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1. 发明申请

US20070236310A1 Electronic device on substrate with cavity and mitigated parasitic leakage path 失效
标题翻译：衬底上的电子器件具有空腔和减轻的寄生泄漏路径
公开(公告)号：US20070236310A1
公开(公告)日：2007-10-11
申请号：US11373434
申请日：2006-03-10
申请人： R. Fazzio , Richard Ruby , Christopher Wade , Michael Frank , David Feld
发明人： R. Fazzio , Richard Ruby , Christopher Wade , Michael Frank , David Feld
IPC分类号： H03H9/54
CPC分类号： H03H9/02118 , H03H3/02 , H03H9/02125 , H03H9/172
摘要： An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.
摘要翻译：电子设备。电子器件包括第一电极和涂层。电子器件制造在衬底上; 衬底具有在衬底的顶表面中产生的空腔; 并且第一电极电耦合到衬底。涂层涂覆在空腔中的基底表面的至少一部分，并且涂层的存在导致在第一电极和在基底上制造的附加电极之间的至少一个寄生泄漏路径的减轻。

2. 发明申请

US20060103492A1 Thin film bulk acoustic resonator with a mass loaded perimeter 有权
标题翻译：具有质量负载周长的薄膜体声波谐振器
公开(公告)号：US20060103492A1
公开(公告)日：2006-05-18
申请号：US10990201
申请日：2004-11-15
申请人： Hongjun Feng , R. Fazzio , Richard Ruby , Paul Bradley
发明人： Hongjun Feng , R. Fazzio , Richard Ruby , Paul Bradley
IPC分类号： H03H9/54
CPC分类号： H03H9/02118 , H03H9/173 , H03H9/177
摘要： A resonator structure (FBAR) made of electrodes sandwich a piezoelectric material. The intersection of the two conducting electrodes defines the active area of the acoustic resonator. The active area is divided into two concentric areas; a perimeter or frame, and a central region. An annulus is added to one of the two conducting electrodes to improve the electrical performance (in terms of Q).
摘要翻译：由电极制成的谐振器结构（FBAR）夹着压电材料。两个导电电极的交点定义了声谐振器的有效面积。活动区域分为两个同心区域; 周边或框架，以及中央区域。在两个导电电极中的一个上添加环，以改善电性能（以Q为单位）。

3. 发明申请

US20050212117A1 Microcap wafer bonding method and apparatus 失效
标题翻译：微型晶片接合方法和装置
公开(公告)号：US20050212117A1
公开(公告)日：2005-09-29
申请号：US10807417
申请日：2004-03-23
申请人： R. Fazzio
发明人： R. Fazzio
IPC分类号： H01L23/10 , H01L23/12
CPC分类号： H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. Next, the device chip and the cap are bonded such that a sealed cavity is formed by the device chip and the cap. The bond is accomplished using thermo compression technique. Gold or other suitable metal can be used as a bonding agent. Then or at the same time, caulking agent is reflowed over the bonding agent, over portions of the cap, or both to further seal the cavity. In the resultant device, the sealed cavity is sealed by the bonding agent, the caulking agent, or both. The caulking agent increases hermeticity of the cavity and provides for even higher level of protection of the cavity against adverse environmental conditions.
摘要翻译：公开了一种制造包括密封腔的装置的方法和体现该方法的装置。为了制造该装置，制造了包括衬底和衬底上的至少一个电路元件的器件芯片。此外，还制造了一个帽子。接下来，装置芯片和盖被接合，使得由装置芯片和盖形成密封空腔。使用热压技术实现粘结。可以使用金或其它合适的金属作为粘合剂。然后，或者同时，将填缝剂再次通过粘合剂回流，在盖的部分上或两者上进一步密封空腔。在所得到的装置中，密封腔被粘合剂，填缝剂或两者密封。填缝剂增加了空腔的气密性，并提供了更高水平的腔体对不利环境条件的保护。

4. 发明申请

US20070151856A1 Fluidic device having contiguous conductive layer over interior and exterior surfaces thereof 审中-公开
标题翻译：流体装置在其内表面和外表面上具有相邻的导电层
公开(公告)号：US20070151856A1
公开(公告)日：2007-07-05
申请号：US11321302
申请日：2005-12-29
申请人： R. Fazzio , Kevin Killeen , Atul Goel , Reid Brennen , Hongfeng Yin
发明人： R. Fazzio , Kevin Killeen , Atul Goel , Reid Brennen , Hongfeng Yin
IPC分类号： G01N27/00
CPC分类号： G01N27/44791 , B01L3/5027 , B01L9/527 , B01L2200/027 , B01L2300/069 , B01L2300/0887 , B01L2400/0421
摘要： A fluidic device is provided that includes a body and a contiguous electrically conductive layer. The body has interior and exterior surfaces. The interior surface defines at least a well and a fluid-transporting feature, e.g., a microfeature in fluid-communication with the well. The well has a sidewall and an exterior opening terminating at the exterior surface. The contiguous electrically conductive layer is located on at least the sidewall of the well and selected regions of the interior and exterior surfaces so as to form a contact pad region on the exterior surface in electrical communication with any fluid within the fluid-transporting feature. Also provided is a method for forming a fluidic device.
摘要翻译：提供了一种流体装置，其包括主体和相邻的导电层。身体内部和外部表面。内表面至少限定了井和流体输送特征，例如与井流体连通的微特征。该井具有侧壁和外部开口，终止于外表面。连续的导电层位于孔的至少侧壁和内表面和外表面的选定区域之间，以在外表面上形成与流体输送特征内的任何流体电连通的接触垫区域。还提供了一种用于形成流体装置的方法。

5. 发明申请

US20060202779A1 Monolithic vertical integration of an acoustic resonator and electronic circuitry 失效
标题翻译：声谐振器和电子电路的单片垂直集成
公开(公告)号：US20060202779A1
公开(公告)日：2006-09-14
申请号：US11079776
申请日：2005-03-14
申请人： R. Fazzio , Thomas Dungan
发明人： R. Fazzio , Thomas Dungan
IPC分类号： H03H9/54
CPC分类号： B81C1/00246 , B81B2201/0271 , B81C2203/0735 , H03H9/0557 , Y10T29/42
摘要： Monolithic devices that include an acoustic resonator vertically integrated with electronic circuitry are described. In one aspect, a monolithic integrated device includes a substrate, electronic circuitry supported by the substrate, an acoustic isolator over the electronic circuitry, and an acoustic resonator on the acoustic isolator. A method of fabricating the monolithic device also is described.
摘要翻译：描述了包括与电子电路垂直集成的声谐振器的单片器件。一方面，单片集成器件包括衬底，由衬底支撑的电子电路，电子电路上的声学隔离器以及声学隔离器上的声学谐振器。还描述了制造单片装置的方法。

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