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1. 发明授权

US07190077B2 Semiconductor structure integrated under a pad 有权
标题翻译：半导体结构集成在一个垫下
公开(公告)号：US07190077B2
公开(公告)日：2007-03-13
申请号：US10519860
申请日：2003-06-12
申请人： Robert Bauer , Werner Ertle , Till Frohnmüller , Bernd Goller , Reinhard Greiderer , Oliver Nagler , Olaf Schmeckebier , Wolfgang Stadler
发明人： Robert Bauer , Werner Ertle , Till Frohnmüller , Bernd Goller , Reinhard Greiderer , Oliver Nagler , Olaf Schmeckebier , Wolfgang Stadler
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/05 , H01L2224/02166 , H01L2224/05093 , H01L2224/05556 , H01L2224/056 , H01L2224/05684 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/0101 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/13091 , H01L2924/19043 , H01L2924/3025 , H01L2924/00
摘要： An integrated semiconductor structure has a substrate, a semiconductor element located on the substrate, a pad metal, metal layers located between the pad metal and the substrate, and insulation layers that separate the metal layers from one another. The pad metal extends over at least—part of the semiconductor element.Below the surface of the pad metal, at least the top two metal layers include two or more adjacent interconnects.
摘要翻译：集成半导体结构具有衬底，位于衬底上的半导体元件，焊盘金属，位于焊盘金属和衬底之间的金属层以及将金属层彼此分离的绝缘层。焊盘金属在半导体元件的至少一部分上延伸。在焊盘金属的表面下方，至少顶部的两个金属层包括两个或更多相邻的互连。

2. 发明申请

US20050242374A1 Semiconductor structure integrated under a pad 有权
标题翻译：半导体结构集成在一个垫下
公开(公告)号：US20050242374A1
公开(公告)日：2005-11-03
申请号：US10519860
申请日：2003-06-12
申请人： Robert Bauer , Werner Ertle , Till Frohnmuller , Bernd Goller , Reinhard Greiderer , Oliver Nagler , Olaf Schmeckebier , Wolfgang Stadler
发明人： Robert Bauer , Werner Ertle , Till Frohnmuller , Bernd Goller , Reinhard Greiderer , Oliver Nagler , Olaf Schmeckebier , Wolfgang Stadler
IPC分类号： H01L23/485 , H01L31/0336
CPC分类号： H01L24/05 , H01L2224/02166 , H01L2224/05093 , H01L2224/05556 , H01L2224/056 , H01L2224/05684 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/0101 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/13091 , H01L2924/19043 , H01L2924/3025 , H01L2924/00
摘要： An integrated semiconductor structure has a substrate, a semiconductor element located on the substrate, a pad metal, metal layers located between the pad metal and the substrate, and insulation layers that separate the metal layers from one another. The pad metal extends over at least -part of the semiconductor element. Below the surface of the pad metal, at least the top two metal layers include two or more adjacent interconnects.
摘要翻译：集成半导体结构具有衬底，位于衬底上的半导体元件，焊盘金属，位于焊盘金属和衬底之间的金属层以及将金属层彼此分离的绝缘层。焊盘金属在半导体元件的至少一部分上延伸。在焊盘金属的表面下方，至少顶部的两个金属层包括两个或更多相邻的互连。

3. 发明授权

US08947887B2 Package assembly and method of tuning a natural resonant frequency of a package 有权
标题翻译：包装组装和调谐包装的固有共振频率的方法
公开(公告)号：US08947887B2
公开(公告)日：2015-02-03
申请号：US13142857
申请日：2009-02-23
申请人： Robert Bauer , Thorsten Hauck
发明人： Robert Bauer , Thorsten Hauck
IPC分类号： H05K1/18 , H01L23/495
CPC分类号： H01L23/49541 , H01L23/495 , H01L23/49548 , H01L2924/0002 , Y10T29/49117 , H01L2924/00
摘要： A package assembly comprises an electronic device; a package body; at least a first plurality of leads having a first geometrical shape and a second plurality of leads having a second geometrical shape, protruding from the package body; each of the first plurality of leads being located in corners of the package body; or the first and the second plurality of leads arranged in at least a first row and a second row located in parallel to the first row; each of the rows comprising at least two leads; the first row being transformable into the second row by mirroring the first row along a symmetry plane of the package body; each of the first plurality of leads having the first geometrical shape different from the second geometrical shape.
摘要翻译：包装组件包括电子装置; 包装体; 具有第一几何形状的至少第一多个引线和从封装主体突出的具有第二几何形状的第二多个引线; 所述第一多个引线中的每一个位于所述封装主体的角部; 或布置在平行于第一行的至少第一行和第二行中的第一和第二多个引线; 每行包括至少两个引线; 所述第一行通过沿着所述包装体的对称平面镜像所述第一行而被转换成第二行; 所述第一多个引线中的每一个具有不同于所述第二几何形状的所述第一几何形状。

