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    • 7. 发明授权
    • Laser light sources having integrated detector and intensity control and methods of producing same
    • 具有集成检测器和强度控制的激光光源及其制造方法
    • US06697396B2
    • 2004-02-24
    • US09970073
    • 2001-10-02
    • John A. LehmanKlein L. JohnsonBernard S. FritzPaul E. BauhahnLynn M. Galarneau
    • John A. LehmanKlein L. JohnsonBernard S. FritzPaul E. BauhahnLynn M. Galarneau
    • H01S310
    • H01S5/02292H01S5/02252H01S5/02284H01S5/0683
    • A device to monitor light output from a light source, including a V-groove substrate with a reflective coating deposited on at least one surface, an optical fiber, a light source positioned so that an amount of the light emitted, which is less than 100%, enters the optical fiber, a light intensity or source detector positioned so that at least some of the light emitted from the light source, that did not enter the optical fiber impinges upon the light intensity detector, and feedback circuitry. A method of producing a device including the steps of coating a surface of a V-groove substrate with a reflective material, placing a light source in said V-groove substrate. A method of producing a device comprising the steps of coating a surface of a V-groove substrate with a reflective material, placing a light source in said V-groove substrate, placing a light intensity detector in said V-groove substrate, and placing a wave guide structure in said V-groove substrate wherein said reflective material, said light source, said detector and said wave guide structure are positioned in said V-groove substrate so that an amount of light emitted from said light source, which is less than 100%, enters said wave guide structure; and at least some of the light emitted from said light source, that did not enter said wave guide structure reflects from said reflective material and impinges upon said light intensity detector.
    • 一种用于监视来自光源的光输出的装置,包括具有沉积在至少一个表面上的反射涂层的V形槽衬底,光纤,定位成使得发射的光量小于100的光源 %,进入光纤,光强度或源检测器被定位成使得从光源发射的光中没有进入光纤的至少一些光照射到光强度检测器和反馈电路上。 一种制造器件的方法,包括以下步骤:用反射材料涂覆V形槽衬底的表面,将光源放置在所述V形槽衬底中。 一种制造器件的方法,包括以下步骤:用反射材料涂覆V形槽衬底的表面,将光源放置在所述V沟槽衬底中,将光强度检测器放置在所述V形槽衬底中, 所述V型槽衬底中的波导结构,其中所述反射材料,所述光源,所述检测器和所述波导结构位于所述V形槽衬底中,使得从所述光源发射的光的量小于100 %,进入波导结构; 并且没有进入所述波导结构的从所述光源发射的至少一些光从所述反射材料反射并撞击在所述光强度检测器上。
    • 8. 发明授权
    • Fiber optic mode scrambler
    • 光纤模式扰频器
    • US5892866A
    • 1999-04-06
    • US723600
    • 1996-10-01
    • Julian P. BristowJohn A. Lehman
    • Julian P. BristowJohn A. Lehman
    • G02B6/14H04B10/2581G02B6/26
    • H04B10/2581G02B6/14
    • The present invention is an optical transmission system comprising an optical source, a first lens and a second lens, a multimode optical waveguide, and a phase-only filter. The optical source generates an optical signal having a predetermined wavelength which is received by the first lens. The signal is then sent from the first lens through the phase-only filter and then to the second lens. The second lens then focuses the signal into the multimode optical waveguide. The multimode optical waveguide has predetermined dimensions and has multiple modes. The phase-only filter excites a plurality of modes in the optical waveguide to approximate equilibrium modal power distribution as the optical signal is received into the optical waveguide.
    • 本发明是一种光传输系统,包括光源,第一透镜和第二透镜,多模光波导和相位滤波器。 光源产生具有由第一透镜接收的预定波长的光信号。 然后将信号从第一透镜通过相位相关滤波器发送到第二透镜。 然后,第二透镜将信号聚焦到多模光波导中。 多模光波导具有预定尺寸并具有多种模式。 当光信号被接收到光波导中时,相位相关滤波器激发光波导中的多个模式以近似平衡模态功率分布。
    • 9. 发明授权
    • Chip-to-interface alignment
    • 芯片到接口对准
    • US6095697A
    • 2000-08-01
    • US52643
    • 1998-03-31
    • John A. LehmanPatrick M. Hamilton
    • John A. LehmanPatrick M. Hamilton
    • G02B6/42H01S5/022G02B6/36
    • G02B6/423
    • A rigid alignment of a fixture connection to a chip having the rigidity of the connection transferred from the chip to a chip holder. The chip has an alignment feature that has a specific position relative to a device on the chip to which another device of a fixture is to be aligned. An alignment fixture has an alignment feature and a device site which aligns with the alignment feature and the device on the chip, respectively. The alignment fixture has a fastener on the chip holder. The chip is moveable on the holder and is moved until the alignment features of the fixture are aligned, which also results in the alignment of the device site with the device. The chip is attached with glue or solder to the holder. The alignment fixture is removed and substituted with a connector interface fixture having no alignment feature relative to the chip but rather an alignment mechanism to the block that the chip is attached. The device and a fastener of the connector interface fixture have the same relative positions as the device site and fastener, respectively, of the alignment fixture. Attaching the fastener of the device fixture to the fastener on the chip holder results in passive alignment of the devices on the fixture and the chip, as the fasteners are likened to an alignment mechanism or features. Stresses applied to the device fixture are transferred to the chip holder via the fastener, and not to the chip. applied to the device fixture are transferred to the chip holder via the fastener, and not to the chip.
    • 夹具连接与具有从芯片传递到芯片保持器的连接的刚性的芯片的刚性对准。 该芯片具有对准特征,该对准特征具有相对于芯片上的与固定装置的另一装置对准的装置的特定位置。 对准夹具具有对准特征和与芯片上的对准特征和器件对准的器件位置。 对准夹具在芯片保持器上具有紧固件。 芯片可在支架上移动,并移动直到夹具的对准特征对齐,这也导致设备位置与设备的对准。 芯片上贴有胶水或焊料到支架上。 对准夹具被移除并且被相对于芯片没有对准特征的连接器接口夹具取代,而是与芯片附接的块的对准机构。 连接器接口固定装置的装置和紧固件分别具有与对准夹具的装置现场和紧固件相同的相对位置。 将装置固定件的紧固件连接到芯片保持器上的紧固件,导致夹具和芯片上的装置的被动对准,因为紧固件被比作对准机构或特征。 应用于设备固定装置的应力通过紧固件而不是芯片传递到芯片保持器。 施加到装置固定装置的装置通过紧固件传送到芯片支架,而不是转移到芯片。