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1. 发明申请

US20150151380A1 METHOD AND APPARATUS FOR LASER PROCESSING OF SILICON BY FILAMENTATION OF BURST ULTRAFAST LASER PULSES 审中-公开
标题翻译：用于激光烧结超声波激光脉冲激光加工硅的方法和装置
公开(公告)号：US20150151380A1
公开(公告)日：2015-06-04
申请号：US14556078
申请日：2014-11-28
申请人： ROFIN-SINAR TECHNOLOGIES INC.
发明人： S. ABBAS HOSSEINI
IPC分类号： B23K26/00 , B23K26/40 , B23K26/36 , B23K26/06 , B23K26/08
CPC分类号： B23K26/009 , B23K26/0617 , B23K26/0648 , B23K26/08 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2103/50 , Y10T225/12 , Y10T428/12389 , Y10T428/24612
摘要： A method for laser processing of Silicon includes placing a Kerr material into engagement with the Silicon forming an interface therebetween. A laser beam is applied having at least one subpulse in a burst envelope operating at a first wavelength. The laser beam passes through a distributive lens focusing assembly and to the Kerr material. The first wavelength is modified to a plurality of second wavelengths, some of which are effective for processing Silicon. Photoacoustic compression processing is produced by the laser pulse energy by a portion of second wavelengths delivered through the interface and to the Silcon which initiates Kerr Effect self focusing which is propagated in the Silicon by additional energy input to the Silicon thus producing a filament within the Silicon.
摘要翻译：一种用于硅的激光加工的方法包括将克尔材料放置成与硅形成与其之间的界面的接合。施加激光束，其具有以第一波长工作的突发包络中的至少一个子脉冲。激光束通过分配透镜聚焦组件和克尔材料。第一波长被修改为多个第二波长，其中一些波长对于处理硅是有效的。光声压缩处理是通过激光脉冲能量通过界面传送的第二波长的一部分和Silcon产生的，该Silcon通过额外的能量输入到硅中而在硅中传播克尔效应自聚焦，从而在硅内产生细丝。

2. 发明申请

US20150140241A1 METHOD AND APPARATUS FOR SPIRAL CUTTING A GLASS TUBE USING FILAMENTATION BY BURST ULTRAFAST LASER PULSES 有权
标题翻译：螺旋切割玻璃管的方法和装置使用BURST超声波激光脉冲进行FILAMENTATION
公开(公告)号：US20150140241A1
公开(公告)日：2015-05-21
申请号：US14547729
申请日：2014-11-19
申请人： ROFIN-SINAR TECHNOLOGIES INC.
发明人： S. ABBAS HOSSEINI
IPC分类号： C03B33/095
CPC分类号： B23K26/53 , B23K26/0617 , B23K26/0622 , B23K26/0665 , B23K26/382 , B23K26/402 , B23K2103/50 , B23K2103/52 , C03B33/0222 , C03B33/06 , Y10T428/131 , Y10T428/15 , Y10T428/21 , Y10T428/218
摘要： A method of producing a spiral cut transparent tube using laser machining includes using an ultrafast laser beam comprising a burst of laser pulses and focusing the laser beam on the transparent tube to enable relative movement between the laser beam and the transparent tube by moving the laser beam, the glass tube or both the laser beam and the glass tube. A beam waist is formed external to the surface of the transparent tube wherein the laser pulses and sufficient energy density is maintained within the transparent tube to form a continuous laser filament therethrough without causing optical breakdown. The method and delivery system makes a spiral cut in the transparent tube.
摘要翻译：使用激光加工制造螺旋切割透明管的方法包括使用包括脉冲串激光脉冲的超快激光束并将激光束聚焦在透明管上，以通过移动激光束来实现激光束和透明管之间的相对移动，玻璃管或激光束和玻璃管两者。在透明管的表面外部形成有一个束腰，其中激光脉冲和足够的能量密度保持在透明管内，以形成连续的激光灯丝而不引起光学击穿。该方法和输送系统在透明管中进行螺旋切割。

