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1. 发明授权

US5127570A Flexible automated bonding method and apparatus 失效
标题翻译：柔性自动粘接方法和装置
公开(公告)号：US5127570A
公开(公告)日：1992-07-07
申请号：US545271
申请日：1990-06-28
申请人： Richard R. Steitz , Melvin C. August , Diane M. Christie , Deanna M. Dowdle , Dean B. Dudley , Stephen E. Nelson , Eugene F. Neumann , Paul E. Schroeder
发明人： Richard R. Steitz , Melvin C. August , Diane M. Christie , Deanna M. Dowdle , Dean B. Dudley , Stephen E. Nelson , Eugene F. Neumann , Paul E. Schroeder
IPC分类号： B23K26/00 , H01L21/60 , H01L23/498 , H05K1/11 , H05K3/00 , H05K3/36 , H05K3/40
CPC分类号： H01L24/86 , B23K26/0661 , B23K26/382 , B23K26/384 , B23K26/386 , B23K26/40 , B23K26/402 , H01L23/4985 , H05K3/4084 , B23K2201/35 , B23K2203/05 , B23K2203/08 , B23K2203/10 , B23K2203/12 , B23K2203/172 , B23K2203/42 , B23K2203/50 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K1/118 , H05K2201/0394 , H05K2201/0397 , H05K2203/1184 , H05K3/0032 , H05K3/361 , Y10T29/49133
摘要： A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.
摘要翻译：柔性自动接合装置将集成电路载体，印刷电路板和其它装置电互连。金属化互连图案沉积在基板的表面上。图案中的金属化互连使用准分子激光器跨越在衬底中产生的孔。因此，金属化互连可以通过孔电连接到位于衬底下方的元件。

2. 发明授权

US5283948A Method of manufacturing interconnect bumps 失效
标题翻译：制造互连凸点的方法
公开(公告)号：US5283948A
公开(公告)日：1994-02-08
申请号：US708447
申请日：1991-05-31
申请人： Paul E. Schroeder , Deanna M. Dowdle
发明人： Paul E. Schroeder , Deanna M. Dowdle
IPC分类号： H01R12/04 , H05K1/00 , H05K3/40 , H01R9/09 , H01K3/10
CPC分类号： H05K3/4007 , H05K1/0393 , H05K2201/0347 , H05K2201/0367 , H05K2201/09845 , H05K2203/1476 , Y10T29/49149 , Y10T29/49165
摘要： A method of manufacturing interconnect bumps on electrical connectors is disclosed. The interconnect bumps are formed with mechanically interlocking structure which allows the bumps to reach a height substantially greater than prior art bumps, while remaining structurally intact. The interconnect bumps are formed using standard photolithography techniques to form the bumps in multiple interlocking portions to achieve a structurally superior interconnect bump.
摘要翻译：公开了一种在电连接器上制造互连凸块的方法。互连凸块形成有机械互锁结构，其允许凸块达到高于现有技术凸块的高度，同时保持结构完整。使用标准光刻技术形成互连凸块，以在多个互锁部分中形成凸块，以实现结构上优异的互连凸块。

3. 发明授权

US4383020A Preparation of photoconductive film using radiation curable resin 失效
标题翻译：使用辐射固化树脂制备光导膜
公开(公告)号：US4383020A
公开(公告)日：1983-05-10
申请号：US198627
申请日：1980-10-20
申请人： Sidney J. Roberts , Deanna M. Dowdle
发明人： Sidney J. Roberts , Deanna M. Dowdle
IPC分类号： G03C1/74 , G03F7/16 , G03G5/00 , G03G5/05 , G03G5/08
CPC分类号： G03G5/0525 , Y10S430/107
摘要： An improvement in the method of preparing a coating or layer of reprographic material upon a substrate which includes the conventional steps of coating the substrate surface with a layer of resinous binder curable upon exposure to radiant energy including electron beam and ultraviolet radiation, the binder layer containing reprographic solids. The resinous binder is applied as a fluid and is irradiated until a coherent and adherent layer is formed. The method includes the steps of forceably applying and tautly maintaining a sheet of a smooth flexible film against the surface of the curable resinous binder while directing a beam of radiant energy through the sheet and onto the binder while the layer of flexible film is held thereagainst. The exposure to radiant energy is continued until the resinous binder is substantially completely cured, whereupon the sheet of flexible film is removed from the surface of the binder. The reprographic solids preferably consist of cadmium sulfide, cadmium selenide, or alloys thereof.
摘要翻译：在基材上制备复制材料的涂层或层的方法的改进，其包括以下步骤：用暴露于包括电子束和紫外线辐射的辐射能可固化的可树脂粘合剂层涂覆基材表面的常规步骤，所述粘合剂层含有复制固体。将树脂粘合剂作为流体施加，并且被照射直到形成相干和粘附层。该方法包括以下步骤：在将柔性膜层保持在其上的同时将可光辐射束通过片材引导到粘合剂上，同时将柔性柔性膜片张紧地保持在可固化树脂粘合剂的表面上。暴露于辐射能量持续直到树脂粘合剂基本上完全固化，于是从粘合剂的表面去除柔性膜片。复制固体优选由硫化镉，硒化镉或其合金组成。

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