4. 发明申请

US20080014046A1 Retaining Element for Blocking Screw Elements 审中-公开
标题翻译：用于阻挡螺丝元件的保持元件
公开(公告)号：US20080014046A1
公开(公告)日：2008-01-17
申请号：US10571049
申请日：2004-08-27
申请人： Robert Bauer
发明人： Robert Bauer
IPC分类号： F16B39/24
CPC分类号： F16B39/282 , F16B39/24 , F16B43/00
摘要： A locking element for holding together threaded parts such as screws and nuts against undesired loosening, consisting of at least two annular lock washers (1, 2) lying on each other and having center holes (14), wherein the inner surfaces lying on each other have teeth (7) and teeth (5) are provided on the outer faces, characterized in that at least one center hole (14) has a rounding (6) or a groove (24) on the inner face provided with teeth.
摘要翻译：一种锁定元件，用于将诸如螺钉和螺母的螺纹部分保持在一起以防止不希望的松动，由至少两个彼此相对并具有中心孔（14）的环形锁紧垫圈（1,2）组成，其中彼此相对的内表面具有齿（7）和齿（5）设置在外表面上，其特征在于，至少一个中心孔（14）在设有齿的内表面上具有圆形（6）或凹槽（24）。

5. 发明申请

US20060157701A1 Integrated sensor chip unit 审中-公开
标题翻译：集成传感器芯片单元
公开(公告)号：US20060157701A1
公开(公告)日：2006-07-20
申请号：US11329981
申请日：2006-01-10
申请人： Robert Bauer , Jochen Hagen
发明人： Robert Bauer , Jochen Hagen
IPC分类号： H01L23/58
CPC分类号： G01L19/086 , A61B5/145 , A61B5/14532 , G01D3/022 , H01L23/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2224/05599
摘要： The invention relates to a sensor module, in particular a measured-value pickup (2) for determining measurement data and a circuit arrangement (3) for enabling a wire-free power supply and interrogation of the measurement data. The measured-value pickup is formed as an integrable sensor (2), and the circuit arrangement is formed as an integrated semiconductor circuit module (3), the sensor (2) and the semiconductor circuit module (3) being mechanically and electrically conductively connected to one another to form an integrated sensor chip unit (1) using microsystems engineering means.
摘要翻译：本发明涉及一种用于确定测量数据的传感器模块，特别是用于确定测量数据的测量值拾取器（2）和用于实现无电源电源和询问测量数据的电路装置（3）。测量值拾取器形成为可积分传感器（2），并且电路装置形成为集成半导体电路模块（3），传感器（2）和半导体电路模块（3）机电导电连接使用微系统工程手段形成集成传感器芯片单元（1）。

6. 发明授权

US06324821B1 Riding or travelling bit for horses 失效
标题翻译：骑马或骑马为马
公开(公告)号：US06324821B1
公开(公告)日：2001-12-04
申请号：US09486628
申请日：2000-03-01
申请人： Robert Bauer , Curt Merker , Hjalmar Konzet
发明人： Robert Bauer , Curt Merker , Hjalmar Konzet
IPC分类号： B68B106
CPC分类号： B68B1/06
摘要： A riding or travelling bit for horses comprising at least one rigid or articulated bit rod (2) made at least partially of metal. The inventive bit is characterized in that the bit rod has at least two different metal parts (4,6) thus creating a difference in electrical potential. This difference in electric potential creates a sour taste for the horse, encouraging it to chew and making it receptive to assistance from the reins. In one embodiment, one member (4) of the two-membered bit rod (2) is made of one type of metal and the other member is made of another type of metal. Both members are coupled together in a known manner by means of self-engaging eyelets (8, 10) in a chain-like fashion. However, at least one of the eyelets is lined (12) with electrically insulating material. In another embodiment, both metal surfaces are electrically connected to various poles of at least one commercial electric battery cell (94) which is accommodated in a tubular receptacle (92) forming one part of the bit rod (90).
摘要翻译：用于马的骑行或旅行钻头包括至少部分由金属制成的至少一个刚性或铰接的钻头杆（2）。本发明的特征在于钻头杆具有至少两个不同的金属部件（4,6），从而产生电位差。这种电势的差异为马创造了酸味，鼓励它咀嚼，使其能够接受to to的帮助。在一个实施例中，两元位杆（2）的一个构件（4）由一种类型的金属制成，另一个构件由另一种类型的金属制成。两个构件以已知方式通过自链接孔眼（8,10）以链状方式联接在一起。然而，至少一个孔眼用电绝缘材料衬里（12）。在另一个实施例中，两个金属表面电连接到容纳在形成钻头杆（90）的一部分的管状容器（92）中的至少一个商用电池单元（94）的各个极上。

