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1. 发明授权

US5570506A Method for forming multilayer wiring construction 失效
标题翻译：多层布线结构形成方法
公开(公告)号：US5570506A
公开(公告)日：1996-11-05
申请号：US463562
申请日：1995-06-05
申请人： Rie Tawata , Shunichi Numata , Takao Miwa , Koji Fujisaki , Takayoshi Ikeda , Yoshiaki Okabe , Hisae Shimanoki
发明人： Rie Tawata , Shunichi Numata , Takao Miwa , Koji Fujisaki , Takayoshi Ikeda , Yoshiaki Okabe , Hisae Shimanoki
IPC分类号： C08G73/10 , H01L23/498 , H05K1/00 , H05K1/03 , H05K3/46 , H01K3/22
CPC分类号： H05K3/4655 , H01L23/49894 , H05K1/0346 , H05K3/4673 , H05K3/4676 , H01L2924/0002 , H05K2201/0154 , H05K2201/0195 , H05K2201/068 , H05K2203/0759 , H05K3/4644 , H05K3/4652 , Y10T29/49126 , Y10T29/49128 , Y10T29/49163 , Y10T428/31721
摘要： Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film is formed as a highly adhesive film on a low-thermal-expansivity polyimide film in a half-cured state, then metallic wiring is applied thereon, followed by formation of another highly adhesive thin film in a half-cured state, and then a low-thermal-expansivity polyimide film is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film and the wiring pattern layer or the substrate.
摘要翻译：低热膨胀性聚酰亚胺具有线性刚性骨架，使得完全固化的低热膨胀聚酰亚胺膜之间的粘附性非常低。另一方面，具有柔性骨架的聚酰亚胺的膜即使在完全固化后也显示出高的粘合性，从而可以通过插入具有柔性骨架的聚酰亚胺来增强低热膨胀性聚酰亚胺膜之间的粘附性。在半固化状态下在低热膨胀性聚酰亚胺膜上形成柔性聚酰亚胺薄膜作为高粘合剂膜，然后在其上施加金属布线，然后形成半固化状态的另一高粘合性薄膜然后在其上进一步形成低热膨胀性聚酰亚胺膜。可以提供具有改善低热膨胀性聚酰亚胺膜和布线图案层或基板之间的粘附性的多层布线结构。

2. 发明授权

US5183838A Acid anhydride complex and process for producing same, and composition containing same 失效
标题翻译：酸酐络合物及其制造方法，含有其的组合物
公开(公告)号：US5183838A
公开(公告)日：1993-02-02
申请号：US724777
申请日：1991-07-02
申请人： Takao Miwa , Takayoshi Ikeda , Shunichi Numata , Koji Fujisaki , Hisae Shimanoki
发明人： Takao Miwa , Takayoshi Ikeda , Shunichi Numata , Koji Fujisaki , Hisae Shimanoki
IPC分类号： C07C51/573 , C08G73/10 , C08L63/00
CPC分类号： C08G73/1003 , C07C51/573 , C08L63/00
摘要： An acid dianhydride complex which is characterized in anti-hydrolysis, good stability, and high solubility in an organic solvent, is prepared by a reaction of a basic organic compound having a donor number of at least 20 and being free from an active hydrogen atom in the molecule and a carboxylic dianhydride compound.
摘要翻译：特征在于抗水解，稳定性好，在有机溶剂中的高溶解度的酸二酐络合物是通过具有给体数为20以上且不含活性氢原子的碱性有机化合物的反应制备的该分子和羧酸二酐化合物。