3. 发明申请

US20150121960A1 METHOD AND APPARATUS FOR MACHINING DIAMONDS AND GEMSTONES USING FILAMENTATION BY BURST ULTRAFAST LASER PULSES 审中-公开
标题翻译：使用BURST超声波激光脉冲激光加工钻石和GEMSTONES的方法和装置
公开(公告)号：US20150121960A1
公开(公告)日：2015-05-07
申请号：US14521114
申请日：2014-10-22
申请人： ROFIN-SINAR TECHNOLOGIES INC.
发明人： S. ABBAS HOSSEINI
IPC分类号： B23K26/40 , A44C17/00 , B23K26/03 , B23K26/06 , B23K26/38
CPC分类号： A44C17/00 , A44C17/001 , B23K26/032 , B23K26/0624 , B23K26/382 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D5/00
摘要： A non-ablative laser machining method and apparatus for cutting facets of a diamond, using a material machining technique involving filamentation by burst ultrafast laser pulses well suited to mass production. Coupled with 3D modeling and the computerized laser machining system, complex geometric surfaces can be created on the diamond. The facets of the diamond need not be planar in configuration, and may incorporate acute as well as oblique angles. This method minimizes the need for diamond polishing, speeds up production, and realizes great reductions in the quantity of lost material from the cutting process.
摘要翻译：一种用于切割金刚石面的非烧蚀激光加工方法和装置，其使用涉及通过非常适合批量生产的脉冲超快激光脉冲进行光纤化的材料加工技术。结合3D建模和电脑激光加工系统，可以在钻石上创建复杂的几何表面。钻石的小平面在构造上不需要是平面的，并且可以并入锐角以及斜角。这种方法最大限度地减少了对金刚石抛光的需求，加快了生产速度，并且实现了切割过程中损失的材料量的大量减少。

4. 发明申请

US20180360175A1 METHOD AND APPARATUS FOR MACHINING DIAMONDS AND GEMSTONES USING FILAMENTATION BY BURST ULTRAFAST LASER PULSES 审中-公开
公开(公告)号：US20180360175A1
公开(公告)日：2018-12-20
申请号：US16048119
申请日：2018-07-27
申请人： ROFIN SINAR TECHNOLOGIES INC.
发明人： S. ABBAS HOSSEINI
IPC分类号： A44C17/00 , B28D5/00 , B23K26/40 , B23K26/03 , B23K26/0622 , B23K26/53 , B23K26/382 , B23K103/00
摘要： A non-ablative laser machining method and apparatus for cutting facets of a diamond, using a material machining technique involving filamentation by burst ultrafast laser pulses well suited to mass production. Coupled with 3D modeling and the computerized laser machining system, complex geometric surfaces can be created on the diamond. The facets of the diamond need not be planar in configuration, and may incorporate acute as well as oblique angles. This method minimizes the need for diamond polishing, speeds up production, and realizes great reductions in the quantity of lost material from the cutting process.

5. 发明申请

US20150246415A1 METHOD AND APPARATUS FOR MATERIAL PROCESSING USING MULTIPLE FILAMENTATION OF BURST ULTRAFAST LASER PULSES 有权
标题翻译：使用多孔激光脉冲超声波激光脉冲进行材料加工的方法和装置
公开(公告)号：US20150246415A1
公开(公告)日：2015-09-03
申请号：US14629327
申请日：2015-02-23
申请人： ROFIN-SINAR TECHNOLOGIES INC.
发明人： S. ABBAS HOSSEINI
IPC分类号： B23K26/38 , B23K26/40 , C03C23/00
CPC分类号： C03C23/0025 , B23K26/0006 , B23K26/53 , B23K2103/50 , B23K2103/52 , B23K2103/54 , C03C23/001 , Y10T428/24355
摘要： A method of drilling multiple orifices in and texturing a substrate is disclosed and includes the following steps. Ultrafast laser pulses are passed through a beam splitting diffractive optical element and then multiple beams are passed through a distributive-focus lens focusing assembly. The relative distance and/or angle of said distributive-focus lens focusing assembly in relation to the laser source is adjusted focusing the pulses in a distributed focus configuration creating a principal focal waist and at least one secondary focal waist. The fluence level of the at least one secondary focal waists is adjusted such that it is or they are of sufficient intensity and number to ensure propagation of multiple filaments in the substrate. Photoacoustic compressive machining is performed and forms multiple volume(s) within the substrate.
摘要翻译：公开了一种在衬底上钻孔和纹理化多个孔的方法，包括以下步骤。超快激光脉冲通过分束衍射光学元件，然后多个光束通过分布聚焦透镜聚焦组件。调整所述分配聚焦透镜聚焦组件相对于激光源的相对距离和/或角度，将脉冲聚焦在分布的焦点配置中，从而产生主要的焦点腰部和至少一个次要的焦点腰部。调节至少一个次要焦平面的注量水平，使得它们或者它们具有足够的强度和数量，以确保多个细丝在基底中的传播。执行光声压缩加工，并在基片内形成多个体积。

