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1. 发明授权

US06255202B1 Damascene T-gate using a spacer flow 有权
标题翻译：大马士革T型门采用间隔流
公开(公告)号：US06255202B1
公开(公告)日：2001-07-03
申请号：US09619836
申请日：2000-07-20
申请人： Christopher F. Lyons , Ramkumar Subramanian , Bhanwar Singh , Marina Plat
发明人： Christopher F. Lyons , Ramkumar Subramanian , Bhanwar Singh , Marina Plat
IPC分类号： H01L213205
CPC分类号： H01L29/66583 , H01L21/28114 , H01L21/28123 , H01L21/76807 , H01L29/4238 , H01L29/4925
摘要： A method for fabricating a T-gate structure is provided. A structure is provided that has a silicon layer having a gate oxide layer, a polysilicon layer over the gate oxide layer and an insulating layer over the gate oxide layer. An opening is formed extending partially into the insulating layer. The opening in the insulating layer extends from a top surface of the insulating layer to a first depth. Spacers are then formed on the sides of the opening. The opening is then extended in the insulating layer from the first depth to a second depth. The opening is wider from the top surface of the insulating layer to the first depth than the opening is from the first depth to the second depth. The spacers are then removed from the opening. The opening is then filled with a conductive material to form a T-gate structure.
摘要翻译：提供了一种制造T型栅结构的方法。提供一种结构，其具有硅层，该硅层具有栅极氧化物层，栅极氧化物层上的多晶硅层和栅极氧化物层上的绝缘层。形成部分地延伸到绝缘层中的开口。绝缘层中的开口从绝缘层的顶表面延伸到第一深度。然后在开口的两侧形成隔板。然后将开口在绝缘层中从第一深度延伸到第二深度。开口从绝缘层的顶表面到比第一深度从第一深度到第二深度的第一深度更宽。然后将隔离物从开口中取出。然后用导电材料填充开口以形成T形栅结构。

2. 发明授权

US06417084B1 T-gate formation using a modified conventional poly process 有权
标题翻译：使用改进的常规聚合方法形成T形栅
公开(公告)号：US06417084B1
公开(公告)日：2002-07-09
申请号：US09620300
申请日：2000-07-20
申请人： Bhanwar Singh , Marina Plat , Ramkumar Subramanian , Christopher F. Lyons
发明人： Bhanwar Singh , Marina Plat , Ramkumar Subramanian , Christopher F. Lyons
IPC分类号： H01L213205
CPC分类号： H01L21/28114 , H01L21/32139
摘要： A method is provided for fabricating a T-gate structure. A structure is provided that has a silicon layer having a gate oxide layer, a polysilicon layer over the gate oxide layer, and an ARC layer over the polysilicon layer. A gate structure is formed by removing the ARC layer and a portion of the polysilicon layer around a gate region. Spacers are then formed around the gate structure. Undercut regions are formed in the gate structure by performing an isotropic etch to provide the gate structure with a base region and a contact region. The base region has a width smaller than the contact region.
摘要翻译：提供了一种用于制造T型栅结构的方法。提供一种结构，其具有硅层，该硅层具有栅极氧化物层，栅极氧化物层上的多晶硅层以及多晶硅层上的ARC层。通过在栅极区域周围除去ARC层和多晶硅层的一部分来形成栅极结构。然后在栅极结构周围形成间隔物。通过执行各向同性蚀刻在栅极结构中形成底切区域，以向栅极结构提供基极区域和接触区域。基部区域的宽度小于接触区域。

3. 发明授权

US06319802B1 T-gate formation using modified damascene processing with two masks 有权
标题翻译：使用具有两个掩模的改良镶嵌加工的T形栅结构
公开(公告)号：US06319802B1
公开(公告)日：2001-11-20
申请号：US09620145
申请日：2000-07-20
申请人： Ramkumar Subramanian , Christopher F. Lyons , Bhanwar Singh , Marina Plat
发明人： Ramkumar Subramanian , Christopher F. Lyons , Bhanwar Singh , Marina Plat
IPC分类号： H01L213205
CPC分类号： H01L21/28114
摘要： A method for fabricating a T-gate structure is provided. A structure is provided that has a silicon layer having a gate oxide layer, a protection layer over the gate oxide layer and a sacrificial layer over the protection layer. An opening is then formed in the sacrificial layer. A contact material is deposited over the sacrificial layer filling the opening with the contact material and forming a contact layer. Portions of the contact material outside a gate region are then removed. Finally, the sacrificial layer and portions of the protection layer and the gate oxide layer not forming a part of the T-gate structure are removed.
摘要翻译：提供了一种制造T型栅结构的方法。提供了一种具有硅层的结构，该硅层具有栅极氧化物层，栅极氧化物层上的保护层和保护层上的牺牲层。然后在牺牲层中形成开口。接触材料沉积在用接触材料填充开口的牺牲层上并形成接触层。然后去除栅极区域外部的接触材料的部分。最后，除去牺牲层和不形成T栅结构的一部分的保护层和栅极氧化物层的部分。

