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    • 1. 发明申请
    • PROCESS AND COMPOSITION FOR PASSIVATING A SUBSTRATE DURING ELECTROCHEMICAL MECHANICAL POLISHING
    • 电化学机械抛光过程中用于剥离基材的方法和组合
    • US20070144915A1
    • 2007-06-28
    • US11613918
    • 2006-12-20
    • Yuan TianRenhe JiaFeng LiuYongqi HuStan TsaiLiang-Yuh ChenRobert Ewald
    • Yuan TianRenhe JiaFeng LiuYongqi HuStan TsaiLiang-Yuh ChenRobert Ewald
    • B23H7/00H05K3/07
    • C25F3/02B23H5/08H01L21/32125
    • Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a method of electrochemically processing a substrate using a conductive polishing article is provided. The method includes disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising a cathode coupled to the conductive polishing article and an anode, wherein the substrate is in electrical contact with the anode, supplying a polishing composition comprising a cathodic inhibitor and an anodic inhibitor, forming a protective film on the cathode to prevent corrosion of the cathode, and polishing the substrate. In another embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes a corrosion inhibitor selected from the group of an amino acid based inhibitor, a polymeric based corrosion inhibitor, an oxidizer, a chelating inhibitor or combinations thereof.
    • 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施例中,提供了使用导电抛光制品电化学处理衬底的方法。 该方法包括将包括形成在其上的导电材料层的衬底放置在包括耦合到导电抛光制品的阴极和阳极的处理装置中,其中衬底与阳极电接触,提供包含阴极抑制剂的抛光组合物, 阳极抑制剂,在阴极上形成保护膜以防止阴极腐蚀,并抛光衬底。 在另一个实施方案中,提供了一种用于处理其上设置有导电材料层的基材的组合物,其组成包括选自氨基酸基抑制剂,聚合物基腐蚀抑制剂,氧化剂,螯合抑制剂或组合的腐蚀抑制剂 其中。