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1. 发明授权

US5605277A Hot vacuum device removal process and apparatus 失效
标题翻译：热真空装置拆除工艺及装置
公开(公告)号：US5605277A
公开(公告)日：1997-02-25
申请号：US360100
申请日：1994-12-20
申请人： Raymond A. Jackson , Kathleen A. Lidestri , William E. Sablinski , David C. Linnell , Raj N. Master
发明人： Raymond A. Jackson , Kathleen A. Lidestri , William E. Sablinski , David C. Linnell , Raj N. Master
IPC分类号： B23K1/018
CPC分类号： B23K1/018 , B23K2201/40
摘要： A cost efficient, highly reliable method to remove electronic devices and components from substrates eliminates separate tooling for every substrate and device or component size. The apparatus which implements the method allows for multiple device or component removal simultaneously, or in a single sequential operation, in a nondestructive action in a very low cost environment. A box oven and vacuum system and is used with different device or component and substrate sizes providing a simple, low cost, molten device removal procedure, eliminating the need for thermal monitor build and associated profiling for each product. The apparatus works independently of chip type or size, utilizing universal fixturing, and can be set up to pull multiple devices and/or components in a single run.
摘要翻译：从基板上去除电子设备和组件的成本效益高，可靠的方法消除了每个基板和设备或部件尺寸的单独的工具。实现该方法的装置允许在非常低成本的环境中的非破坏性动作中同时进行多个装置或部件移除，或者在单个顺序操作中。箱式烘箱和真空系统，并且使用不同的装置或部件和基板尺寸，提供简单，低成本的熔融装置移除程序，消除了对每个产品的热监测器构建和相关的分析的需要。该设备独立于芯片类型或尺寸，利用通用的固定方式工作，并可设置为在单次运行中拉出多个设备和/或组件。

2. 发明授权

US5553766A In-situ device removal for multi-chip modules 失效
标题翻译：多芯片模块的原位设备拆除
公开(公告)号：US5553766A
公开(公告)日：1996-09-10
申请号：US342563
申请日：1994-11-21
申请人： Raymond A. Jackson , Kathleen A. Lidestri , David C. Linnell , Raj N. Master
发明人： Raymond A. Jackson , Kathleen A. Lidestri , David C. Linnell , Raj N. Master
IPC分类号： B23K1/018 , H05K13/04 , H05K3/34 , B23K3/00
CPC分类号： H05K13/0486 , B23K1/018 , B23K2201/40
摘要： Deformation of a lifting ring of bimetallic structure or memory metal is matched to a solder softening or melting temperature to apply forces to lift a chip from a supporting structure, such as a substrate or multi-chip module, only when the solder connections between the chip and the supporting structure are softened or melted. The temperature of the chip, module and solder connections there between is achieved in a commercially available box oven or belt furnace or the like and results in much reduced internal chip temperatures and thermal gradients within the chip as compared to known hot chip removal processes. Tensile and/or shear forces at solder connections and chip and substrate contacts are much reduced in comparison with known cold chip removal processes. Accordingly, the process is repeatable at will without significant damage to or alteration of electrical characteristics of the chip or substrate.
摘要翻译：双金属结构或记忆金属的提升环的变形与焊料软化或熔化温度匹配，以施加力以从支撑结构（例如基板或多芯片模块）提升芯片，只有当芯片之间的焊料连接支撑结构软化或熔化。与市售的盒式炉或带式炉等相比，芯片，模块和焊料连接的温度是可以实现的，并且与已知的热切屑去除工艺相比，在芯片内的内部芯片温度和热梯度大大降低。与已知的冷芯片去除工艺相比，焊料连接和芯片和基板触点处的拉伸和/或剪切力大大降低。因此，该过程可以随意重复，而不会显着损坏或改变芯片或衬底的电特性。