4. 发明授权

US06270929B1 Damascene T-gate using a relacs flow 有权
标题翻译：大马士革T门使用相关资料流
公开(公告)号：US06270929B1
公开(公告)日：2001-08-07
申请号：US09619789
申请日：2000-07-20
申请人： Christopher F. Lyons , Ramkumar Subramanian , Bhanwar Singh , Marina Plat
发明人： Christopher F. Lyons , Ramkumar Subramanian , Bhanwar Singh , Marina Plat
IPC分类号： H01L21302
CPC分类号： H01L21/28114 , H01L21/0273 , H01L21/0338 , H01L21/31144 , H01L21/76802 , H01L29/42376
摘要： A method for fabricating a T-gate structure is provided. A structure is provided that has a silicon layer having a gate oxide layer, a polysilicon layer over the gate oxide layer and an insulating layer over the gate oxide layer. A photoresist layer is formed over the insulating layer. An opening is the formed extending through the photoresist layer and partially into the insulating layer. The opening in the insulating layer extends from a top surface of the insulating layer to a first depth. The photoresist layer is swelled to reduce the size of the opening in the photoresist layer. The opening is then extended in the insulating layer from the first depth to a second depth. The opening is wider from the top surface of the insulating layer to the first depth than the opening is from the first depth to the second depth. The opening is then filled with a conductive material to form a T-gate structure.
摘要翻译：提供了一种制造T型栅结构的方法。提供一种结构，其具有硅层，该硅层具有栅极氧化物层，栅极氧化物层上的多晶硅层和栅极氧化物层上的绝缘层。在绝缘层上形成光致抗蚀剂层。开口形成为延伸穿过光致抗蚀剂层并部分地进入绝缘层。绝缘层中的开口从绝缘层的顶表面延伸到第一深度。光致抗蚀剂层被膨胀以减小光致抗蚀剂层中的开口的尺寸。然后将开口在绝缘层中从第一深度延伸到第二深度。开口从绝缘层的顶表面到比第一深度从第一深度到第二深度的第一深度更宽。然后用导电材料填充开口以形成T形栅结构。

5. 发明授权

US06403456B1 T or T/Y gate formation using trim etch processing 有权
标题翻译： T或T / Y栅极形成
公开(公告)号：US06403456B1
公开(公告)日：2002-06-11
申请号：US09643611
申请日：2000-08-22
申请人： Marina Plat , Christopher F. Lyons , Bhanwar Singh , Ramkumar Subramanian
发明人： Marina Plat , Christopher F. Lyons , Bhanwar Singh , Ramkumar Subramanian
IPC分类号： H01L2128
CPC分类号： H01L29/42376 , H01L21/28114 , H01L21/28123 , H01L21/76802
摘要： A method for fabricating a T-gate structure is provided. The method comprises the steps of providing a silicon layer having a gate oxide layer, a protection layer over the gate oxide layer, a first sacrificial layer over the protection layer and a second sacrificial layer over the first sacrificial layer. A photoresist layer is formed over the second sacrificial layer. An opening is formed in the photoresist layer. An opening is then formed in the second sacrificial layer beneath the opening in the photoresist layer. The opening is then expanded in the photoresist layer to expose portions of the top surface of the second sacrificial layer around the opening in the second sacrificial layer. The opening is extended in the second sacrificial layer through the first sacrificial layer and the opening is expanded in the second sacrificial layer to form a T-shaped opening in the first and second sacrificial layers. The photoresist layer is removed and the T-shaped opening is filled with a conductive material.
摘要翻译：提供了一种制造T型栅结构的方法。该方法包括以下步骤：提供具有栅极氧化物层的硅层，栅极氧化物层上的保护层，保护层上的第一牺牲层和第一牺牲层上的第二牺牲层。在第二牺牲层上形成光致抗蚀剂层。在光致抗蚀剂层中形成开口。然后在光致抗蚀剂层中的开口下方的第二牺牲层中形成开口。然后在光致抗蚀剂层中扩展开口，以暴露第二牺牲层的顶表面的部分围绕第二牺牲层中的开口。所述开口在所述第二牺牲层中延伸穿过所述第一牺牲层，并且所述开口在所述第二牺牲层中膨胀以在所述第一和第二牺牲层中形成T形开口。去除光致抗蚀剂层，并用导电材料填充T形开口。

