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    • 8. 发明授权
    • Room temperature curable compositions
    • 室温固化组合物
    • US5891978A
    • 1999-04-06
    • US856709
    • 1997-05-15
    • Scott S. D. BrownPatrick J. MerlinRichard G. Taylor
    • Scott S. D. BrownPatrick J. MerlinRichard G. Taylor
    • C08K5/56C08G77/08C08K5/00C08L83/06H05K3/28C08G77/06
    • H05K3/287C08G77/08C08K5/0091
    • A curable composition which comprises (A) an organosilicon compound having at least one silicon-bonded alkoxy group per molecule and on average at least three hydroxyl and/or alkoxy groups bonded to silicon per molecule; (B) a catalyst component characterized in that the catalyst component is according to the formula ##STR1## wherein R.sup.1 and R.sup.2 each independently represent a pentahapto ligand, R.sup.3 represents a fluoroaromatic ligand having a fluorine atom bonded in the ortho position relative to the M-ligand bond, R.sup.4 represents a group R.sup.3 or a monovalent alkyl, alkenyl, alkoxy, alkoxy alkoxy, halogen, aryl, halo substituted aryl, organosilicon or organosiloxane group and M represents Ti, Zr or Hf, which is curable by exposure by UV radiation; and optionally (C) an organo-silicon having two of silicon-bonded hydroxyl or alkoxy groups per molecule, wherein the organo-silicone is selected from the group consisting of organopolysiloxane and organosilicon-organic copolymer.
    • 一种可固化组合物,其包含(A)每分子具有至少一个与硅键合的烷氧基的有机硅化合物,并且平均每个分子与至少三个与硅键合的羟基和/或烷氧基; (B)催化剂组分,其特征在于所述催化剂组分按照下式其中R 1和R 2各自独立地表示五巴配体,R 3表示氟原子在相邻M- 配体键,R4表示R3或单价烷基,烯基,烷氧基,烷氧基烷氧基,卤素,芳基,卤素取代的芳基,有机硅或有机硅氧烷基团,M表示可通过紫外线照射而固化的Ti,Zr或Hf。 和(C)每分子具有两个与硅键合的羟基或烷氧基的有机硅,其中有机硅选自有机聚硅氧烷和有机硅 - 有机共聚物。