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    • 3. 发明授权
    • Repair method for low noise metal lines in thin film imager devices
    • 薄膜成像设备中低噪声金属线路的修复方法
    • US5616524A
    • 1997-04-01
    • US580094
    • 1995-12-22
    • Ching Y. WeiJianqiang LiuRoger S. SalisburyRobert F. KwasnickGeorge E. PossinDouglas Albagli
    • Ching Y. WeiJianqiang LiuRoger S. SalisburyRobert F. KwasnickGeorge E. PossinDouglas Albagli
    • H01L21/66H01L21/3205H01L21/768H01L23/52H01L27/146H01L21/465
    • H01L21/76892Y10T29/49162
    • A method of repairing an open circuit defect in a damaged address line in a thin film electronic imager device includes the steps of forming a repair area on the device so as to expose the open-circuit defect in the damaged address line and then depositing a conductive material to form a second conductive component and to coincidentally form a repair shunt in the repair area so as to electrically bridge the defect. The step of forming the repair area includes the steps of ablating dielectric material disposed over the first conductive component in the repair area, and etching the repair area so as to remove dielectric material disposed over the defect in the address line in the repair area such that the surface of the address line conductive material is exposed but is not contaminated by the removal of the overlying dielectric material. A layer of photoresist is deposited over the imager device prior to forming the repair area, such that the photoresist layer is patterned during the ablating step and serves as a mask during the etch step.
    • 在薄膜电子成像装置中修复损坏的地址线中的开路缺陷的方法包括以下步骤:在设备上形成修复区域,以暴露损坏的地址线中的开路缺陷,然后沉积导电 材料以形成第二导电部件并且在修复区域中巧合地形成修复分路,从而电连接缺陷。 形成修复区域的步骤包括以下步骤:消除设置在修复区域中的第一导电部件上的介电材料,并蚀刻修复区域,以便去除在修复区域中的地址线上的缺陷上的介电材料,使得 地址线导电材料的表面被暴露,但不会被除去上覆电介质材料污染。 在形成修复区域之前,在成像器装置上沉积一层光致抗蚀剂,使得光刻胶层在烧蚀步骤期间被图案化,并在蚀刻步骤期间用作掩模。