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    • 6. 发明授权
    • Pulsed current resistive heating for bonding temperature critical
components
    • 用于焊接温度关键部件的脉冲电流电阻加热
    • US5421943A
    • 1995-06-06
    • US149163
    • 1993-11-08
    • Andrew C. TamCelia E. Yeack-Scranton
    • Andrew C. TamCelia E. Yeack-Scranton
    • G11B5/31B23K20/02H05K1/02H05K1/16H05K3/30H05K3/32H05K3/34B32B31/00
    • B23K20/023B32B37/06H05K1/0212H05K1/167H05K2201/09263H05K2201/09772H05K2203/1115H05K3/305H05K3/328H05K3/3494Y10T156/1105
    • Controlled current pulses applied to a shaped resistive heating element formed on the bonding surface of a base or substrate component provide sufficient heat to the bonding interface formed between a chip and the base bonding surface to produce a high bonding temperature at the bonding interface while maintaining an opposite surface of the chip at or below a relatively low temperature critical for components formed or mounted on the chip surface. A layer of a thermally setting thin-film bonding agent is applied over a serpentine-shaped resistive heating element having a relatively narrow linewidth formed on the base component bonding surface. The chip to be bonded is retained in a desired position against the bonding surface over the heating element and bonding agent layer while a current pulse is applied to the heating element via contact pads. The current pulse magnitude and duration are controlled to produce sufficient local heating at the bonding interface to effect the desired bonding without excessive heating of any critical components at some predetermined distance from the bonding site.
    • 施加到形成在基底或基底部件的接合表面上的成形电阻加热元件的受控电流脉冲为形成在芯片和基底接合表面之间的接合界面提供足够的热量,以在接合界面处产生高的接合温度,同时保持 芯片的相对表面处于或低于对形成或安装在芯片表面上的部件关键的相对低的温度。 将一层热定型薄膜粘合剂施加在形成在基底部件接合表面上的相对较窄线宽的蛇形电阻加热元件上。 待接合的芯片通过接触焊盘将电流脉冲施加到加热元件上时,保持在加热元件和接合剂层上的接合表面所需的位置。 控制当前脉冲幅度和持续时间以在接合界面处产生足够的局部加热以实现期望的接合,而不会在距离接合位置一定预定距离的任何关键部件过度加热。