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1. 发明申请

US20050254552A1 Thermal sensing 有权
标题翻译：热传感
公开(公告)号：US20050254552A1
公开(公告)日：2005-11-17
申请号：US11167746
申请日：2005-06-27
申请人： Richard Bruce , Dirk De Bruyker , Francisco Torres , Michal Wolkin
发明人： Richard Bruce , Dirk De Bruyker , Francisco Torres , Michal Wolkin
IPC分类号： G01F1/68 , G01K1/00 , G01K7/30 , G01K17/00 , G01N25/20 , G01N25/48 , G01N27/00
CPC分类号： G01K7/30 , G01K17/00 , G01K17/006 , G01N25/482
摘要： In thermal sensing devices, such as for calorimetry, a support layer or central layer can have a thermometer element or other thermal sensor on one side and a thermally conductive structure or component on the other. The thermally conductive structure can conduct temperature or other thermal input signals laterally across the support layer or central layer. The temperature or signals can then be provided to the thermometer element, such as by thermal contact through the support layer. An electrically conducting, thermally isolating anti-coupling layer, such as of gold or chromium, can reduce capacitive coupling between the thermally conductive structure and the thermometer element or other thermal sensor.
摘要翻译：在诸如用于量热法的热感测装置中，支撑层或中心层可以在一侧具有温度计元件或其它热传感器，而在另一侧可以具有导热结构或部件。导热结构可以横跨支撑层或中心层横向传导温度或其他热输入信号。然后可以将温度或信号提供给温度计元件，例如通过通过支撑层的热接触。导电的，热隔离的抗耦合层（例如金或铬）可以减少导热结构和温度计元件或其它热传感器之间的电容耦合。

2. 发明申请

US20050254994A1 Thermal sensing with bridge circuitry 有权
标题翻译：具有桥接电路的热感测
公开(公告)号：US20050254994A1
公开(公告)日：2005-11-17
申请号：US11167612
申请日：2005-06-27
申请人： Alan Bell , Richard Bruce , Eric Peeters , Michal Wolkin , Dirk Bruyker
发明人： Alan Bell , Richard Bruce , Eric Peeters , Michal Wolkin , Dirk Bruyker
IPC分类号： G01F1/68 , G01K1/00 , G01K7/30 , G01K17/00 , G01N25/20 , G01N25/48 , G01N27/00
CPC分类号： G01K7/30 , G01K17/00 , G01N25/482
摘要： Thermal sensing devices can include two subsets of thermal sensors connected in a bridge by circuitry on the same support layer or surface with the sensors. Each thermal sensor can be formed in a patterned layer of semiconductor material, and the bridge circuitry can include leads formed in a patterned layer of conductive material, over or under the semiconductor layer. In one implementation, the bridge circuitry includes conductive portions that extend across and electrically contact the lower surface of each sensor's semiconductor slab. The bridge circuitry can also include pads that can be electrically contacted, such as by pogo pins. The device's reaction surface can be spaced apart from or over the thermal sensors. The device's components can be shaped and positioned so that the bridge's offset voltage is below the sensitivity level required for an application, such as by left-right symmetry about an axis.
摘要翻译：热感测装置可以包括通过与传感器相同的支撑层或表面上的电路在桥中连接的两个热传感器子集。每个热传感器可以形成在半导体材料的图案化层中，并且桥接电路可以包括形成在导电材料的图案化层中的引线，在半导体层之上或之下。在一个实施方式中，桥接电路包括导电部分，其延伸并且电接触每个传感器的半导体板的下表面。桥接电路还可以包括可以电接触的焊盘，例如通过弹簧销。设备的反应表面可以与热传感器间隔开或超过热传感器。该装置的部件可以被成形和定位，使得桥的偏移电压低于应用所需的灵敏度水平，例如通过关于轴的左右对称。

3. 发明申请

US20070148416A1 Layered structures on thin substrates 有权
标题翻译：薄基底上的分层结构
公开(公告)号：US20070148416A1
公开(公告)日：2007-06-28
申请号：US11318975
申请日：2005-12-27
申请人： Michal Wolkin , Ana Arias
发明人： Michal Wolkin , Ana Arias
IPC分类号： B41M5/00
CPC分类号： B41M5/52 , B05D5/12 , G01K7/16 , G01K17/006 , G01K2211/00 , H01L21/02565 , H05K3/048 , H05K3/061 , H05K3/12 , Y10T428/24802
摘要： A thin substrate has a layered structure on one surface, and can also have a layered structure on the other. Each layered structure can include a part of at least one patterned layer that, if patterned by photolithography, would frequently result in damage to the substrate due to fragility. For example, the substrate could be a 3 mil (76.2 μm) or thinner polyimide film and one patterned layer could be a semiconductor material such as vanadium oxide, while another could be metal in electrical contact with semiconductor material. The layer part, however, can be patterned by a printing operation or can include a printed patterned artifact such as an uneven boundary or an alignment. The printing operation can be direct printing or printing of a mask for etching or liftoff or both. The layered structure can include an array of cells, each with layer parts on each substrate surface.
摘要翻译：薄基板在一个表面上具有层状结构，并且另外可以具有层状结构。每个分层结构可以包括至少一个图案化层的一部分，如果通过光刻图案，则会由于脆性而频繁地导致对基底的损伤。例如，衬底可以是3密耳（76.2μm）或更薄的聚酰亚胺膜，并且一个图案化层可以是诸如氧化钒的半导体材料，而另一个可以是与半导体材料电接触的金属。然而，层部分可以通过打印操作来图案化，或者可以包括印刷的图案化伪像，例如不均匀边界或对准。打印操作可以是直接打印或打印用于蚀刻或剥离的掩模或两者。层状结构可以包括每个在每个衬底表面上具有层部分的单元阵列。

