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    • 5. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH MULTIPLE DIELECTRICS
    • 用多个电介质制造半导体器件的方法
    • US20080096383A1
    • 2008-04-24
    • US11874443
    • 2007-10-18
    • Howard TigelaarStefan KubicekHongYu Yu
    • Howard TigelaarStefan KubicekHongYu Yu
    • H01L23/48H01L21/02
    • H01L21/823462H01L21/823857H01L2924/0002H01L2924/00
    • A method of manufacturing a semiconductor device with at least a first dielectric material and a second dielectric material is disclosed. In one aspect, the method comprises providing a first dielectric material on a substrate. The method further comprises providing a patterned sacrificial layer covering the first dielectric material in at least a first region of the substrate. The method further comprises providing a second dielectric material covering the patterned sacrificial layer in the first region and covering the first dielectric material in at least a second region, the second region being different from the first region. The method further comprises patterning the second dielectric material such that the patterned second dielectric material covers the first dielectric material in the second region but not the patterned sacrificial layer in the first region. The method further comprises removing the patterned sacrificial material.
    • 公开了一种制造具有至少第一介电材料和第二介电材料的半导体器件的方法。 一方面,该方法包括在基底上提供第一介电材料。 该方法还包括在衬底的至少第一区域中提供覆盖第一电介质材料的图案化牺牲层。 该方法还包括提供覆盖第一区域中的图案化牺牲层并在至少第二区域中覆盖第一介电材料的第二电介质材料,第二区域与第一区域不同。 该方法还包括对第二电介质材料进行图案化,使得图案化的第二电介质材料覆盖第二区域中的第一介电材料,但不覆盖第一区域中的图案化牺牲层。 该方法还包括去除图案化的牺牲材料。