • 减少气体传感器装置中冷凝水的方法
    • US07626168B2
    • 2009-12-01
    • US11166593
    • 2005-06-24
    • Joerg FischerMarco ForlenzaRobert FrodlRudi MinuthKuno StraubThomas Tille
    • Joerg FischerMarco ForlenzaRobert FrodlRudi MinuthKuno StraubThomas Tille
    • G01N21/35
    • G01N21/3504G01N21/15G01N2021/158
    • The present invention relates to a method for measuring the presence and/or the concentration of an analyte by means of a gas sensor arrangement and to a corresponding gas sensor arrangement. The gas sensor arrangement comprises a radiation-emitting radiation source, a gas measuring chamber, which may be filled with a test gas containing at least one analyte to be measured, and at least one radiation-detecting detector device which generates an output signal as a function of the presence and/or the concentration of the analyte. In order to be able to reduce the harmful effects of condensation water, which condenses in the gas measuring chamber, the gas measuring chamber according to the invention is heated before the measurement process, such that the wall of the gas measuring chamber assumes a temperature which lies above the dew point of the test gas.
    • 本发明涉及一种通过气体传感器装置和对应的气体传感器装置来测量分析物的存在和/或浓度的方法。 气体传感器装置包括辐射发射辐射源,气体测量室,其可填充含有待测量的至少一种分析物的测试气体,以及至少一个辐射检测检测器装置,其产生输出信号 分析物的存在和/或浓度的功能。 为了能够减少在气体测量室中冷凝的冷凝水的有害影响,根据本发明的气体测量室在测量过程之前被加热,使得气体测量室的壁呈现温度 位于测试气体的露点之上。
    • 10. 发明申请
    • PERSONAL DOCUMENT AND METHOD FOR PRODUCING IT
    • 个人档案及其制作方法
    • US20100051702A1
    • 2010-03-04
    • US12448189
    • 2007-12-11
    • Manfred PaeschkeMalte PflughoefftJoerg FischerGuenter Beyer-MeklenburgOliver Muth
    • Manfred PaeschkeMalte PflughoefftJoerg FischerGuenter Beyer-MeklenburgOliver Muth
    • G06K19/07B29C65/54
    • G06K19/07749G06K19/025Y10T156/10
    • The invention relates to a personal document comprising an integrated chip which can be read contactlessly and which comprises a laminate composed of a chip film, a substrate covering the chip film on the structure side of the chip and a covering layer covering the chip film on the rear side, wherein the chip film comprises a chip with integrated circuit, said chip being thinned to a thickness d≦50 μm, preferably d≦30 μm, particularly preferably d≦20 μm, and a polymeric carrier film, which, apart from contact connections, is applied both on the structure side and on the rear side of the chip. The chip is connected to the carrier film on both sides by in each case a coupling reagent whose molecules have a first chemically functional group, which preferably reacts with the semiconductor material of the chip surface and forms a covalent bond there, and have a second functional group, which preferably reacts with the polymer matrix of the carrier film, wherein the carrier film, the substrate and the covering layer each have compatible polymers which are miscible with one another, in particular soluble in one another, and the chip is connected to an antenna provided on the substrate
    • 本发明涉及一种个人文件,其包括可以非接触地读取的集成芯片,其包括由芯片膜,覆盖芯片的结构侧上的芯片膜的基板和覆盖芯片膜上的覆盖层的层叠体 背面,其中所述芯片膜包括具有集成电路的芯片,所述芯片被薄化至厚度d< l1;50μm,优选d< ll;30μm,特别优选d≦̸20μm,以及除接触之外的聚合物载体膜 连接,均施加在芯片的结构侧和后侧。 芯片通过在每种情况下连接到载体膜,其中每种情况下都是分子具有第一化学官能团的偶联剂,其优选与芯片表面的半导体材料反应并在其上形成共价键,并且具有第二功能 基团,其优选与载体膜的聚合物基质反应,其中载体膜,基材和覆盖层各自具有彼此可混溶的相容的聚合物,特别是彼此可溶,并且芯片连接到 设置在基板上的天线