3. 发明授权

US5153408A Method and structure for repairing electrical lines 失效
标题翻译：修复电线的方法和结构
公开(公告)号：US5153408A
公开(公告)日：1992-10-06
申请号：US607969
申请日：1990-10-31
申请人： Edward F. Handford , Joseph M. Harvilchuck , Mario J. Interrante , Raymond A. Jackson , Raj N. Master , Sudipta K. Ray , William E. Sablinski , Thomas A. Wassick
发明人： Edward F. Handford , Joseph M. Harvilchuck , Mario J. Interrante , Raymond A. Jackson , Raj N. Master , Sudipta K. Ray , William E. Sablinski , Thomas A. Wassick
IPC分类号： H01L21/3205 , H01L21/768 , H01L23/498 , H01L23/52 , H01L23/525 , H01L23/538 , H05K3/00 , H05K3/02 , H05K3/22 , H05K3/34
CPC分类号： H01L21/76892 , H01L23/49866 , H01L23/525 , H05K3/225 , H01L2924/0002 , H05K2201/10181 , H05K2201/10234 , H05K2201/1028 , H05K2201/10287 , H05K2203/0769 , H05K2203/107 , H05K2203/121 , H05K2203/173 , H05K2203/175 , H05K3/0017 , H05K3/027 , H05K3/34 , Y10T29/49124
摘要： The present invention relates generally to a new method of repairing electrical lines, and more praticularly to repairing electrical lines having an open at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the open with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.
摘要翻译：本发明一般涉及一种修复电线的新方法，并且更具体地涉及在装置就位时修复在模块级具有开路的电线。使用各种方法和过程来修复电导体线中的这个开路或有缺陷的部分。它可以通过将跨接线或熔核固定在开口处进行修复，或者可以通过沉积工艺进行修复，该沉积工艺包括但不限于用焊料型材料填充开口或插入焊料涂覆的电线并加热焊接并允许焊料熔化并修复开路。本发明的一个特征是在其上附着有诸如引脚，电容器等的诸如芯片和无源部件的有源部件的基板或模块上进行修复的能力。本发明还允许修复通常不能通过常规技术修复的细线图案。

4. 发明授权

US5543584A Structure for repairing electrical lines 失效
标题翻译：修理电线的结构
公开(公告)号：US5543584A
公开(公告)日：1996-08-06
申请号：US843684
申请日：1992-02-28
申请人： Edward F. Handford , Joseph M. Harvilchuck , Mario J. Interrante , Raymond A. Jackson , Raj N. Master , Sudipta K. Ray , William E. Sablinski , Thomas A. Wassick
发明人： Edward F. Handford , Joseph M. Harvilchuck , Mario J. Interrante , Raymond A. Jackson , Raj N. Master , Sudipta K. Ray , William E. Sablinski , Thomas A. Wassick
IPC分类号： H01L21/3205 , H01L21/768 , H01L23/498 , H01L23/52 , H01L23/525 , H01L23/538 , H05K3/00 , H05K3/02 , H05K3/22 , H05K3/34 , H05K1/11
CPC分类号： H01L21/76892 , H01L23/49866 , H01L23/525 , H05K3/225 , H01L2924/0002 , H05K2201/10181 , H05K2201/10234 , H05K2201/1028 , H05K2201/10287 , H05K2203/0769 , H05K2203/107 , H05K2203/121 , H05K2203/173 , H05K2203/175 , H05K3/0017 , H05K3/027 , H05K3/34 , Y10T29/49124
摘要： The present invention relates generally to a new method of repairing electrical lines, and more particularly to repairing electrical lines having an opening at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the opening with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.
摘要翻译：本发明一般涉及一种修复电线的新方法，更具体地说，涉及在装置的适当位置修复具有模块级开口的电线。使用各种方法和过程来修复电导体线中的这个开路或有缺陷的部分。它可以通过将跨接线或熔核固定在整个开口处进行修复，或者可以通过沉积工艺进行修复，该沉积工艺包括但不限于用焊料型材料填充开口或插入焊料涂覆的电线并加热焊接并允许焊料熔化并修复开路。本发明的一个特征是在其上附着有诸如引脚，电容器等的诸如芯片和无源部件的有源部件的基板或模块上进行修复的能力。本发明还允许修复通常不能通过常规技术修复的细线图案。

5. 发明授权

US06253986B1 Solder disc connection 失效
标题翻译：焊盘连接
公开(公告)号：US06253986B1
公开(公告)日：2001-07-03
申请号：US09400784
申请日：1999-09-22
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
IPC分类号： B23K3514
CPC分类号： H01L24/12 , B23K1/0016 , B23K2101/42 , H01L23/10 , H01L23/50 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/06102 , H01L2224/13099 , H01L2224/1403 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/1025 , H05K2201/10992 , H05K2203/0415 , Y02P70/613 , Y10T29/49144 , H01L2924/00
摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.
摘要翻译：提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成连接。焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。