7. 发明授权

US5513360A Computer microphone powered by internal battery or computer hardware 失效
标题翻译：电脑麦克风由内置电池或电脑硬件供电
公开(公告)号：US5513360A
公开(公告)日：1996-04-30
申请号：US262354
申请日：1994-06-20
申请人： Robert Bauer
发明人： Robert Bauer
IPC分类号： G06F1/32 , G06F1/00 , H04M11/00
CPC分类号： G06F1/3209
摘要： A computer microphone with a dual power source capability is disclosed. This dual power source capability allows the microphone to receive power from an internal power source or an external power source disposed in computer hardware. In the event that the computer microphone is receiving power from the internal power source, and power is thereafter provided from the external source disposed in computer hardware, the present invention provides for the automatic turning off of the internal power source. In related fashion, in the event the computer microphone is receiving power from the external power source disposed in the computer hardware, and that external power source is thereafter turned off, the present invention automatically provides the computer microphone with power from the internal power source.
摘要翻译：公开了具有双电源能力的计算机麦克风。这种双电源功能允许麦克风从内部电源或设置在计算机硬件中的外部电源接收电力。在计算机麦克风从内部电源接收电力的情况下，从设置在计算机硬件中的外部电源提供电源时，本发明提供了内部电源的自动关闭。以相关的方式，在计算机麦克风从设置在计算机硬件中的外部电源接收电力的情况下，然后关闭外部电源的情况下，本发明自动向计算机麦克风提供来自内部电源的电力。

8. 发明授权

US4190419A Device for detecting serum bilirubin 失效
标题翻译：血清胆红素检测装置
公开(公告)号：US4190419A
公开(公告)日：1980-02-26
申请号：US944718
申请日：1978-09-22
申请人： Robert Bauer
发明人： Robert Bauer
IPC分类号： G01N31/22 , G01N33/72 , G01N33/16
CPC分类号： G01N33/728 , Y10S436/903 , Y10T436/146666
摘要： A test device for detecting bilirubin in serum is provided which comprises a carrier and, incorporated therewith, a composition comprising a diazonium salt, p-toluenesulfonic acid and dyphylline. The test device is free of the undesirable characteristic of nonuniformity of color development when reacted with a test sample. Uniform color development provides a more accurate and reliable quantitation of serum bilirubin. A method of making and a method of using the device are likewise disclosed.
摘要翻译：提供了一种用于检测血清中胆红素的测试装置，其包括载体，并且与其结合，包含重氮盐，对甲苯磺酸和二茶碱的组合物。当与测试样品反应时，测试装置不具有不均匀的显色不良的不良特征。均匀的色彩开发提供了更准确可靠的血清胆红素定量。同样公开了一种制造方法和使用该装置的方法。

9. 发明授权

US08283762B2 Lead frame based semiconductor package and a method of manufacturing the same 有权
标题翻译：引线框架半导体封装及其制造方法
公开(公告)号：US08283762B2
公开(公告)日：2012-10-09
申请号：US13182137
申请日：2011-07-13
申请人： Robert Bauer , Anton Kolbeck
发明人： Robert Bauer , Anton Kolbeck
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/49541 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing a semiconductor package, where the package includes a surface for attachment of the package to a device by a joint formed of a connective material in a joint area of the surface. The method is characterized in that it comprises the step of patterning one or more channels on the surface which channels extend away from the joint area towards an edge of the surface. Also the method has the step of applying a compound to one or more channels which compound interacts with the connective material, such that when the semiconductor package is attached to the device the interaction defines one or more paths in the connective material. These correspond to the one or more channels on the surface and allow the passage of waste material away from the joint area to the outer edge of the surface.
摘要翻译：一种制造半导体封装的方法，其中封装包括用于通过由表面的接合区域中的连接材料形成的接头将封装附接到器件的表面。该方法的特征在于，其包括在表面上构图一个或多个通道的步骤，该通道沿着接合区域朝向表面的边缘延伸。此外，该方法具有将化合物施加到化合物与连接材料相互作用的一个或多个通道的步骤，使得当半导体封装附接到器件时，相互作用限定了连接材料中的一个或多个路径。这些对应于表面上的一个或多个通道，并允许废物从接合区域延伸到表面的外边缘。

10. 发明申请

US20100283110A1 INTEGRATED SENSOR CHIP UNIT 审中-公开
标题翻译：集成传感器芯片单元
公开(公告)号：US20100283110A1
公开(公告)日：2010-11-11
申请号：US12838202
申请日：2010-07-16
申请人： Robert Bauer , Jochen Von Hagen
发明人： Robert Bauer , Jochen Von Hagen
IPC分类号： H01L29/66
CPC分类号： G01L19/086 , A61B5/145 , A61B5/14532 , G01D3/022 , H01L23/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2224/05599
摘要： An integrated sensor chip unit and fabrication method includes a measured-value pickup for determining measurement data and a circuit arrangement for enabling a wireless power supply and interrogation of the measurement data. The measured-value pickup is formed as an integratable sensor, and the circuit arrangement is formed as an integrated semiconductor circuit module. The sensor and the semiconductor circuit module are mechanically and electrically conductively connected to one another using one or more microsystems engineering techniques.
摘要翻译：集成传感器芯片单元和制造方法包括用于确定测量数据的测量值拾取器和用于实现无线电力供应和询问测量数据的电路装置。测量值拾取器形成为可积分传感器，并且电路装置形成为集成半导体电路模块。传感器和半导体电路模块使用一个或多个微系统工程技术彼此机械地和导电地连接。

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