6. 发明授权

US06313019B1 Y-gate formation using damascene processing 有权
标题翻译：使用大马士革加工的Y型门形成
公开(公告)号：US06313019B1
公开(公告)日：2001-11-06
申请号：US09643343
申请日：2000-08-22
申请人： Ramkumar Subramanian , Christopher F. Lyons , Bhanwar Singh , Marina Plat
发明人： Ramkumar Subramanian , Christopher F. Lyons , Bhanwar Singh , Marina Plat
IPC分类号： H01L2144
CPC分类号： H01L21/28114 , H01L29/42376 , Y10S438/978
摘要： A method for fabricating a Y-gate structure is provided. The method comprises the steps of providing a silicon layer having a gate oxide layer, a protection layer over the gate oxide layer, a first sacrificial layer over the protection layer and a second sacrificial layer over the first sacrificial layer. An inwardly sloping opening is formed in the second sacrificial layer and the opening is extended vertically in the first sacrificial layer. A contact material is deposited over the second sacrificial layer filling the opening with the contact material and forming a contact layer and portions of the contact material outside a gate region are removed. The first sacrificial layer and the second sacrificial layer are then removed.
摘要翻译：提供一种制造Y栅极结构的方法。该方法包括以下步骤：提供具有栅极氧化物层的硅层，栅极氧化物层上的保护层，保护层上的第一牺牲层和第一牺牲层上的第二牺牲层。在第二牺牲层中形成向内倾斜的开口，并且开口在第一牺牲层中垂直延伸。接触材料沉积在用接触材料填充开口的第二牺牲层上，并形成接触层，并且去除栅极区域外部的接触材料的部分。然后去除第一牺牲层和第二牺牲层。

7. 发明授权

US06869888B1 E-beam flood exposure of spin-on material to eliminate voids in vias 失效
标题翻译：旋转材料的电子束暴露以消除通孔中的空隙
公开(公告)号：US06869888B1
公开(公告)日：2005-03-22
申请号：US09901704
申请日：2001-07-11
申请人： Marina V. Plat , Ramkumar Subramanian , Christopher F. Lyons , Bhanwar Singh
发明人： Marina V. Plat , Ramkumar Subramanian , Christopher F. Lyons , Bhanwar Singh
IPC分类号： H01L21/027 , H01L21/3105 , H01L21/312 , H01L21/768
CPC分类号： H01L21/76808 , H01L21/02118 , H01L21/0212 , H01L21/02134 , H01L21/0276 , H01L21/31058 , H01L21/312 , H01L21/76825
摘要： A method for forming a semiconductor device is described. The method comprises forming a first layer over a semiconductor substrate. At least one hole is formed through the first layer. A bottom anti-reflective coating (BARC) layer is formed in the at least one hole. The BARC layer is exposed to an electron beam (e-beam) so that the BARC layer reaches a flow temperature in the at least one hole. An etch is performed to form a trench in the first layer and over the at least one hole, wherein the BARC layer in the at least one hole acts as an etch resistant layer during the etch.
摘要翻译：对半导体装置的形成方法进行说明。该方法包括在半导体衬底上形成第一层。通过第一层形成至少一个孔。在至少一个孔中形成底部抗反射涂层（BARC）层。 BARC层暴露于电子束（电子束），使得BARC层在至少一个孔中达到流动温度。执行蚀刻以在第一层中和在至少一个孔上形成沟槽，其中至少一个孔中的BARC层在蚀刻期间用作耐蚀刻层。

8. 发明授权

US06808591B1 Model based metal overetch control 有权
标题翻译：基于型号的金属防腐控制
公开(公告)号：US06808591B1
公开(公告)日：2004-10-26
申请号：US10021531
申请日：2001-12-12
申请人： Khoi A. Phan , Bharath Rangarajan , Christopher F. Lyons , Steven C. Avanzino , Ramkumar Subramanian , Bhanwar Singh , Cyrus E. Tabery
发明人： Khoi A. Phan , Bharath Rangarajan , Christopher F. Lyons , Steven C. Avanzino , Ramkumar Subramanian , Bhanwar Singh , Cyrus E. Tabery
IPC分类号： H01L21302
CPC分类号： H01L21/67253 , H01L21/32136
摘要： A systems and methodologies are provided for metal overetch control. Metal overetch processes are controlled by utilizing overetch device models to determine overetch times or overetch endpoints. The systems and methodologies reduce the need for manual testing and manual overetch characterization. An overetch system includes a metal etcher, a target device and an overetch controller. The target device is located in or on the metal etcher. The overetch controller is coupled to the metal etcher. The overetch controller controls overetching of the target device by the metal etcher. The overetch controller includes an overetch time controller, a set of etch control models and a control system.
摘要翻译：提供了用于金属过程控制的系统和方法。通过利用过滤设备模型来确定金属过蚀刻过程以确定过蚀刻时间或过程延伸端点。系统和方法减少了手动测试和手动过程表征的需要。一种过蚀系统包括金属蚀刻机，目标装置和过程控制器。目标设备位于金属蚀刻机中或其上。该过程控制器耦合到金属蚀刻器。过程控制器通过金属蚀刻器控制目标器件的过蚀刻。该过程控制器包括一个过时延时间控制器，一组蚀刻控制模型和一个控制系统。