6. 发明申请

US20150140229A1 METHOD AND APPARATUS FOR FORWARD DEPOSITION OF MATERIAL ONTO A SUBSTRATE USING BURST ULTRAFAST LASER PULSE ENERGY 审中-公开
标题翻译：使用爆炸超声波激光能量将材料前体沉积到基材上的方法和装置
公开(公告)号：US20150140229A1
公开(公告)日：2015-05-21
申请号：US14542647
申请日：2014-11-16
申请人： ROFIN-SINAR TECHNOLOGIES INC.
发明人： S. ABBAS HOSSEINI
IPC分类号： B32B38/00
CPC分类号： B32B38/0008 , B32B2255/00 , C23C14/28
摘要： A process of forward deposition of a material onto a target substrate is accomplished by passing a burst of ultrafast laser pulses of a laser beam through a carrier substrate that is transparent to a laser beam. The carrier substrate is coated with a material to be transferred on the bottom side thereof. Electrons on the back side of said transparent carrier coated with the material are excited by the first few sub-pulses of the laser beam which lifts the material from the carrier substrate and subsequent sub-pulse of the laser beam send the material into space at hypersonic speed by a shock wave that drives the material with forward momentum across a narrow gap between the carrier substrate and the target substrate, and onto the target substrate.
摘要翻译：通过使激光束的超快激光脉冲的突发通过对激光束透明的载体衬底来实现将材料向靶沉积到目标衬底上的过程。载体基材在其底侧涂覆有待转印的材料。涂覆有材料的所述透明载体的背侧的电子被激光束的前几个子脉冲激发，激光束从载体衬底提起材料，随后的激光束的子脉冲将材料发送到超音速的空间通过在载体基板和目标基板之间的窄间隙上驱动具有向前动量的材料的冲击波的速度，并且到目标基板上。

7. 发明申请

US20150118522A1 METHOD OF FABRICATING A GLASS MAGNETIC HARD DRIVE DISK PLATTER USING FILAMENTATION BY BURST ULTRAFAST LASER PULSES 有权
标题翻译：使用BURST超声波激光脉冲激光玻璃制造磁性硬盘驱动器的方法
公开(公告)号：US20150118522A1
公开(公告)日：2015-04-30
申请号：US14512180
申请日：2014-10-10
申请人： ROFIN-SINAR TECHNOLOGIES INC.
发明人： S. ABBAS HOSSEINI
IPC分类号： G11B5/82 , C03B33/09
CPC分类号： C03B33/091 , B23K26/0617 , B23K26/0622 , B23K2103/54 , C03B33/0222 , C03B33/04 , G11B5/8404 , Y02P40/57
摘要： A non-ablative method and apparatus for making an economical glass hard disk (platter) for a computer hard disk drive (HDD) using a material machining technique involving filamentation by burst ultrafast laser pulses. Two related methods disclosed, differing only in whether the glass substrate the HDD platter is to be cut from has been coated with all the necessary material layers to function as a magnetic media in a computer's hard drive. Platter blanks are precisely cut using filamentation by burst ultrafast laser pulses such that the blank's edges need not be ground, the platter's geometric circularity need not be corrected and there is no need for further surface polishing. Thus the platters can be cut from raw glass or coated glass. As a result, this method reduces the product contamination, speeds up production, and realizes great reductions in the quantity of waste materials and lower production costs.
摘要翻译：一种不烧蚀的方法和装置，用于使用涉及通过脉冲超快激光脉冲进行光纤化的材料加工技术来制造用于计算机硬盘驱动器（HDD）的经济型玻璃硬盘（盘片）。公开了两种相关方法，其区别在于玻璃基板的HDD盘片是否被切割已经涂覆了所有必需的材料层，以在计算机的硬盘驱动器中用作磁性介质。通过脉冲超快激光脉冲使用细丝精细切割拼板毛坯，使得坯件的边缘不需要被研磨，盘片的几何圆形度不需要被校正，并且不需要进一步的表面抛光。因此，可以从原料玻璃或涂层玻璃切割盘子。因此，这种方法可以减少产品污染，加快生产，实现废料数量的大幅减少，降低生产成本。