6. 发明授权

US06283359B1 Method for enhancing fatigue life of ball grid arrays 有权
标题翻译：提高球栅阵列疲劳寿命的方法
公开(公告)号：US06283359B1
公开(公告)日：2001-09-04
申请号：US09644486
申请日：2000-08-23
申请人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
发明人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
IPC分类号： B23K3102
CPC分类号： H01L24/12 , B23K35/0222 , B23K35/0244 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L2224/1184 , H01L2224/13099 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , H05K2203/0435 , Y02P70/613 , Y10T428/12687 , Y10T428/2991 , H01L2224/29099 , H01L2924/00
摘要： This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.
摘要翻译：本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路板。焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面被绑定。

7. 发明授权

US06278184B1 Solder disc connection 失效
公开(公告)号：US06278184B1
公开(公告)日：2001-08-21
申请号：US09400783
申请日：1999-09-22
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
IPC分类号： H01L2348
CPC分类号： H01L24/12 , B23K1/0016 , B23K2101/42 , H01L23/10 , H01L23/50 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/06102 , H01L2224/13099 , H01L2224/1403 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/1025 , H05K2201/10992 , H05K2203/0415 , Y02P70/613 , Y10T29/49144 , H01L2924/00
摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

8. 发明授权

US6070321A Solder disc connection 失效
标题翻译：焊盘连接
公开(公告)号：US6070321A
公开(公告)日：2000-06-06
申请号：US890458
申请日：1997-07-09
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
IPC分类号： B23K1/00 , B23K35/14 , H01L21/60 , H01L23/10 , H01L23/50 , H05K3/34
CPC分类号： H01L24/12 , B23K1/0016 , H01L23/10 , H01L23/50 , H01L24/16 , H01L24/81 , H05K3/3436 , B23K2201/42 , H01L2224/0401 , H01L2224/06102 , H01L2224/13099 , H01L2224/1403 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K2201/1025 , H05K2201/10992 , H05K2203/0415 , Y02P70/613 , Y10T29/49144
摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.
摘要翻译：提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成连接。焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。

9. 发明授权

US6158644A Method for enhancing fatigue life of ball grid arrays 失效
标题翻译：提高球栅阵列疲劳寿命的方法
公开(公告)号：US6158644A
公开(公告)日：2000-12-12
申请号：US70163
申请日：1998-04-30
申请人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
发明人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
IPC分类号： H01L23/12 , B23K35/02 , B23K35/14 , H01L21/60 , H01L23/498 , H05K3/34 , B23K35/24 , B23K35/26
CPC分类号： H01L24/12 , B23K35/0222 , H01L23/49811 , H01L24/11 , H01L24/16 , H05K3/3436 , B23K35/0244 , H01L2224/1184 , H01L2224/13099 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , H05K2203/0435 , Y02P70/613 , Y10T428/12687 , Y10T428/2991
摘要： This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.
摘要翻译：本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路板。焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面被绑定。

10. 发明授权

US5975409A Ceramic ball grid array using in-situ solder stretch 失效
标题翻译：陶瓷球栅阵列使用原位焊料拉伸
公开(公告)号：US5975409A
公开(公告)日：1999-11-02
申请号：US909865
申请日：1997-08-12
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
IPC分类号： H01L21/60 , H05K3/34 , B23K31/02 , B23K37/04
CPC分类号： H01L24/81 , H01L24/75 , H05K3/3436 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H05K2203/0195 , H05K2203/0465 , H05K2203/082 , H05K2203/306 , Y02P70/613
摘要： A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.
摘要翻译：提供了一种方法和装置，用于在电子模块的两个焊接的基板之间通过在模块的加热期间和/或之后施加受控的分离力来在两个焊接的基板之间形成细长的焊接接头。焊接接头被塑化，优选地熔化到高于液相线温度的熔融状态，并且由此被拉伸，然后将模块冷却以固化拉伸接头。提供了一种优选使用真空装置作为将现有焊料接头拉伸到期望的焊料高度和优选为沙漏形状的构造的分离力的装置和方法。

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