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    • 2. 发明授权
    • Design and use of a spacer cell to support reconfigurable memories
    • 间隔单元的设计和使用以支持可重构存储器
    • US07006369B2
    • 2006-02-28
    • US10650192
    • 2003-08-27
    • Ramnath VenkatramanRugger CastagnettiSubramanian Ramesh
    • Ramnath VenkatramanRugger CastagnettiSubramanian Ramesh
    • G11C5/06G11C11/40
    • G11C7/18G11C8/16H01L27/11Y10S257/903
    • The present invention provides a method and apparatus for reconfiguring a memory array. Aspects of the present invention include fabricating the memory array as at least one row of single-port cells up to a first metal layer. A split word line having first and second word lines is coupled to the single-port cells in each row, wherein the first word line is patterned in the first metal layer, and the second word line is patterned in a second metal layer. The split word line is further coupled to a spacer cell in the row. The method and apparatus further include programming the memory array into custom configurations based on whether the first and second word lines are connected over the spacer cell, or whether the first and second word lines are left unconnected.
    • 本发明提供了一种用于重新配置存储器阵列的方法和装置。 本发明的方面包括将存储器阵列制造为直到第一金属层的至少一行单端口单元。 具有第一和第二字线的分割字线被耦合到每行中的单端口单元,其中第一字线在第一金属层中被图案化,并且第二字线被图案化在第二金属层中。 分割字线还耦合到行中的间隔单元。 所述方法和装置还包括基于第一和第二字线是否连接在间隔单元上,或者第一和第二字线是否保持不连接,将存储器阵列编程成定制配置。
    • 6. 发明申请
    • SRAM BASED ONE-TIME-PROGRAMMABLE MEMORY
    • 基于SRAM的一次可编程存储器
    • US20100080035A1
    • 2010-04-01
    • US12239469
    • 2008-09-26
    • Ramnath VenkatramanRuggero CastagnettiSubramanian Ramesh
    • Ramnath VenkatramanRuggero CastagnettiSubramanian Ramesh
    • G11C17/08
    • G11C17/16G11C17/18
    • Disclosed is a method and device for providing fast-response One-Time-Programmable (OTP) memory based on SRAM memory technology and the inherent breakdown characteristics of a MOS transistor. Each memory cell of an SRAM memory cell circuit is connected to a programming circuit. The programming circuit is comprised of two groups of MOS transistors connected to the storage nodes (SN and SNB, where SNB is the complementary value of SN) of the two cross-coupled inverters of the SRAM memory circuit. A desired data set is loaded into the circuit and then is burned-in by applying and repeatedly cycling a “burn-in” voltage across the source and drain of the MOS transistors of the programming circuit that approaches the ON STATE trigger voltage of the characteristic bipolar junction transistor contained within the MOS transistors. Upon repeated cycling of the source-to-drain voltage, the targeted MOS transistor within the programming circuit breaks down and shorts across the gate, drain, and/or source of the transistor. When the system is returned to normal operation, the programming circuits will be connected to ground, Vdd or Vss and one of the two nodes of the SRAM cell circuit will be shorted through the programming circuit to ground, Vdd or Vss, thus, forcing a retention of the programmed data state.
    • 公开了一种用于提供基于SRAM存储器技术的快速响应一次可编程(OTP)存储器和MOS晶体管的固有击穿特性的方法和装置。 SRAM存储单元电路的每个存储单元连接到编程电路。 编程电路由连接到SRAM存储器电路的两个交叉耦合反相器的存储节点(SN和SNB,其中SNB是SN的互补值)的两组MOS晶体管组成。 将期望的数据组加载到电路中,然后通过施加并重复地循环编程电路的MOS晶体管的源极和漏极上的“老化”电压并接近特性的ON状态触发电压而被烧录 双极结晶体管包含在MOS晶体管内。 在重复循环源极至漏极电压之后,编程电路内的目标MOS晶体管在晶体管的栅极,漏极和/或源极之间分解和短路。 当系统恢复正常运行时,编程电路将连接到地,Vdd或Vss,SRAM单元电路的两个节点之一将通过编程电路短路到地Vdd或Vss,从而强制 保留编程数据状态。
    • 9. 发明授权
    • SRAM based one-time-programmable memory
    • 基于SRAM的一次可编程存储器
    • US07869251B2
    • 2011-01-11
    • US12239469
    • 2008-09-26
    • Ramnath VenkatramanRuggero CastagnettiSubramanian Ramesh
    • Ramnath VenkatramanRuggero CastagnettiSubramanian Ramesh
    • G11C17/00
    • G11C17/16G11C17/18
    • Disclosed is a method and device for providing fast-response One-Time-Programmable (OTP) memory based on SRAM memory technology and the inherent breakdown characteristics of a MOS transistor. Each memory cell of an SRAM memory cell circuit is connected to a programming circuit. The programming circuit is comprised of two groups of MOS transistors connected to the storage nodes (SN and SNB, where SNB is the complementary value of SN) of the two cross-coupled inverters of the SRAM memory circuit. A desired data set is loaded into the circuit and then is burned-in by applying and repeatedly cycling a “burn-in” voltage across the source and drain of the MOS transistors of the programming circuit that approaches the ON STATE trigger voltage of the characteristic bipolar junction transistor contained within the MOS transistors. Upon repeated cycling of the source-to-drain voltage, the targeted MOS transistor within the programming circuit breaks down and shorts across the gate, drain, and/or source of the transistor. When the system is returned to normal operation, the programming circuits will be connected to ground, Vdd or Vss and one of the two nodes of the SRAM cell circuit will be shorted through the programming circuit to ground, Vdd or Vss, thus, forcing a retention of the programmed data state.
    • 公开了一种用于提供基于SRAM存储器技术的快速响应一次可编程(OTP)存储器和MOS晶体管的固有击穿特性的方法和装置。 SRAM存储单元电路的每个存储单元连接到编程电路。 编程电路由连接到SRAM存储器电路的两个交叉耦合反相器的存储节点(SN和SNB,其中SNB是SN的互补值)的两组MOS晶体管组成。 将期望的数据组加载到电路中,然后通过施加并重复地循环编程电路的MOS晶体管的源极和漏极上的“老化”电压并接近特性的ON状态触发电压而被烧录 双极结晶体管包含在MOS晶体管内。 在重复循环源极至漏极电压之后,编程电路内的目标MOS晶体管在晶体管的栅极,漏极和/或源极之间分解和短路。 当系统恢复正常运行时,编程电路将连接到地,Vdd或Vss,SRAM单元电路的两个节点之一将通过编程电路短路到地Vdd或Vss,从而强制 保留编程数据状态。