4. 发明申请

US20070145362A1 Passive electronic devices 有权
标题翻译：被动电子设备
公开(公告)号：US20070145362A1
公开(公告)日：2007-06-28
申请号：US11318967
申请日：2005-12-27
申请人： Michal Wolkin , Ana Arias
发明人： Michal Wolkin , Ana Arias
IPC分类号： B44C1/22 , H01L21/302 , C23F1/00 , H01L29/10 , H01L21/20
CPC分类号： G01N25/20 , G01K17/006 , G01K2211/00 , H01C7/006 , H01C7/008 , H01C17/075 , H01L27/16 , H01L28/20
摘要： A passive electronic device includes layers of a layered structure on a support surface. The device can include a first layer part that includes electrically conductive or semiconductive material and that has a contact surface. The device can also include second layer parts that include electrically conductive material and are in electrical contact with the contact surface, with a subset electrically connectible to external circuitry. At least one of the parts of the two layers can be produced by a printing operation or can include a printed patterned artifact such as an uneven boundary or an alignment. The printing operation can be direct printing or printing of a mask for etching or liftoff or both. The device could, for example, be a resistive device, such as a device with resistance varying in response to non-electrical stimuli, or a conductive device, such as with a contact pad for a pogo pin.
摘要翻译：无源电子设备包括在支撑表面上的分层结构的层。该装置可以包括包括导电或半导体材料并且具有接触表面的第一层部分。该装置还可以包括包括导电材料并与接触表面电接触的第二层部分，其中子集可电连接到外部电路。可以通过打印操作来产生两层的至少一个部分，或者可以包括印刷图案化伪像，例如不均匀边界或对准。打印操作可以是直接打印或打印用于蚀刻或剥离的掩模或两者。该装置可以例如是电阻性装置，例如具有响应于非电刺激而变化的电阻的装置，或导电装置，例如用于弹簧销的接触垫。

5. 发明申请

US20050238080A1 Resistive thermal sensing 有权
标题翻译：电阻式热感测
公开(公告)号：US20050238080A1
公开(公告)日：2005-10-27
申请号：US11167748
申请日：2005-06-27
申请人： Michal Wolkin , Dirk Bruyker , Eric Peeters , Alan Bell
发明人： Michal Wolkin , Dirk Bruyker , Eric Peeters , Alan Bell
IPC分类号： G01F1/68 , G01K1/00 , G01K7/30 , G01K17/00 , G01N25/20 , G01N25/48 , G01N27/00
CPC分类号： G01K7/30 , B82Y15/00 , G01K17/00 , G01N25/482 , G01N25/4846 , G01N25/4866
摘要： Thermal sensors for calorimetry can include vanadium oxide, heavily p-doped amorphous silicon, or other materials with high temperature coefficients of resistivity. Such thermal sensors can have low noise equivalent temperature difference (NETD). For example, a thermal sensor with NETD no greater than 100 μK over a bandwidth range of approximately 3 Hz or more can include a thermistor including vanadium oxide sputtered at room temperature under conditions that yield primarily V2O5; more specifically, the NETD can be no greater than 35 μK, or even 10 μK over a bandwidth range of approximately 3 Hz or more. If a low noise thermal sensor has NETD no greater than 50 μK over such a bandwidth range, a low noise output circuitry connected to its thermistor can provide an electrical output signal that includes information about input thermal signal peaks with amplitude of approximately 100 μK.
摘要翻译：用于量热法的热传感器可以包括氧化钒，重掺杂非晶硅或具有高温电阻系数的其它材料。这样的热传感器可以具有低噪声等效温差（NETD）。例如，在约3Hz以上的带宽范围内，NETD不大于100μKK的热传感器可以包括在室温下溅射的氧化钒的热敏电阻，其主要产生V 2 O 2， SUB> 5

6. 发明申请

US20070147473A1 Producing layered structures using printing 有权
标题翻译：使用印刷生产分层结构
公开(公告)号：US20070147473A1
公开(公告)日：2007-06-28
申请号：US11318926
申请日：2005-12-27
申请人： Michal Wolkin , Ana Arias
发明人： Michal Wolkin , Ana Arias
IPC分类号： G01K1/00
CPC分类号： H05B3/00 , G01K7/22 , G01K17/006 , Y10T29/49083 , Y10T29/49117 , Y10T29/49124
摘要： A layered structure is on a support structure's surface. The layered structure can include a component that responds electrically to thermal signals, such as a thermistor, and can also include a layer part that has a printed patterned artifact such as an uneven boundary or an alignment. The support structure can be a polymer layer such as polyimide, and a thermistor can include vanadium oxide with a printed patterned artifact. An array can include a layered structure with thermal sensor cells, at least one of which includes a printed patterned artifact. A layered structure can be produced by depositing a first layer, printing a mask, removing the exposed part of the first layer, depositing a second layer, and lifting off part of the second layer, leaving part of the second layer next to part of the first layer.
摘要翻译：分层结构在支撑结构的表面上。层状结构可以包括对诸如热敏电阻之类的热信号进行电响应的部件，并且还可以包括具有印刷图案化伪像的层部分，例如不均匀边界或对准。支撑结构可以是诸如聚酰亚胺的聚合物层，并且热敏电阻可以包括具有印刷图案的假象的氧化钒。阵列可以包括具有热传感器单元的分层结构，其中至少一个包括印刷图案的伪影。可以通过沉积第一层，印刷掩模，去除第一层的暴露部分，沉积第二层和提起第二层的一部分来制造分层结构，将第二层的一部分留在第二层的一部分上第一层

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