3. 发明授权

US5208066A Process of forming a patterned polyimide film and articles including such a film 失效
标题翻译：形成图案化的聚酰亚胺膜的方法和包括这种膜的制品
公开(公告)号：US5208066A
公开(公告)日：1993-05-04
申请号：US877391
申请日：1992-04-30
申请人： Koji Fujisaki , Shunichi Numata , Takao Miwa , Takayoshi Ikeda , Hisae Shimanoki
发明人： Koji Fujisaki , Shunichi Numata , Takao Miwa , Takayoshi Ikeda , Hisae Shimanoki
IPC分类号： G03F7/00 , G11B5/31 , H01L21/312 , H01L21/3213 , H01L23/498 , H01L23/556 , H05K3/28 , H05K3/46
CPC分类号： B82Y10/00 , B82Y40/00 , G03F7/0002 , G11B5/3163 , H01L21/312 , H01L21/32139 , H01L23/49894 , H01L23/556 , H01L2224/48463 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01039 , H01L2924/01046 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/3025 , H05K3/28 , H05K3/4644 , Y10S438/953
摘要： A process of forming a patterned polyimide film includes the step of conversion of a polyimide precursor into polyimide. The improvement is imidizing the precursor by means of a chemical imidizing reagent. Typically a film of polyimide precursor is formed on a substrate, and mask which is negative with respect to the desired pattern is formed on the film. The film is contacted through the mask with a chemical imidizing reagent to effect imidization of unmasked portions, thereby forming polyimide. The mask and masked portions of the film are removed, leaving the desired polyimide pattern. High temperatures and harmful etchants can be avoided.
摘要翻译：形成图案化聚酰亚胺膜的工艺包括将聚酰亚胺前体转化成聚酰亚胺的步骤。改进之处在于通过化学酰亚胺化试剂将前体酰亚胺化。通常，在基板上形成聚酰亚胺前体膜，在膜上形成相对于所需图案为负的掩模。通过掩模将膜与化学酰亚胺化试剂接触以实现未掩蔽部分的酰亚胺化，由此形成聚酰亚胺。除去膜的掩模和掩蔽部分，留下所需的聚酰亚胺图案。可以避免高温和有害的蚀刻剂。

4. 发明授权

US5133989A Process for producing metal-polyimide composite article 失效
标题翻译：生产金属 - 聚酰亚胺复合材料的方法
公开(公告)号：US5133989A
公开(公告)日：1992-07-28
申请号：US416279
申请日：1989-09-27
申请人： Shunichi Numata , Takao Miwa , Takayoshi Ikeda , Koji Fujisaki , Hisae Shimanoki , Kunio Miyazaki , Osamu Miura , Ryuji Watanabe , Toshio Miyamoto , Yukio Okoshi
发明人： Shunichi Numata , Takao Miwa , Takayoshi Ikeda , Koji Fujisaki , Hisae Shimanoki , Kunio Miyazaki , Osamu Miura , Ryuji Watanabe , Toshio Miyamoto , Yukio Okoshi
IPC分类号： B32B15/088 , B32B15/08 , C08G73/10 , H01B1/22 , H01B3/30 , H01L21/48 , H01L23/14 , H05K1/03
CPC分类号： H05K1/0346 , H01B1/22 , H01B3/306 , H01L21/481 , H01L23/145 , H01L2224/16225 , H01L2924/12044 , Y10T428/31681
摘要： The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