9. 发明授权

US06605855B1 CVD plasma process to fill contact hole in damascene process 有权
标题翻译： CVD等离子体工艺在镶嵌工艺中填充接触孔
公开(公告)号：US06605855B1
公开(公告)日：2003-08-12
申请号：US09650538
申请日：2000-08-30
申请人： Bhanwar Singh , Michael K. Templeton , Bharath Rangarajan , Christopher F. Lyons , Sanjay K. Yedur , Ramkumar Subramanian
发明人： Bhanwar Singh , Michael K. Templeton , Bharath Rangarajan , Christopher F. Lyons , Sanjay K. Yedur , Ramkumar Subramanian
IPC分类号： H01L2900
CPC分类号： H01L21/76808 , H01L21/31144 , H01L21/312 , H01L21/76831 , H01L2221/1063
摘要： The present invention relates to a method for fabricating interconnecting lines and vias in a layer of insulating material. A via is formed in the layer of insulating material. A protective material is formed so as to be conformal to at least edges and sidewalls of the via, the protective material facilitating shielding of at least the edges and sidewalls of the via from a trench etch step. The trench etch step is performed to form a trench opening in the insulating material. The via and trench are filled with a conductive metal.
摘要翻译：本发明涉及在绝缘材料层中制造互连线和通孔的方法。在绝缘材料层中形成通孔。形成保护材料以至少与通孔的边缘和侧壁共形，所述保护材料有助于屏蔽通孔的至少边缘和侧壁至沟槽蚀刻步骤。执行沟槽蚀刻步骤以在绝缘材料中形成沟槽开口。通孔和沟槽填充有导电金属。

10. 发明授权

US06326231B1 Use of silicon oxynitride ARC for metal layers 有权
标题翻译：氧氮化硅ARC用于金属层
公开(公告)号：US06326231B1
公开(公告)日：2001-12-04
申请号：US09207562
申请日：1998-12-08
申请人： Ramkumar Subramanian , Bhanwar Singh , Sanjay K. Yedur , Marina V. Plat , Christopher F. Lyons , Bharath Rangarajan , Michael K. Templeton
发明人： Ramkumar Subramanian , Bhanwar Singh , Sanjay K. Yedur , Marina V. Plat , Christopher F. Lyons , Bharath Rangarajan , Michael K. Templeton
IPC分类号： H01L2100
CPC分类号： H01L21/32139 , H01L21/0276 , H01L21/3143 , H01L21/3145
摘要： In one embodiment, the present invention relates to a method of forming a silicon oxynitride antireflection coating over a metal layer, involving the steps of providing a semiconductor substrate comprising the metal layer over at least part of the semiconductor substrate; depositing a silicon oxynitride layer over the metal layer having a thickness from about 100 Å to about 150 Å; and forming an oxide layer having a thickness from about 5 Å to about 50 Å over the silicon oxynitride layer to provide the silicon oxynitride antireflection coating. In another embodiment, the present invention relates to a method of reducing an apparent reflectivity of a metal layer having a first reflectivity in a semiconductor structure, involing forming a silicon oxynitride antireflection coating over the metal layer; wherein the silicon oxynitride antireflection coating formed over the metal layer has a second reflectivity and is formed by depositing silicon oxynitride on the metal layer by chemical vapor deposition and forming an oxide layer over the oxynitride, and the difference between the first reflectivity and the second reflectivity is at least about 60%.
摘要翻译：在一个实施方案中，本发明涉及在金属层上形成氮氧化硅抗反射涂层的方法，包括以下步骤：在半导体衬底的至少一部分上提供包括金属层的半导体衬底; 在所述金属层上沉积厚度为约至约的氧氮化硅层; 并在氮氧化硅层上形成厚度约为5-20埃的氧化物层，以提供氮氧化硅抗反射涂层。在另一个实施方案中，本发明涉及一种在半导体结构中减少具有第一反射率的金属层的表观反射率的方法，包括在金属层上形成氮氧化硅抗反射涂层; 其中形成在所述金属层上的所述氧氮化硅抗反射涂层具有第二反射率，并且通过化学气相沉积在所述金属层上沉积氧氮化硅并在所述氧氮化物上形成氧化物层，并且所述第一反射率和所述第二反射率之间的差异至少约60％。

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