8. 发明申请

US20160199944A1 METHOD AND SYSTEM FOR SCRIBING BRITTLE MATERIAL FOLLOWED BY CHEMICAL ETCHING 审中-公开
标题翻译：通过化学蚀刻来筛选脆性材料的方法和系统
公开(公告)号：US20160199944A1
公开(公告)日：2016-07-14
申请号：US14985365
申请日：2015-12-30
申请人： ROFIN-SINAR TECHNOLOGIES INC.
发明人： S. ABBAS HOSSEINI
IPC分类号： B23K26/402 , B23K26/362 , B23K26/0622 , G03F7/36
CPC分类号： B23K26/402 , B23K26/0622 , B23K26/0624 , B23K26/361 , B23K26/362 , B23K26/364 , B23K2103/50
摘要： Very fine closed form structures can be scribed via filamentation in the transparent substrate very quickly, the modified zone can be etched via dry or wet chemical etching to release the closed form. A metal layer engages the transparent substrate and is covered with photoresist. A portion of the photoresist and a portion of the metal are removed simultaneously with the creation of a filament through the transparent substrate. The photoresist protects the portion of the metal layer that is not removed. The desired closed form can be released by weakening the cut region using dry or wet chemical etching to remove the desired part.
摘要翻译：非常精细的封闭形式的结构可以非常快速地在透明基底中通过丝网划线，可以通过干法或湿法化学蚀刻来蚀刻改质区以释放封闭形式。金属层与透明基板接合并被光致抗蚀剂覆盖。在通过透明基板产生细丝的同时去除光致抗蚀剂和金属的一部分的一部分。光致抗蚀剂保护未被去除的金属层的部分。通过使用干或湿化学蚀刻削弱切割区域以除去所需的部分，可以释放所需的封闭形式。

9. 发明申请

US20150140735A1 ELECTRO/MECHANICAL MICROCHIPS AND METHOD OF MAKING WITH BURST ULTRAFAST LASER PULSES 有权
标题翻译：电子/机械微波炉及其制造方法与BURST超声波激光脉冲
公开(公告)号：US20150140735A1
公开(公告)日：2015-05-21
申请号：US14539861
申请日：2014-11-12
申请人： ROFIN-SINAR TECHNOLOGIES INC.
发明人： S. ABBAS HOSSEINI
IPC分类号： B81C1/00
CPC分类号： B81C1/00238 , B23K26/0604 , B23K26/0624 , B23K26/0626 , B23K26/0648 , B23K26/356 , B23K26/382 , B23K26/40 , B23K2103/50 , B81C1/00634 , B81C2201/019 , B81C2203/036 , B81C2203/038 , C03B33/0222 , C03B33/04 , H01L25/043 , H01L25/0657 , H01L25/0756 , H01L25/117 , H01L2924/0002 , H01L2924/00
摘要： A method for making an electromechanical chip using a plurality of transparent substrates, comprising the steps of: machining, using photoacoustic compression, full or partial voids in at least one of the plurality of substrates. The plurality of transparent substrates are stacked and arranged in a specific order. The transparent substrates are affixed and sealed together. The chip may be sealed by laser welding or adhesive.
摘要翻译：一种制造使用多个透明基板的机电芯片的方法，包括以下步骤：使用光声压缩来加工所述多个基板中的至少一个中的全部或部分空隙。多个透明基板以特定的顺序堆叠和布置。将透明基板固定并密封在一起。芯片可以通过激光焊接或粘合剂密封。

10. 发明申请

US20150122656A1 MASS BASED FILTRATION DEVICES AND METHOD OF FABRICATION USING BURSTS OF ULTRAFAST LASER PULSES 审中-公开
标题翻译：基于质量的过滤装置和使用超激光激光脉冲的制造方法
公开(公告)号：US20150122656A1
公开(公告)日：2015-05-07
申请号：US14531761
申请日：2014-11-03
申请人： ROFIN-SINAR TECHNOLOGIES INC.
发明人： S. ABBAS HOSSEINI
IPC分类号： G01N27/447
CPC分类号： G01N27/44756
摘要： A mass separation device includes a transparent substrate and a plurality of small diameter cylindrically shaped orifices in the transparent substrate. The small diameter cylindrically shaped orifices include smooth wall surfaces and are not tapered. The small diameter cylindrically shaped orifices are drilled by photoacoustic compression and are clean and sharp and do not have ejecta mounds surrounding the orifice on the surface of the transparent substrate. The small diameter cylindrically shaped orifices in said transparent substrate are less than or equal to 1 μm in diameter. The transparent substrate is glass and preferably is borosilicate glass.
摘要翻译：质量分离装置包括透明基板和透明基板中的多个小直径圆柱形孔。小直径的圆柱形孔口包括光滑的壁表面，并且不是锥形的。小直径的圆柱形孔通过光声压缩钻孔，并且清洁和锋利，并且在透明基底的表面上没有围绕孔的喷出土堆。所述透明基材中的小直径圆柱形孔直径小于或等于1μm。透明基板是玻璃，优选是硼硅酸盐玻璃。

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