5. 发明申请

US20100018767A1 WATERTIGHT STRUCTURE FOR SPLICED PORTION 失效
标题翻译：分离部分的水分结构
公开(公告)号：US20100018767A1
公开(公告)日：2010-01-28
申请号：US12520921
申请日：2007-06-11
申请人： Takayoshi Ikeda
发明人： Takayoshi Ikeda
IPC分类号： H02G3/06
CPC分类号： H02G15/113 , H01R4/70 , H02G15/013
摘要： A watertight structure for a spliced portion includes a container 14 that has an open top 14g adapted to receive a spliced portion 13 of electrical wires and that is elongated in a longitudinal direction X of the electrical wires W1 and W2, and a lid 15 to be mounted on the container. The container is provided with a bottom wall 14a including a central flat portion 14a-1 at a deepest position in the container and upward inclined portions 14a-2 that extend from opposite sides of the central flat portion in a longitudinal direction. The central flat portion is provided with a spliced portion positioning section 14c having a narrow width. The spliced portion positioning section is provided on opposite outer sides with receiving portions 14f to be engaged with locking pieces 15d projecting from opposite sides of the lid. The lid is provided on a middle part in the longitudinal direction with a narrow width portion 15a adapted to be fitted in the spliced portion positioning section. Wide width portions 15b at opposite sides of the narrow width portion in the longitudinal direction are formed into configurations adapted to be fitted in spaces at opposite sides of the spliced portion positioning section of the container in the longitudinal direction. The spliced portion of the electrical wires is fitted and held in the spliced portion positioning section in the container. The spliced portion is embedded in a watertight agent 16. The lid closes the embedded part to secure the spliced portion to the container.
摘要翻译：用于接合部分的防水结构包括：容器14，其具有开口顶部14g，其适于容纳电线的接合部分13，并且在电线W1和W2的纵向方向X上延伸，并且盖15为安装在容器上。容器设置有包括在容器中最深位置的中央平坦部分14a-1的底壁14a和从纵向方向从中心平坦部分的相对侧延伸的向上倾斜部分14a-2。中央平坦部分具有窄的宽度的接合部分定位部分14c。接合部定位部在相对的外侧设置有容纳部14f，以与从盖的相对侧突出的锁定片15d接合。盖子沿长度方向设置在中间部分上，并具有适于装配在接合部分定位部分中的窄宽度部分15a。在宽度方向的狭窄部分的相对侧的宽度方向的宽度部分15b形成为适于在纵向方向上装配在容器的拼接部分定位部分相对侧的空间中。电线的接合部分装配并保持在容器中的拼接部分定位部分中。接合部分嵌入防水剂16.盖子封闭嵌入部分，以将接合部分固定到容器上。

6. 发明授权

US08076579B2 Watertight structure for spliced portion 失效
标题翻译：拼接部分的防水结构
公开(公告)号：US08076579B2
公开(公告)日：2011-12-13
申请号：US12520921
申请日：2007-06-11
申请人： Takayoshi Ikeda
发明人： Takayoshi Ikeda
IPC分类号： H02G3/06
CPC分类号： H02G15/113 , H01R4/70 , H02G15/013
摘要： A watertight structure for a spliced portion includes a container that has an open top adapted to receive a spliced portion of electrical wires and that is elongated in a longitudinal direction of the electrical wires, and a lid to be mounted on the container. The container is provided with a bottom wall and upward inclined portions that extend in a longitudinal direction. The container is provided with a spliced portion positioning section having a narrow width. The spliced portion positioning section is provided on opposite outer sides with receiving portions to be engaged with locking pieces projecting from the lid.
摘要翻译：用于拼接部分的防水结构包括容器，其具有适于接收电线的拼接部分并且沿着电线的纵向方向延伸的开口顶部以及要安装在容器上的盖子。容器设置有沿纵向方向延伸的底壁和向上倾斜的部分。容器设置有具有窄宽度的拼接部分定位部分。接合部定位部设置在相对的外侧上，接收部分与从盖突出的锁定件接合。

7. 发明授权

US4283632A Electron beam aperture device 失效
标题翻译：电子束孔径装置
公开(公告)号：US4283632A
公开(公告)日：1981-08-11
申请号：US86254
申请日：1979-10-18
申请人： Seiichi Nakagawa , Takayoshi Ikeda
发明人： Seiichi Nakagawa , Takayoshi Ikeda
IPC分类号： G21K1/02 , H01J9/16 , H01J37/09 , G01J1/00
CPC分类号： H01J37/09 , G21K1/02
摘要： A 10 to 50 microns thick apertured foil is coated on at least one of its sides with a material having a thickness of about 10 to 100 microns. The atomic number of the coating material is such that characteristic X-rays generated are effectively absorbed.
摘要翻译：在其至少一个侧面上涂覆10至50微米厚的有孔箔，其厚度为约10至100微米。涂层材料的原子序数使得产生的特征X射线被有效地吸收。

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